Patents Examined by P. Hampton Hightower
  • Dental materials based on polyfunctional amides
    Patent number: 6953832
    Abstract: Dental material containing an amide of the general formula BXn in which B stands for a hydrocarbon radical with 1 to 5 carbon atoms, which can contain one or more of the groups O, S, NH, CO—NH, O—CO—NH and/or NH—CO—NH, and which is substituted n times with the group X, X stands for the group which is bound via the nitrogen atom or via C-2 to the radical B, the bond site not connected to B carrying a radical R2, R1 being hydrogen, an alkyl group with 1 to 20 carbon atoms or a phenyl radical, two or more radicals X being able to share a radical R1 and R1 also being able to be a constituent of the radical B, R2 being hydrogen, an alkyl group with 1 to 20 carbon atoms or a phenyl radical, and n being a number from 2 to 5.
    Type: Grant
    Filed: January 14, 2002
    Date of Patent: October 11, 2005
    Assignee: Ivoclar Vivadent AG
    Inventors: Norbert Moszner, Frank Zeuner, Volker Rheinberger, Jörg Angermann, Thomas Völkel
  • Phenolic hydroxyl-bearing polyimide resin, making method and polyimide resin composition
    Patent number: 6949619
    Abstract: A polyimide resin having phenolic hydroxyl radicals in its skeleton is prepared using a diamine bearing an aromatic ring having an amino radical attached thereto and another aromatic ring having a phenolic hydroxyl radical. The polyimide resin and a composition comprising the polyimide resin, an epoxy resin and a curing agent are suited for use as varnish, adhesive and adhesive film for which adhesion and heat resistance are required.
    Type: Grant
    Filed: July 18, 2003
    Date of Patent: September 27, 2005
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Nobuhiro Ichiroku, Masachika Yoshino, Hideki Akiba, Toshio Shiobara
  • Polymer compound, precursor for the same and thin film-forming method using the same polymer precursor
    Patent number: 6949618
    Abstract: Provided are polyimide and a thin film thereof which have a three-dimensional structure and therefore are excellent in a mechanical strength and a heat resistance as compared with those of conventional linear polyimide. The polyimide is obtained from a salt of multifunctional amine represented by Formula (1): (wherein A represents a tetravalent organic group, and n represents an integer of 0 to 3) and tetracarboxylic diester represented by Formula (2): (wherein B represents a tetravalent organic group having 1 to 20 carbon atoms, and R1 and R2 each represent independently an alkyl group having 1 to 5 carbon atoms).
    Type: Grant
    Filed: October 29, 2002
    Date of Patent: September 27, 2005
    Assignee: Chisso Corporation
    Inventor: Takashi Kato
  • Polyimide substrates having enhanced flatness, isotropy and thermal dimensional stability, and methods and compositions relating thereto
    Patent number: 6949296
    Abstract: The substrates of the present invention comprise a polyimide base polymer derived at least in part from non-rigid rod monomers together with optionally rigid rod monomers where the substrates are cured under low tension. The resulting polyimide materials have been found to provide advantageous properties (e.g. balanced molecular orientation, good dimensional stability, and flatness) particularly useful for electronics type applications.
    Type: Grant
    Filed: April 4, 2003
    Date of Patent: September 27, 2005
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: Meredith L. Dunbar, James R. Edman
  • Methods for producing polyester amides based on polyisobutylenes, polyester amides produced thereby, and uses therefor in stabilizing crude oil
    Patent number: 6946524
    Abstract: Processes for producing polyester amides, by reacting a polyisobutylene with a first reagent selected from the group consisting of at least monounsaturated acids having from 3 to 21 carbon atoms and derivatives thereof; and a second reagent selected from the group consisting of monoethanolamine and alkylamines of the general formula R—NH2, wherein R represents an alkyl group having from 1 to 4 carbon atoms; are described. The polyester amides thus produced and their uses in stabilizing asphaltenes in crude oil and crude oil derivatives are also described.
    Type: Grant
    Filed: August 29, 2001
    Date of Patent: September 20, 2005
    Assignee: Cognis Deutschland GmbH & Co. KG
    Inventors: Wolfgang Breuer, Paul Birnbrich, Claus-Peter Herold, Stephan Von Tapavicza, Didier Groffe, Matthias Hof
  • Transparent polyamide molding materials having improved transparency, resistance to chemicals and high permanent fatigue strength
    Patent number: 6943231
    Abstract: Transparent polyamide molding materials are provided which are characterized in that they have a melting enthalpy between 0 and 12 J/g and the polyamides are constituted of 100 mole-% of a diamine mixture having 10-70 mole-% of PACM [bis-(4-amino-cyclohexyl)-methane] with less than 50 wt.
    Type: Grant
    Filed: June 2, 2003
    Date of Patent: September 13, 2005
    Assignee: EMS-Chemie AG
    Inventor: Friedrich Severin Bühler
  • Charge-transporting polymer
    Patent number: 6936679
    Abstract: A charge-transporting polymer is represented by the following general formula (I-1) or (I-2): wherein A represents a group represented by the following general formula (II-1):
    Type: Grant
    Filed: September 10, 2002
    Date of Patent: August 30, 2005
    Assignee: Fuji Xerox Co., Ltd.
