Abstract: Herein are disclosed apparatus and methods for impinging fluids, e.g. heated fluids, onto the surface of substrates and then locally removing the impinged fluid. The apparatus may comprise at least first and second fluid delivery outlets that are in diverging relation to each other. The apparatus may comprise at least first and second fluid capture inlets that are locally positioned relative to the first and second fluid delivery outlets, respectively. The apparatus and method may be used e.g. to impinge fluids onto two converging substrates and may be used to heat the surfaces of the substrates so as to facilitate melt-bonding the substrates to each other.

Abstract: Systems, devices, and methods are disclosed for the cleaning of an endotracheal tube while a patient is being supported by a ventilator connected to the endotracheal tube for the purpose of increasing the available space for airflow or to prevent the build up of materials that may constrict airflow or be a potential nidus for infection. In one embodiment, a method for cleaning endotracheal tubes comprises inserting a cleaning device within an endotracheal tube while a cleaning member is in a compressed position, radially expanding the cleaning member to an expanded position within the endotracheal tube, and withdrawing the cleaning device from the endotracheal tube with the cleaning member in the expanded position.

Abstract: In one disclosed embodiment, the present method for semiconductor fabrication utilizing a cleaning substrate comprises loading a cleaning substrate capable of removing an undesirable particle from a semiconductor processing tool onto the tool, causing the undesirable particle to be attracted to the cleaning substrate, and unloading the cleaning substrate from the semiconductor processing tool. Following cleaning, the processing tool can be used for producing a lithographic pattern on a semiconductor wafer. In one embodiment, the cleaning substrate comprises an electret. In another embodiment, the cleaning substrate comprises an adhesive layer. The present method can be used without breaking vacuum, or otherwise altering the operational state of a processing tool. In one embodiment, the present method is used in conjunction with an exposure tool utilized for high resolution lithography, for example, an extreme ultraviolet (EUV) lithographic exposure tool.

Abstract: The invention relates to a method for pre-cleaning parts made of plastic as part of a recycling process, wherein foreign bodies to be removed adhere to the parts, in particular for removing foreign bodies on parts made of plastic, preferably for removing labels, dirt, etc. on used plastic bottles, said method being characterized in that the foreign bodies are removed from the parts by mechanically loading the parts. A device for applying the method is characterized by a housing (2) having a chamber for accommodating the parts, means (3, 4, 11) for mechanically acting upon the parts and means for separating the foreign bodies released from the parts and for discharging the foreign bodies and parts onto separate paths being provided in the chamber.

Abstract: The present invention relates to a method for cleaning wafers while preventing pattern collapse of the wafers in semiconductor device fabrication, the wafer having at its surface an uneven pattern and containing silicon element at least on surfaces of recessed portions. Provided is: a liquid chemical for forming a protective film which allows efficient cleaning; and a method for cleaning wafers, using the liquid chemical. A liquid chemical for forming a water repellent protective film is provided for forming a protective film on a wafer (having at its surface an uneven pattern and containing silicon element at least at a part of the uneven pattern), the protective film being formed at least on surfaces of recessed portions of the uneven pattern at the time of cleaning the wafer. The liquid chemical contains a dialkylsilyl compound represented by the formula [1] and does not contain an acid and a base.

Abstract: A cleaning package for wires, method and system comprising said cleaning package, the package comprising a fiber-glass core, a synthetic fiber coating layer surrounding the fiber-glass core and interlaced with said fiber-glass core, and a coating layer surrounding, at least in part, the synthetic fiber coating layer, wherein the coating layer is a thermoplastic layer. The cooled-off galvanized wire is passed in between the at least two cleaning packages at a speed of up to 250 meters per second, while lasting up to eight hours.

Abstract: The present disclosure includes an automatic portable misting apparatus for the dispersal of fluids. The misting apparatus is customizable to a specified use and is highly portable. The misting apparatus includes a pressurizable fluid tank, an automatic air compressor mounted to the fluid tank, a fluid conduit and a hose or wand coupled to a plurality of nozzles. Fluid may be distributed in the form of a corresponding number of fine spray streams, and a valve for controlling the flow of fluid from the fluid tank to the fluid conduit. The fluids dispersal apparatus is easy to operate, easy to maintain, unobtrusive and economical.

Abstract: A substrate cleaning apparatus performs scrub cleaning of a surface of a substrate such as a semiconductor wafer. The substrate cleaning apparatus includes a cleaning member having a lower-end contact surface, and a cleaning liquid supply nozzle configured to supply a cleaning liquid to the surface of the substrate. The cleaning member is configured to scrub-clean the surface of the substrate by moving the cleaning member in one direction while the cleaning member is being rotated about its rotational axis and by rubbing the lower-end contact surface of the cleaning member against the surface of the substrate which is being rotated horizontally in the presence of the cleaning liquid. The cleaning member has an inverted truncated-cone shape wherein the angle ? between the lower-end contact surface and a straight line on an outer circumferential surface of the cleaning member is larger than 90° and is not more than 150°.

Abstract: A device arranged to apply a linear tension to an intramedullary reamer for ultrasonic cleaning, and a corresponding method thereof.

Abstract: An artificial turf cleaning system and a method for cleaning artificial turf surfaces are disclosed. The artificial turf cleaning system includes (a) at least two wheels, (b) at least one liquid tank, (c) a tap for controlling the dripping rate and covering at least one liquid tank, (d) a cleaning drum having replaceable brushes, and wherein the cleaning drum is coupled mechanically to the wheels by cog-wheels transmission gear, (e) a removable rubbish storage tank, and (f) a handle, wherein the artificial turf cleaning system is designed for manually cleaning artificial turf surfaces.

