Patents Examined by Omar R Rojas
  • Patent number: 10298357
    Abstract: The present disclosure discloses a photonic chip. The photonic chip receives a first optical signal and a second optical signal with different wavelengths from two optical sources, respectively. The photonic chip includes a polarization multiplexing element (PME). The PME receives the first and the second optical signals from the first and the second optical sources respectively and combines the first and the second optical signals into a single optical path. The PME polarizes the first optical signal to have a different polarization than the second optical signal and transmits the combined first and the second optical signals in a common waveguide.
    Type: Grant
    Filed: June 29, 2017
    Date of Patent: May 21, 2019
    Assignee: Cisco Technology, Inc.
    Inventor: Sean P. Anderson
  • Patent number: 10295737
    Abstract: The present invention relates to the field of single-mode optical fibers and discloses a bending-insensitive, radiation-resistant single-mode optical fiber, sequentially including from inside to outside: a core, inner claddings, and an outer cladding, all made from a quartz material. The inner claddings comprise, from inside to outside, a first fluorine-doped inner cladding and a second fluorine-doped inner cladding. The core and the first fluorine-doped inner cladding are not doped with germanium. The respective concentrations of other metal impurities and phosphorus are less than 0.1 ppm. By mass percent, the core has a fluorine dopant content of 0-0.45% and a chlorine content of 0.01-0.10%; the first fluorine-doped inner cladding has a fluorine concentration of 1.00-1.55%; and the second fluorine-doped inner cladding has a fluorine concentration of 3.03-5.00%.
    Type: Grant
    Filed: October 21, 2016
    Date of Patent: May 21, 2019
    Assignee: FIBERHOME TELECOMMUNICATION TECHNOLOGIES CO., LTD
    Inventors: Qi Mo, Lijie Huang, Huang Yu, Cheng Liu, Wen Chen, Zhiqiang Yu, Dongxiang Wang, Bingfeng Cai, Liming Chen, Huiping Shi
  • Patent number: 10295775
    Abstract: A fiber optic pulling grip assembly includes a front grip unit to grip a front end of a mesh of a fiber optic cable, and a rear grip unit to grip a rear end of the mesh. The rear grip includes a sleeve member and a tubular fastener. The sleeve member has an anti-slip portion that has protrusions to increase friction between the anti-slip portion and a rear end of the mesh. The tubular fastener is sleeved around the sleeve member. A cable entry hole of the tubular fastener allows insertion of the fiber optic cable into the sleeve member. The anti-slip portion and the tubular fastener cooperate to clamp therebetween the rear end of the mesh.
    Type: Grant
    Filed: July 11, 2018
    Date of Patent: May 21, 2019
    Assignee: AMPHENOL FIBER OPTIC TECHNOLOGY (SHENZHEN) CO., LTD.
    Inventors: Linghua Zhu, Songsheng Li, Xingfu Mo, Jinan Zhou, Anh Nguyen
  • Patent number: 10288819
    Abstract: Connector assemblies having an adjustable polarity are described. A connector assembly comprises a frame comprising a single housing having top and bottom frame components, first and second plug frames located within the housing, a first ferrule located in the first plug frame, a second ferrule located in the second plug frame, and a latch component attached to the top or bottom frame component, the latch component having at least one compression element. The latch component is configured to rotate around the housing when the at least one compression element is compressed to change the polarity of the connector assembly from a first polarity when the latch component is located at a first polarity position to a second polarity when the latch component is located at a second polarity position.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: May 14, 2019
    Assignee: Senko Advanced Components, Inc
    Inventors: Jimmy Jun-Fu Chang, Kazuyoshi Takano
  • Patent number: 10288830
    Abstract: An expandable optical distribution device is provided which includes a basic module defined by a basic box, closed by a front cover, receiving an optical cable and housing an optical fiber derived from the optical cable and coupled to an output adapter to which a user's drop cable of a first user is coupled; and an additional carton-shaped expansion module in the form of an additional box, engageable on the basic box and closed by a tilting cover. The additional box is provided with an input connector attachable to the output adapter, and houses an expansion fiber split into multiple user fibers, each user fiber being coupled to an expansion adapter internal to the additional box and to each of which a user's drop cable is attachable.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: May 14, 2019
    Assignee: FURUKAWA ELECTRIC LATAM S.A.