    Inventors: Mieko Seki, Hirohito Yoneyama, Daisuke Okuda, Hidekazu Hirose, Tadayoshi Ozaki, Takeshi Agata, Toru Ishii, Kiyokazu Mashimo, Katsuhiro Sato
  • Polyamide
    Patent number: 6936682
    Abstract: A polyamide characterized in that the polyamide is obtained by thermal polycondensation of (a) dicarboxylic acid components comprising 10 to 80% by mole in total carboxylic acid components of 1,4-cyclohexanedicarboxylic acid having a trans/cis molar ratio of 50/50 to 97/3 and (b) an aliphatic diamine component is disclosed. The alicyclic polyamide having 1,4-cyclohexanedicarboxylic acid in a backbone thereof as a dicarboxylic acid unit, which is suitable as materials for various uses such as automotive parts, electric/electronics parts, industrial materials, engineering materials and daily household goods, and superior in heat resistance, low water absorption, light resistance, moldability and light weight, as well as superior in toughness, chemical resistance and appearance, and molded articles thereof.
    Type: Grant
    Filed: December 6, 2001
    Date of Patent: August 30, 2005
    Assignee: Asahi Kasei Kabushiki Kaisha
    Inventors: Masaaki Aramaki, Tomofumi Maekawa
  • Thermally re-mendable cross-linked polymers
    Patent number: 6933361
    Abstract: Thermally re-mendable cross-linked polymeric materials that can be repeatedly mended or repaired by simple thermal treatment. The polymeric materials are made by polymerizing furan monomers and maleimide monomers via the Diels-Alder (DA) reaction wherein the furan monomers have at least three furan moieties and the maleimide monomers have at least three maleimide moieties. The intermonomer linkages that form between the furan and maleimide monomers are thermally reversible and do not require the addition of catalysts, additional monomer or special surface treatments.
    Type: Grant
    Filed: July 12, 2002
    Date of Patent: August 23, 2005
    Assignee: The Regents of the University of California
    Inventors: Fred Wudl, Xiangxu Chen
  • Modified polyamides, compositions based on same and macromolecular compounds used to obtain them
    Patent number: 6930165
    Abstract: The invention concerns polyamides modified by a multifunctional compound. Finished articles formed from said polyamides or from compositions based on said polyamides exhibit excellent mechanical properties, and a very good surface appearance. The modified polyamide is obtained by mixing in melted form a polyamide and a polyamide macromolecular compound comprising star-shaped or H-shaped macromolecular chains.
    Type: Grant
    Filed: June 15, 2001
    Date of Patent: August 16, 2005
    Assignee: Rhodia Engineering Plastics S.r.l.
    Inventors: Nicolangelo Peduto, Franco Speroni, Haichun Zhang
  • Resin compositions, processes for preparing the resin compositions and processes for forming resin films
    Patent number: 6927274
    Abstract: Polyimide precursors contained in resin compositions of the present invention have a polymer structure unit represented by formula (1) below: wherein chemical structure A2 includes an alicyclic compound but not an aromatic compound such as a benzene ring so that they provide excellent light transmission over a wide wavelength range. The polyimide precursors are imidized at 7.5% or more and 36% or less so that they are less soluble in developing solutions and therefore are not dissolved in the developing solutions at unexposed parts. Thus, the resin compositions of the present invention can be used to form a resin film having a precise pattern by exposure and development.
    Type: Grant
    Filed: October 24, 2003
    Date of Patent: August 9, 2005
    Assignee: Sony Chemicals Corp.
    Inventors: Mamiko Nomura, Masatoshi Hasegawa, Junichi Ishii, Tadashi Akamatsu
  • Coated polyamide molding products
    Patent number: 6924034
    Abstract: It is disclosed that a coated polyamide molding product, characterized in that, a polyamide molding product obtained from a polyamide resin composition containing a polyamide resin (A), a thermoplastic resin composition (B) having functional groups reacting with the polyamide resin and, if necessary, an inorganic filler (C) is coated with a thermoplastic resin elastomer (D) which is compatible with the thermoplastic resin composition which is the above-mentioned component (B).
    Type: Grant
    Filed: May 8, 2002
    Date of Patent: August 2, 2005
    Assignee: Toyo Boseki Kabushiki Kaisha
    Inventors: Tsutomu Tamura, Yoshinobu Hanaoka, Tomohide Nakagawa
  • Polyamide acid and polyimide, and optical material
    Patent number: 6924348
    Abstract: A polyimide excelling in heat resistance, chemical resistance, water repellency, dielectric characteristics, electrical characteristics, and optical characteristics and a polyamide acid useful as the raw material therefor are provided. Specifically, a polyamide acid containing a chlorine atom and a fluorine atom and comprising a repeating unit represented by the following formula (1): (wherein X and X? independently denote a divalent organic group; Y and Y? independently denote a chlorine, bromine, or iodine atom; p and p? denote independently denote the number of fluorine atom {F in the formula (1)} bonded to the relevant benzene ring, representing an integer of 0-3; q and q? independently denote an integer of 0-3; and p+q total 3, and p?+q? total 3).
