Patents Examined by P. Hampton Hightower
-
Patent number: 7087311Abstract: Provided are polyimide and a thin film thereof which have a three-dimensional structure and therefore are excellent in a mechanical strength and a heat resistance as compared with those of conventional linear polyimide. The polyimide is obtained from a salt of multifunctional amine represented by Formula (1): (wherein A represents a tetravalent organic group, and n represents an integer of 0 to 3) and tetracarboxylic diester represented by Formula (2): (wherein B represents a tetravalent organic group having 1 to 20 carbon atoms, and R1 and R2 each represent independently an alkyl group having 1 to 5 carbon atoms).Type: GrantFiled: August 18, 2005Date of Patent: August 8, 2006Assignee: Chisso CorporationInventor: Takashi Kato
-
Patent number: 7083833Abstract: An aromatic polyamide photoalignment material prepared by a reaction from a diamine compound with a side branch and a photosensitive dicarboxylic acid. Furthermore, liquid crystal display devices using such photoalignment materials in an alignment film on at least one substrate.Type: GrantFiled: June 3, 2004Date of Patent: August 1, 2006Assignees: LG.Philips LCD Co., Ltd., Pohang University of Science and TechnologyInventors: Hyun Ho Shin, Mi Sook Nam, Su Hyun Park, Moonhor Ree, Seung Woo Lee
-
Patent number: 7078477Abstract: In the process of the present invention, a solvent-soluble polyimide is produced by polycondensing at least one tetracarboxylic acid component with at least one diamine component in a solvent in the presence of a tertiary amine. The tetracarboxylic acid component is selected from the group consisting of tetracarboxylic dianhydrides represented by the following formula 1: wherein R is as defined in the specification, and tetracarboxylic acids and their derivatives represented by the following formula 2: wherein R and Y1 to Y4 are as defined in the specification. Unlike the conventional techniques using an excessively large amount of a chemical imidation agent such as acetic anhydride and a chemical imidation catalyst such as triethylamine, in the process of the present invention, the solvent-soluble polyimide having a high polymerization degree is easily produced in a solvent with good productivity by using only a catalytic amount of the tertiary amine.Type: GrantFiled: June 25, 2004Date of Patent: July 18, 2006Assignee: Mitsubishi Gas Chemical Company, Inc.Inventors: Hiroki Oguro, Shuta Kihara, Tsuyoshi Bito
-
Patent number: 7074881Abstract: Disclosed are methods of synthesis of copoly(succinimide-aspartate), copolymers and derivatives thereof, prepared in a thermal or supercritical fluid method. Also disclosed are methods of isolating, compounding, stabilizing and processing the copoly(succinimide-aspartate), and its derivatives.Type: GrantFiled: November 3, 2003Date of Patent: July 11, 2006Assignee: Folia, INCInventors: Graham Swift, George H. Redlich
-
Patent number: 7074880Abstract: A preparation process of polyimide aerogels that composed of aromatic dianhydrides and aromatic diamines or a combined aromatic and aliphatic diamines is described. Also descried is a process to produce carbon aerogels derived from polyimide aerogel composed of a rigid aromatic diamine and an aromatic dianhydride. Finally, the processes to produce carbon aerogels or xerogel-aerogel hybrid, both of which impregnated with highly dispersed transition metal clusters, and metal carbide aerogels, deriving from the polyimide aerogels composed of a rigid aromatic diamine and an aromatic dianhydride, are described. The polyimide aerogels and the polyimide aerogel derivatives consist of interconnecting mesopores with average pore size at 10 to 30 nm and a mono-dispersed pore size distribution. The gel density could be as low as 0.008 g/cc and accessible surface area as high as 1300 m2/g.Type: GrantFiled: July 22, 2003Date of Patent: July 11, 2006Assignee: Aspen Aerogels, Inc.Inventors: Wendell Rhine, Jing Wang, Redouane Begag
-
Patent number: 7074882Abstract: The present invention provides a polyimide resin for an electrical insulating material which comprises a polyimide resin having a repeating unit represented by general formula (I): wherein R1 represents a bivalent organic group.Type: GrantFiled: July 2, 2004Date of Patent: July 11, 2006Assignee: Nitto Denko CorporationInventors: Takami Hikita, Hisae Sugihara, Amane Mochizuki
-
Patent number: 7074883Abstract: Copolymers of lactide and glycolide with high glycolide content. The average glycolate block length is less then about 3, which allows the copolymer to be soluble in slightly polar solvents such as methylene chloride.Type: GrantFiled: December 1, 2003Date of Patent: July 11, 2006Assignee: Alkermes Controlled Therapeutics, Inc. IIInventor: Chiem V. Pham
-