    Inventor: Thiago Deconto Vieira
  • Patent number: 10278295
    Abstract: In a multi-panel display device in which plural individual display devices are joined, it is possible to guarantee image continuity in panel junction areas of the multi-panel display device by disposing a frame-type optical member, which includes a frame section having plural optical fibers and a central light-transmitting area, on the front surface of the multi-panel display device and optimizing structures of an inner inclined surface of the frame section of the frame-type optical member and optical fibers included in the frame section.
    Type: Grant
    Filed: May 3, 2016
    Date of Patent: April 30, 2019
    Assignee: LG Display Co., Ltd.
    Inventors: MiHyung Chin, JeongMin Moon, Sejin Lee
  • Patent number: 10274690
    Abstract: An enclosure for splicing a trunk line from outside a building to inside the building comprises a housing, a removable frame, and a splice tray. The housing includes a back and a sidewall comprising a wall portion and a gap. The removable frame is removably coupled to the back of the housing and comprises an adaptor plate, a splice tray coupler, and a wall. The wall of the removable frame fills in the gap of the sidewall of the housing. Further, the splice tray couples to the removable frame via the splice tray coupler of the removable frame.
    Type: Grant
    Filed: March 6, 2018
    Date of Patent: April 30, 2019
    Assignee: Total Cable Solutions, Inc.
    Inventor: Charles Hoskins
  • Patent number: 10261279
    Abstract: A rack-level breakout box, system, and method for distributing high-fiber count optical fiber cables to one or more network racks. External routing of incoming and outgoing cables around the rack is kept neat and orderly, with one large cable serving a fully populated rack and, optionally, multiple racks. A flexible mounting configuration is further provided.
    Type: Grant
    Filed: October 12, 2017
    Date of Patent: April 16, 2019
    Assignee: Sumitomo Electric Lightwave Corp.
    Inventors: Craig Steven Potter, Daniel Brian Hangebrauck, Daniel Frederick Oberklein, Patrick Stephen VanVickle
  • Patent number: 10261267
    Abstract: A terminal for making a hydraulic, electrical, or optical connection in an ink jet printing machine. The terminal extends along an axis XX?, and its external surface includes: a cylindrical portion, including a contact end and having a first diameter (d1), this end being provided with hydraulic or electrical or optical connection structure. The external surface also includes a collar, having a diameter (d2) higher than the first diameter (d1), and a throat, the bottom of which has a cross-section, in a plane perpendicular to the axis XX?, having at least one arc of circle portion having a third diameter (d3) lower than that of the collar, at least one planar part, and a part of this cross-section having a width lower than the third diameter. The throat continues with a connection device, for connecting to at least one hydraulic conduit or one electrical cable or one optical fiber.
    Type: Grant
    Filed: October 25, 2017
    Date of Patent: April 16, 2019
    Assignee: DOVER EUROPE SÀRL
    Inventors: Vincent Audouard, Jean-François Desse
  • Patent number: 10254492
    Abstract: An optical module includes a housing, a printed circuit board, an optical assembly, an optical interface joined with the optical assembly, the printed circuit board, the optical assembly, and the optical interface being disposed in the housing, an adapter to be mated with an external optical connector and disposed on an end of the housing, and first and second connecting part disposed on the adapter and the housing, respectively. The adapter and the housing are secured together through the first and second connecting parts. The optical interface and the adapter are configured to correspond to each other.
    Type: Grant
    Filed: December 22, 2017
    Date of Patent: April 9, 2019
    Assignee: InnoLight Technology (Suzhou) Ltd.