Abstract: An engine wash system includes a manifold to secure to a nose cone of an engine; a feeder pipe connecting to the manifold to deliver wash liquid to the manifold; a plurality of nozzles connected to the manifold to direct the wash liquid into the engine; a hook connected to the manifold to connect to a slot on the nose cone; and a guide connected to the feeder to align the manifold relative to the engine.

Abstract: A substrate rotates, and a liquid nozzle of a gas/liquid supply nozzle moves to a position above the center of the rotating substrate. In this state, a rinse liquid is discharged from the liquid nozzle onto the rotating substrate. The gas/liquid supply nozzle moves toward a position outside the substrate. A gas nozzle reaches the position above the center of the rotating substrate, so that the gas/liquid supply nozzle temporarily stops. With the gas/liquid supply nozzle stopping, an inert gas is discharged onto the center of the rotating substrate for a given period of time. After that, the gas/liquid supply nozzle again moves toward the position outside the substrate.

Abstract: A method for cleaning a film separating device involves: a) performing positive-direction water cleaning when the ratio between the film filter resistance and the preliminary film filter resistance is less than 1.2; b) performing reverse water cleaning when the ratio between the film filter resistance and the preliminary film filter resistance is greater-than or equal-to 1.2; c) performing reverse chemical cleaning when the ratio between the film filter resistance and the preliminary film filter resistance is greater-than or equal-to 2; d) performing positive-direction chemical cleaning when the ratio between the film filter resistance and the preliminary film filter resistance is greater-than or equal-to 3.

Abstract: A system and method for cleaning and cooling solar panels are described. A solar tracker includes a main beam for supporting the solar panels, and nozzles coupled to the main beam. The main beam includes a water channel along its interior which supplies water to the nozzles. The nozzles are positioned to spray water on the collecting surfaces of the solar panels to clean and cool them. The solar tracker may also include gutters to reclaim used water. The solar tracker may include air ducts which direct air across the undersides of the solar panels to cool them.

Abstract: A cleaning apparatus includes a cleaning tank in which an object to be cleaned having oil is immersed, a cleaning water supply device that supplies cleaning water from a lower side of the cleaning tank to the inner portion thereof, a recovery device in which an upper end opening is provided at a position that is lower than a liquid surface of the cleaning water supplied to the cleaning tank, and that recovers the cleaning water overflowed due to the cleaning water supplied to the cleaning tank through the cleaning water supply device and the oil floating on the liquid surface of the cleaning water from the opening, and a contact member that is disposed so that an edge of the liquid surface of the cleaning water contacts therewith, and in which the portion contacting the edge of the liquid surface of the cleaning water is formed of glass.

Abstract: There is provided a substrate cleaning method which optimizes the shape of a roll cleaning member and can efficiently clean a substrate surface with a high degree of cleaning and reduce the number of defects remaining on the substrate surface. The substrate cleaning method performs scrub cleaning of a surface of a substrate with a roll cleaning member, having a large number of nodules on the surface and extending linearly over approximately an entire length of a diameter of the substrate and which forms a cleaning area between it and the substrate surface, by bringing the nodules into contact with the substrate surface while rotating the roll cleaning member and the substrate each in one direction. During this scrub cleaning, the area of contact between the nodules and the substrate surface in the cleaning area is made smaller in a forward-direction cleaning area.

Abstract: The present invention concerns a method for measuring the thickness of any deposit of material on the inner wall of a structure conducting a fluid stream of hydrocarbons, the method comprising the steps of: applying a first heat pulse or continuous heating to at least one first section of the structure removing deposits on the inner wall of the first section of the structure; applying a second heat pulse to both the first section of the structure and at least one second section of the structure, the first and second sections being spaced apart, which heat pulse does not loosen any deposit of material in the second section; measuring the temperature of the wall of the structure or the fluid during the second heat pulse at both the first and second sections; and determining the thickness of any deposit of material on the inner wall of the structure at the second section based on the measured temperatures. The present invention also relates to a corresponding device and arrangement.

Abstract: Disclosed are methods and apparatus for cleaning heat exchangers and similar vessels by introducing chemical cleaning solutions and/or solvents while maintaining a target temperature range by direct steam injection into the cleaning solution. The steam may be injected directly into the heat exchanger or into a temporary side stream loop for recirculating the cleaning solution or admixed with fluids being injected to the heat exchanger. The disclosed methods are suitable for removing metallic oxides from a heat exchanger under chemically reducing conditions or metallic species such as copper under chemically oxidizing conditions. In order to further enhance the heat transfer efficiency of heating cleaning solvents by direct steam injection, mixing on the secondary side of the heat exchanger can be enhanced by gas sparging or by transferring liquid between heat exchangers when more than one heat exchanger is being cleaned at the same time.

Abstract: An automatic wax removing device includes a base, a heating plate, a cooling plate, a first actuator, a second actuator, and an operation plate. The base includes a base plate and a framework. The heating plate is arranged on the base plate. The cooling plate is arranged on the base plate and separated from the heating plate. The first actuator includes a sliding rail and a elongated sliding member on the sliding rail. The sliding rail is fixed on the frame and parallel with the heating plate. The second actuator includes a main body and a rotation shaft arranged on the main body. The main body is slideable along the length of the sliding member. One end of the rotation shaft is connected to the main body. The operation plate is fixed to the other end of the rotation shaft.

Abstract: A cleaning apparatus for cleaning a semiconductor wafer includes a rotary brush to be positioned to clean the semiconductor wafer, and an optical sensing device associated with the rotary brush to sense a separation distance between a reference position thereon and the semiconductor wafer. An actuator is coupled to the optical sensing device to position the rotary brush based upon the sensed separation distance.