Patent number: 7071282Abstract: Disclosed herein are polyetherimide compositions comprising structural units of the formula: derived from at least one benzimidazole diamine, wherein R1 and R2 are independently selected from hydrogen and C1–C6 alkyl groups; “A” comprises structural units of the formulae: or mixtures of the foregoing structural units; wherein “D” is a divalent aromatic group, R3 and R10–R12 are independently selected from hydrogen, halogen, and C1–C6 alkyl groups; “q” is an integer having a value of 1 up to the number of positions available on the aromatic ring for substitution; and “W” is a linking group; and “B” comprises substituted and unsubstituted arylene groups having from about 6 to about 25 carbon atoms. Methods for producing the polyetherimide compositions are also disclosed herein.Type: GrantFiled: June 3, 2003Date of Patent: July 4, 2006Assignee: General Electric CompanyInventors: Havva Acar, Daniel Joseph Brunelle
-
Patent number: 7071288Abstract: The present invention is generally directed to a process for producing lactide-based polymers and the polymers produced by this process. The polymers of the present invention are terpolymers formed by the copolymerization of a lactide monomer, a linking monomer and an epoxy-terminated monomer. In one embodiment of the invention, the polymers may be formed from fluorine-containing monomers or aromatic ring-containing monomers. The disclosed materials may display improved hydrolytic and thermal characteristics as compared to previously known lactide-based materials. For example, the lactide based terpolymers may have a glass transition temperature over 60° C. For instance, lactide-based thermoplastic terpolymers of the present invention can have a glass transition temperatures of about 80° C. or higher. Lactide-based thermoset networks of the invention can have glass transition temperatures of up to about 200° C.Type: GrantFiled: April 7, 2004Date of Patent: July 4, 2006Assignee: Clemson UniversityInventors: Dennis W. Smith, Nilmini Abayasinghe
-
Patent number: 7070858Abstract: An absorbable crystalline, monocentric polyaxial copolymer comprising a central carbon or nitrogen atom and at least three axes, each of which includes an amorphous flexible component adjacent and originating from the central atom and a rigid, crystallizable component extending outwardly from the amorphous, flexible component is disclosed along with the use of such copolymer in medical devices which may contain a bioactive agent. The present invention also relates to a suture, stents, stent mantles and sealing devices made from the polyaxial copolymer.Type: GrantFiled: July 30, 2003Date of Patent: July 4, 2006Assignee: Poly Med IncInventors: Shalaby W. Shalaby, Torbjorn Mathisen
-
Patent number: 7071287Abstract: A preparation process of polyimide aerogels that composed of aromatic dianhydrides and aromatic diamines or a combined aromatic and aliphatic diamines is described. Also descried is a process to produce carbon aerogels derived from polyimide aerogel composed of a rigid aromatic diamine and an aromatic dianhydride. Finally, the processes to produce carbon aerogels or xerogel-aerogel hybrid, both of which impregnated with highly dispersed transition metal clusters, and metal carbide aerogels, deriving from the polyimide aerogels composed of a rigid aromatic diamine and an aromatic dianhydride, are described. The polyimide aerogels and the polyimide aerogel derivatives consist of interconnecting mesopores with average pore size at 10 to 30 nm and a mono-dispersed pore size distribution. The gel density could be as low as 0.008 g/cc and accessible surface area as high as 1300 m2/g.Type: GrantFiled: January 28, 2005Date of Patent: July 4, 2006Assignee: Aspen Aerogels, Inc.Inventors: Wendell Rhine, Jing Wang, Redouane Begag
-
Patent number: 7067580Abstract: A flexible thermal control composite comprising a natural or synthetic polymer and an endotherm dispersed, distributed and suspended within said natural or synthetic polymer i.e. “P”olymer “C”ontaining an “E”ndothermic “A”gent (PCEA). The PCEA can be formed into thin and thick films. It can be drawn, molded, extruded and spun into fibers or all dimensions. It can be formed and chopped into PCEA mulch. Irrespective its final form, the PCEA can be used in insulating, thermoprotecting, heat absorbing applications on the one hand, and heat maintenance applications of all types on the other.Type: GrantFiled: April 26, 2004Date of Patent: June 27, 2006Inventor: Claude Q. C. Hayes
-
Patent number: 7064176Abstract: The invention relates to novel polyhydroxyamide compounds that, in the form of their oxazoles, ane suited as a coating material, particularly for electronic components. The invention also relates to a method for producing these novel compounds and to the use thereof.Type: GrantFiled: March 28, 2002Date of Patent: June 20, 2006Assignee: Infineon Technologies AGInventors: Marcus Halik, Klaus Lowack, Recai Sezi, Andreas Walter
-
Patent number: 7060784Abstract: A polyimide precursor resin solution composition sheet having a solvent content of 1–50% by weight and a thickness of 1–10 microns has improved adhesion, forms a heat resistant polyimide layer when cured, and is advantageously used in the bonding of conductors to plastic films.Type: GrantFiled: June 24, 2004Date of Patent: June 13, 2006Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Shigehiro Hoshida, Masahiro Usuki, Michio Aizawa, Tadashi Amano