    Inventors: Zhanwei Wang, Kewu Wang
  • Patent number: 10246602
    Abstract: Polymeric compositions comprising a blend of high-density polyethylene (“HDPE”) with ethylene vinyl acetate (“EVA”), and optionally with a carbon black and/or one or more other additives, where the polymeric compositions have certain melt-index and vinyl-acetate-content ranges to improve melt strength and processability. Such polymeric compositions can be employed in manufacturing coated conductors, such as fiber optic cables.
    Type: Grant
    Filed: February 3, 2016
    Date of Patent: April 2, 2019
    Assignee: Union Carbide Chemicals & Plastics Technology LLC
    Inventor: Day-Chyuan Lee
  • Patent number: 10234635
    Abstract: A connector comprising: (a) shell acing a cavity configured to receive a single conventional insert (b) one or more modular inserts, each modular insert having a form factor ½ to ¼ of the form factor of said conventional insert, such that said cavity is capable of receiving 2 to 4 said modular inserts; (c) said each modular insert having at least: (i) a housing having a front opening and a rear opening, (ii) an interface disposed in said front opening, said interface presenting one or more conductors, said conductors extending from said interface rearward through said rear opening and into a jacketed cable, (iii) a crimp portion rearward of said rear opening, said jacketed cable being secured to said crimp portion, and (iv) one or more seals sealing said front and rear opening such that said interior of said housing is sealed from environment.
    Type: Grant
    Filed: January 22, 2018
    Date of Patent: March 19, 2019
    Assignee: TE CONNECTIVITY CORPORATION
    Inventors: David James Fabian, James Patrick Mosier, Douglas Harold Rohde
  • Patent number: 10228516
    Abstract: A fiber optic connector includes a boot receiving an optical fiber; a connector body for receiving the optical fiber and terminating the optical fiber; and a latch coupled to the connector body, the latch for engaging an adapter for receiving the fiber optic connector, the latch repositionable relative to the connector body to enable polarity change of the fiber optic connector without changing a relative position of the connector body and the optical fiber.
    Type: Grant
    Filed: June 19, 2017
    Date of Patent: March 12, 2019
    Assignee: THE SIEMON COMPANY
    Inventors: Anthony Veatch, John A. Siemon, Johnny Zheng, Alex Yao, Scott Nagel
  • Patent number: 10222565
    Abstract: Two semiconductor chips are optically aligned to form a hybrid semiconductor device. Both chips have optical waveguides and alignment surface positioned at precisely-defined complementary vertical offsets from optical axes of the corresponding waveguides, so that the waveguides are vertically aligned when one of the chips is placed atop the other with their alignment surface abutting each other. The position of the at least one of the alignment surface in a layer stack of its chip is precisely defined by epitaxy. The chips are bonded at offset bonding pads with the alignment surfaces abutting in the absence of bonding material therebetween.
    Type: Grant
    Filed: October 13, 2017
    Date of Patent: March 5, 2019
    Assignee: Elenion Technologies, LLC
    Inventors: David Henry Kinghorn, Ari Jason Novack, Holger N. Klein, Nathan A. Nuttall, Kishor V. Desai, Daniel J. Blumenthal, Michael J. Hochberg, Ruizhi Shi
  • Patent number: 10216013
    Abstract: Switches for electromagnetic radiation, including radiofrequency switches and optical switches, are provided. Also provided are methods of using the switches. The switches incorporate layers of high quality VO2 that are composed of a plurality of connected crystalline VO2 domains having the same crystal structure and orientation.