    Type: Grant
    Filed: July 11, 2002
    Date of Patent: August 2, 2005
    Assignees: Nippon Shokubai Co., Ltd., NTT Advanced Technology Corporation
    Inventors: Kozo Tajiri, Masayoshi Kuwabara, Yasunori Okumura, Tohru Matsuura, Noriyoshi Yamada
  • Approach to reduce cyclics formation in 3-CIPA based polyetherimide polymers
    Patent number: 6919418
    Abstract: Methods of reducing the amount of undesirable cyclic oligomer by-products in the production of polyetherimides are disclosed. The resulting polyetherimides have enhanced thermomechanical properties.
    Type: Grant
    Filed: August 25, 2003
    Date of Patent: July 19, 2005
    Inventors: Farid Fouad Khouri, Daniel Joseph Brunelle, Donald Scott Johnson
  • Polyimide resin with reduced mold deposit
    Patent number: 6919422
    Abstract: A polyimide composition and a process to prepare polyimide resins with reduced plate out and mold deposits is described. During resin molding operations the low plate out resins show a longer period of operation between cleaning of equipment leading to more efficient operation.
    Type: Grant
    Filed: September 22, 2003
    Date of Patent: July 19, 2005
    Assignee: General Electric Company
    Inventors: Robert R Gallucci, Roy Ray Odle, William A. Kernick, III, Mark Alan Sanner
  • Process for producing polyimide
    Patent number: 6916898
    Abstract: A process of preparing a polyimide of the present invention comprises effecting an imidization reaction of a diamine and a tetracarboxylic dianhydride in a solvent containing 50 to 100% by weight of an equimolar composition of a nitrogen-containing cyclic compound indicated by chemical formula (1) below and a phenol indicated by chemical formula (2) below: in formula (1), X represents —CH2— or —N(CH3)—, and in formula (2), R1 and R2 may be the same as, or different from, each other and represent each any one of —H, —OH, —CH3, —C2H5, —C3H7, —C4H9, —C5H11, —C6H13, —C7H15, —C8H17, —C9H19, —C10H21, —OCH3, —O(C6H5), —NO2, —Cl, —Br and —F.
    Type: Grant
    Filed: March 13, 2001
    Date of Patent: July 12, 2005
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Takashi Kuroki, Atsushi Shibuya, Shoji Tamai
  • Production of polyamide
    Patent number: 6916901
    Abstract: The present invention provides a method for the production of polyamide 6 by the hydrolytic polymerization of ?-caprolactam, in which, in the first step, caprolactam ring opening occurs under the action of water and, in the following steps, polycondensation is performed at low temperatures under anhydrous conditions.
    Type: Grant
    Filed: November 7, 2002
    Date of Patent: July 12, 2005
    Assignee: Bayer Aktiengesellschaft
    Inventors: Sven Gestermann, Ralph Ulrich
  • Low viscosity melt processable high temperature polyimides
    Patent number: 6911519
    Abstract: A series of low melting and low viscosity phenylethynyl end-capped polyimides (PETIs) possessed of long term thermal and mechanical stability useful as films, melt coatings, adhesives, matrix and RTM resins and particular as coatings for optical fibers and phenylethynyl end-capped bismides blended with PETIs are disclosed. Processes for their production including: 1) modification of PETI-5 oligomer by molecular weight adjustments by blending with reactive low melting phenylethynyl end-capped imide monomers, 2) modification of the PETI-5 backbone structure with other diamine components, and 3) modification of the PETI-5 backbone with bulky fluorinated groups are also disclosed.
    Type: Grant
    Filed: March 25, 2003
    Date of Patent: June 28, 2005
    Assignee: University of Connecticut
    Inventors: Daniel A. Scola, Christopher D. Simone
  • Filled epsilon-caprolactone based polymer compositions, method for preparing same and articles based on said compositions
    Patent number: 6911522
    Abstract: Compositions based on ?-caprolactone polymer, comprising at least one ?-caprolactone polymer and calcium carbonate. Process for preparing these compositions, which are used for manufacturing articles, in particular films, preferably obtained by extrusion blow-moulding or by flat-die extrusion.
    Type: Grant
    Filed: January 19, 2001
    Date of Patent: June 28, 2005
    Assignee: SOLVAY (Societe Anonyme)
    Inventors: Dino Manfredi, Ivan Claeys
  • Synthesis of high solids resins from amine terminated polyamides
    Patent number: 6908983
    Abstract: The present invention contemplates a process for forming polyaminoamide polymers formed by the reaction of a dibasic acid/ester with excess amounts of an amine; the intermediate polymer resulting therefrom; a process for synthesizing effective, high solids resins resulting from the reaction of intermediate polymers with an epihalohydrin; and the resultant high, solids resin. These resins may be used as wet strength resins in the papermaking industry.
    Type: Grant
    Filed: April 1, 2003
    Date of Patent: June 21, 2005
    Assignee: Hercules Corporation
    Inventor: William W. Maslanka