-
Patent number: 7060782Abstract: A process for the production of high molecular weight polybenzimidazole by one: providing a first reaction vessel; charging the reaction vessel with at least one aromatic hydrocarbon tetraamine, and a heterocylic ring making up the dicarboxylic component; heating the reactants under agitation in a substantially oxygen-free atmosphere with agitation until the agitator torque is about 1.5 times the torque before a rise in viscosity begins; terminating the agitation while continuing to heat the reaction mixture to about 230° C. while allowing the reaction mass to foam; cooling the reaction mass to a friable foamed mass; crushing the friable foamed mass to obtain a ground prepolymer; and two: providing a second reaction vessel, the second reaction vessel being a high intensity reaction vessel; transferring the ground prepolymer to the second reaction vessel; heating the ground prepolymer under agitation to over 315° C. at atmospheric pressure for a time of about 90 minutes.Type: GrantFiled: July 2, 2004Date of Patent: June 13, 2006Assignee: PBI Performance Products, Inc.Inventors: Bobby G. Dawkins, J. Dean Baker, Rita H. Joiner
-
Patent number: 7057008Abstract: Packaging materials made from water-soluble nylons are disclosed, that readily contain materials such as caustic chemicals and upon exposure to water dissolve to provide for the release of the chemical into an aqueous environment. The materials are made from select polyether diamines and select aliphatic dicarboxylic acids.Type: GrantFiled: May 14, 2003Date of Patent: June 6, 2006Assignee: E.I. du Pont de Nemours and CompanyInventor: Rolando Umali Pagilagan
-
Patent number: 7053168Abstract: A method for preparing a polyimide includes introducing a mixture of an oligomer and a solvent to an extruder, removing solvent via at least one extruder vent, and melt kneading the oligomer to form a polyimide. The polyimide has a low residual solvent content. The method is faster than solution polymerization of polyimides, and it avoids the stoichiometric inaccuracies associated with reactive extrusion processes that use monomers as starting materials.Type: GrantFiled: October 10, 2003Date of Patent: May 30, 2006Assignee: General Electric CompanyInventors: Norberto Silvi, Mark Howard Giammattei, Paul Edward Howson, Farid Fouad Khouri
-
Patent number: 7053169Abstract: The invention relates to new thermoplastically processible transparent polyamide molding materials based on copolyamides containing diamines and dicarboxylic acids with aromatic cores which exhibit a high index of refraction nD20 over 1.59 and a low density under 1.3 g/cm3. At the same time, a low birefringence, high hardness, and scratchresistance are achieved. The polyamide molding materials are fabricated by means of conventional pressure reactors (autoclaves) according to a modified technique. The granulate that is produced from the inventive molding materials is reshaped by thermoplastic processes like injection molding, particularly in multichamber cavity tools. The invention also relates to the utilization of the inventive molding materials for producing optical lenses.Type: GrantFiled: April 18, 2002Date of Patent: May 30, 2006Assignee: Ems-Chemie AGInventor: Friedrich Severin Bühler
-
Patent number: 7053172Abstract: The fuel-barrier polyamide resin of the present invention is a product of the polycondensation of a diamine component comprising 70 mol % or higher of m-xylylenediamine and a dicarboxylic acid component comprising 70 mol % or higher of a mixed dicarboxylic acid which comprises a C4 to C20 ?,?-linear aliphatic dicarboxylic acid and at least one dicarboxylic acid selected from the group consisting of isophthalic acid and naphthalenedicarboxylic acid in a molar ratio of 30:70 to 95:5. The polyamide resin is excellent in not only fuel-barrier property and heat resistance, but also moldability and recyclability, and therefore suitably used as a barrier material of fuel containers.Type: GrantFiled: May 4, 2004Date of Patent: May 30, 2006Assignee: Mitsubishi Gas Chemical Co., Inc.Inventors: Kazunobu Sato, Kazunobu Maruo, Jun Mitadera, Masashi Kurokawa
-
Patent number: 7053171Abstract: In the production method of the present invention, the polyamide is produced by the polycondensation of a diamine component and a dicarboxylic acid component comprising a straight-chain ?,?-aliphatic dicarboxylic acid and an aromatic dicarboxylic acid. The dicarboxylic acid component is first made into a suspension phase of the solid aromatic dicarboxylic acid in a molten straight-chain ?,?-aliphatic dicarboxylic acid. A part of the diamine component is added while the reaction system is in the suspension phase. Then, the reaction system is made into a homogeneous molten phase, to which the rest of the diamine component is added. Finally, the reaction system is kept at temperatures within a specific range to complete the polycondensation.Type: GrantFiled: May 20, 2004Date of Patent: May 30, 2006Assignee: Mitsubishi Gas Chemical Company, Inc.Inventors: Ryoji Otaki, Tomomichi Kanda