    Type: Grant
    Filed: March 7, 2017
    Date of Patent: February 26, 2019
    Assignee: WISCONSIN ALUMNI RESEARCH FOUNDATION
    Inventors: Zhenqiang Ma, Chang-Beom Eom, Jaeseong Lee, Daesu Lee, Sang June Cho, Dong Liu
  • Patent number: 10215919
    Abstract: An optical coupling arrangement is provided, comprising a lightwave circuit (LC), a coupling element and an optical waveguide element, wherein the lightwave circuit has a first surface area and wherein the coupling element is attached to the first surface area) such that an optical signal can be transmitted from the lightwave circuit to the coupling element. The optical waveguide element is attached to the coupling element at a first junction zone such that the optical signal can be transmitted from the coupling element to the optical waveguide element). The coupling element is configured to perform mode transformation to the optical signal transmitted from the lightwave circuit to the optical waveguide element and such that adiabatic coupling of the optical signal to the optical waveguide element is enabled. Thus, a better coupling efficiency can be achieved.
    Type: Grant
    Filed: August 17, 2017
    Date of Patent: February 26, 2019
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Tom Collins, Marco Lamponi
  • Patent number: 10209452
    Abstract: A silicon photonics package includes an L-shaped block formed from a cuboid having a through-hole through front and rear faces thereof. The L-shaped block includes two horizontal inner surfaces lying in a plane longitudinally bisecting a section of the through-hole, a bisected through-hole formed between the two horizontal inner surfaces, and a vertical inner surface. A lens block with a lens or lens array is bonded on the rear face of the L-shaped block. A vertical metal pad is attached on the front face of the L-shaped block. The vertical metal pad is soldered together with two horizontal metal pads on a photonic integrated circuit block formed with a waveguide or waveguide array such that the center of the optical lens is optically aligned with the waveguide. A method for fabricating the silicon photonics package, and an active alignment method for light coupling are also disclosed.
    Type: Grant
    Filed: March 12, 2018
    Date of Patent: February 19, 2019
    Assignee: CLOUD LIGHT TECHNOLOGY LIMITED
    Inventors: Vincent Wai Hung, Vivian Wei Ma
  • Patent number: 10209461
    Abstract: A behind-the-wall optical connector includes a ferrule having an annular collar projecting outwardly from a section of the ferrule and a plug frame receiving the ferrule in a central bore thereof, the plug frame including one or more resiliently-biased latches for gripping the ferrule annular collar to retain the ferrule within the plug frame. The optical connector may be fabricated inexpensively due to the low number of components. An optional boot may be provided. An insertion tool for assembling the optical connector is also described.
    Type: Grant
    Filed: December 19, 2017
    Date of Patent: February 19, 2019
    Assignee: Senko Advanced Components
    Inventors: Jimmy Jun-Fu Chang, Kazuyoshi Takano
  • Patent number: 10203453
    Abstract: Techniques for forming a facet optical coupler to couple light at an edge of silicon substrate are described. The facet optical coupler includes a silicon substrate, a layer of second material disposed on the silicon substrate and in direct contact with the edge of the silicon substrate, and an undercut region disposed between a portion of the silicon substrate and the layer of second material. The undercut region is offset from the edge to provide mechanical integrity of the facet optical coupler to improve production of photonic integrated circuits having the facet optical coupler from a wafer.
    Type: Grant
    Filed: June 12, 2017
    Date of Patent: February 12, 2019
    Assignee: Acacia Communications, Inc.
    Inventor: Long Chen
  • Patent number: 10197822
    Abstract: To reduce a production cost of a semiconductor device and provide a semiconductor device having improved characteristics. A grating coupler has a plurality of projections separated from each other in an optical waveguide direction and a slab portion formed between any two of the projections adjacent to each other and formed integrally with them; a MOS optical modulator has a projection extending in the optical waveguide direction and slab portions formed on both sides of the projection, respectively, and formed integrally therewith. The projection of the grating coupler and the MOS optical modulator is formed of a first semiconductor layer, a second insulating layer, and a second semiconductor layer stacked successively on a first insulating layer, while the grating coupler and the MOS optical modulator each have a slab portion formed of the first semiconductor layer.
    Type: Grant
    Filed: January 24, 2018
    Date of Patent: February 5, 2019
    Assignee: Renesas Electronics Corporation
    Inventors: Shinichi Kuwabara, Yasutaka Nakashiba, Tetsuya Iida, Shinichi Watanuki