Abstract: A technique for handling an integrated circuit/tape assembly having a plurality of integrated circuits supported by underlying dicing tape involves placing the integrated circuit/tape assembly on a bottom file frame carrier (FFC) frame having structure (e.g., an inner rim or flexible pegs), placing a top FFC frame having a central opening over the integrated circuit/tape assembly, and mating the top and bottom FFC frames such that the dicing tape is pulled over the structure thereby laterally stretching the dicing tape, which breaks wafer saw bows holding the integrated circuits together. The lateral stretching of the dicing tape increases distance between adjacent integrated circuits in at least two mutually orthogonal lateral directions, thereby inhibiting the adjacent integrated circuits from colliding during shipment or storage for subsequent processing. The resulting assembly can be thinner than conventional FFC configurations, which results in more efficient shipment and storage.

Abstract: An apparatus for applying individual tapes in layers onto a substrate includes a plurality of reels, applicators, and a guide member. A first reel holds a first tape and a second reel holds a second tape. A first applicator includes a first pressure surface that receives the first tape from the first reel and presses the first tape in a direction toward the substrate to apply the first tape to the substrate. The second applicator includes a second pressure surface that receives the second tape from the second reel. The second pressure surface is aligned to dispense the second tape over a section of the first tape applied to the substrate and to press the second tape toward the substrate to apply the second tape over the first tape. The guide member is disposed between the reels and the applicators and aligns the first and second tapes during application.

Abstract: A processing apparatus includes a wafer carrying-out unit, a wafer table that supports a wafer carried out, a frame carrying-out unit, a frame table that supports an annular frame carried out, a tape sticking unit that sticks a tape to the frame, a tape-attached frame conveying unit, a tape pressure bonding unit that executes pressure bonding of the tape of a tape-attached frame to a back surface of the wafer, a frame unit carrying-out unit, and a beveled part removing unit that cuts and removes, in a ring manner, a beveled part formed in an outer circumferential surplus region from the wafer of a frame unit.

Abstract: Methods of making labels devoid of liner plies. A method of making a label for securement to a substrate comprises providing a face ply having a top side and a bottom side. The method includes disposing a hotmelt adhesive on the bottom side in a pattern. The method comprises formulating a liner coating configured to be activated by a fluid. The method includes disposing the liner coating on the bottom side outwardly adjacent the hotmelt adhesive. The bottom side is configured to be secured to a substrate via the hotmelt adhesive upon activation of the liner coating by the fluid.

Abstract: A sheet separation device is configured to separate a non-bonding portion of a two-ply sheet in which two sheets are overlapped and bonded together at one end as a bonding portion of the two-ply sheet. The sheet separation device includes a conveyance roller pair and circuitry. The conveyance roller pair is configured to convey the two-ply sheet while nipping the two-ply sheet, when separating the non-bonding portion of the two-ply sheet. The circuitry is configured to control sheet conveyance. The circuitry is configured to stop the conveyance roller pair, cause a leading end of the two-ply sheet conveyed toward the conveyance roller pair to contact a nip region of the conveyance roller pair while the conveyance roller pair is stopped, and start the conveyance roller pair to rotate to nip the two-ply sheet.

Abstract: A mobile dismantling system includes an automatic frame dismantling apparatus, a fragmenting apparatus, and a conveying apparatus, all of which are disposed on a mobile apparatus, such as a wheeled transport vehicle. The automatic frame dismantling apparatus includes a dismantling platform and frame dismantling members. The fragmenting apparatus includes a back plate fragmenting device and a cell encapsulation laminate fragmenting device, each of which has a fragmenting platform, a fragmenting unit, and a material collecting and sorting device. The conveying apparatus is disposed above the automatic frame dismantling apparatus and the fragmenting apparatus, and includes a robot for moving solar cell module.

Abstract: Implementations of a semiconductor device may include a semiconductor die comprising a first largest planar surface, a second largest planar surface and a thickness between the first largest planar surface and the second largest planar surface; and a temporary die support structure coupled to one of the first largest planar surface, the second largest planar surface, the thickness, or any combination thereof. The thickness may be between 0.1 microns and 125 microns. The warpage of the semiconductor die may be less than 200 microns.

Abstract: The invention relates to a method for peeling a pressure-sensitive adhesive tape including: a pressure-sensitive adhesive layer. The pressure-sensitive adhesive tape has a thickness greater than 150 ?m and smaller than 1,500 ?m, an elongation at break of 600% to 3,000%, and a stress at break of 2.5 to 80.0 MPa. According to the invention, the conformity and the adhesion with respect to an adherend, particularly, a hard adherend, are excellent, and excellent re-peeling properties are obtained, so that the pressure-sensitive adhesive tape can be stretched and peeled off in a horizontal direction, without necessity for embrittling the pressure-sensitive adhesive tape by heating or by using an organic solvent or the like or without remaining of the pressure-sensitive adhesive on the adherend, in a case of peeling the pressure-sensitive adhesive tape.

Abstract: A dummy removal device includes a picker picking a point of a dummy portion of a preliminary display module and moving in a first moving direction to separate a first portion of the dummy portion from the preliminary display module; and a separator disposed adjacent to the separated first portion and moving in a second moving direction intersecting the first moving direction to remove a second portion of the dummy portion from the preliminary display module, and the dummy portion is disposed around an effective portion of the preliminary display module.

Abstract: The present disclosure provides a laser lift-off method for separating substrate and semiconductor-epitaxial structure, which includes: providing at least one semiconductor device, wherein the semiconductor device includes a substrate and at least one semiconductor-epitaxial structure disposed in a stack-up manner; irradiating a laser onto an edge area of the semiconductor device to separate portions of the substrate and the semiconductor-epitaxial structure in the edge area; and pressing against the edge area of the semiconductor device vis a pressing device, then irradiating the laser onto an inner area of the semiconductor device to separate portions of the substrate and the semiconductor-epitaxial structure in the inner area wherein gas is generated during separating the portions of the substrate and the semiconductor-epitaxial structure in the inner area and evacuated from the edge area, to prevent damage of the semiconductor-epitaxial structure during the separating process.

Abstract: A process for winding a convolutely wound tubular structure having a machine direction, a cross-machine direction coplanar thereto, and a Z-direction orthogonal to both the machine- and cross-machine directions is disclosed.

Abstract: A processing apparatus includes a wafer conveying-out mechanism; a wafer table; a frame conveying-out mechanism; a frame table; a tape attaching mechanism that attaches a tape to a frame; a tape-attached frame conveying mechanism that conveys the tape-attached frame; a tape pressure bonding mechanism that pressure bonds the tape of the tape-attached frame to a back surface of a wafer; a frame unit conveying-out mechanism that conveys out a frame unit in which the tape of the tape-attached frame and the back surface of the wafer are pressure bonded; a reinforcement section removing mechanism that cuts and removes a ring-shaped reinforcement section from the wafer; a ringless unit conveying-out mechanism that conveys out a ringless unit from which the reinforcement section has been removed; and a frame cassette table on which a frame cassette accommodating the ringless unit is to be placed.

Abstract: When picking a die from an adhesive tape, a collet of a pick arm is positioned at a distance over the die, the die being mounted on a first surface of the adhesive tape. A flow of air is then generated onto a second surface of the adhesive surface opposite to the first surface for blowing the adhesive tape to displace the die towards a die-holding surface of the collet. Thereafter, the die is retained on the die-holding surface of the collet while the adhesive tape separates from the die.

Abstract: A film-removing apparatus configured to remove a protecting film from a workpiece includes a supporting module configured to support the workpiece, a clamping module configured to clamp the workpiece supported by the supporting module, and a peeling module. The peeling module includes a first peeling member and a second peeling member. The first peeling member includes a bearing surface. The peeling module moves towards the clamping module to bring the bearing surface to below the protecting film, the second peeling member moves towards the protecting film to cooperate with the first peeling member in clamping the protecting member. The peeling module is then moved away from the clamping module to peel off the protecting film.

Abstract: In order to achieve high product quality and process reliability in a process for manufacturing an endless profile strand of soft plastic and/or rubber material fed to a supply storage for a sealing profile, edge protection profile or the like on a motor vehicle, it is provided that the manufacturing process be divided into two process sections which are carried out on two manufacturing lines that can be operated independently of one another.

Abstract: A processing method for a wafer includes a thermocompression-bonding sheet arrangement step of arranging, on a front side of the wafer, a thermocompression-bonding sheet of a size sufficient to cover the wafer, an integration step of pressing the thermocompression-bonding sheet under heat by a planarizing member, so that the thermocompression-bonding sheet is planarized and the thermocompression-bonding sheet and the wafer are integrated together, a grinding step of holding the wafer on a side of the thermocompression-bonding sheet on a chuck table of a grinding apparatus and grinding the wafer to a desired thickness while supplying grinding water to a back side of the wafer, and a thermocompression-bonding sheet rinsing step of unloading the integrated wafer from the chuck table and rinsing the thermocompression-bonding sheet.

Abstract: The present disclosure relates to an element pickup device, a method for manufacturing the same and a method for using the same. The element pickup device includes: a first substrate and a second substrate oppositely disposed; a spacing part located between the first substrate and the second substrate, wherein the spacing part is spaced apart from each other to define a flow channel for liquid; and an element pickup part including an opening located in the second substrate and in communication with the flow channel.

Abstract: A mass transfer apparatus, a mass transfer system, and a control method for mass transfer are provided. The mass transfer apparatus includes a beam emission assembly, a rotating lens, and a rotating lens adjusting assembly. The rotating lens is configured to receive the beam emitted from the beam emission assembly. The rotating lens adjusting assembly is connected with the rotating lens. The rotating lens adjusting assembly is configured to control the rotating lens to perform peripheral rotation. The rotating lens adjusting assembly is also configured to adjust a rotation radius of the rotating lens.

Abstract: An object adhesion/peeling method according to an embodiment includes adhering a adhesion target object to a second surface side of an adhesive sheet, wherein the adhesive sheet includes adhesive surfaces on a first surface side and the second surface side, and a first electrode and a second electrode provided to be adjacent to the first electrode are provided on the first surface side; adhering the first surface side of the adhesive sheet to a fixation target surface; inputting a predetermined voltage to the first electrode and the second electrode to generate a potential difference based on the predetermined voltage in a direction orthogonal to a layer thickness direction of the adhesive sheet; and causing an electrochemical reaction on the first surface side of the adhesive sheet to peel off the adhesive sheet from the fixation target surface.

Abstract: A bonding apparatus includes a first holder, a first transforming device, a second holder, a second transforming device, a suction device and a control device. The first holder attracts and holds a first substrate from above. The first transforming device transforms the first substrate held by the first holder such that a central portion of the first substrate is protruded downwards. The second holder is provided under the first holder, and attracts and holds a second substrate, which is to be bonded to the first substrate, from below. The second transforming device transforms the second substrate held by the second holder such that a central portion of the second substrate is protruded upwards. The suction device generates different attracting forces in multiple division regions included in an attraction region of the second substrate. The control device controls the suction device.