Abstract: The invention provides a polyimide film manufactured from a polyamic acid prepared from pyromellitic dianhydride in combination with 10 to 60 mol % of phenylenediamine and 40 to 90 mol % of 3,4?-oxydianiline, based on the overall diamine. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.

Abstract: Provided is a method of producing a polymeric fluorescent substance wherein one or more monomers represented by the general formula (1) are polymerized in the presence of a zerovalent nickel complex, X1—Ar1—X2??(1) wherein, Ar1 represents a divalent group selected from the group consisting of arylene groups, divalent heterocyclic compound groups, and divalent or trivalent hetero atom-bonded arylene or divalent heterocyclic compound groups, and X1 and X2 represent leaving groups. By using the polymeric fluorescent substance, a high performance polymer LED can easily be obtained.

Abstract: The invention concerns copolyamides obtained by using multifunctional monomers. It consists in using a multifunctional monomer comprising at least three reactive functions and at least another multifunctional monomer, in amounts such that the terminal group concentrations are balanced. The copolyamides are particularly high viscosity copolyamides. The invention also concerns compositions based on said copolyamides.

Abstract: Poly-o-hydroxyamides are cyclicized to obtain polybenzoxazoles. The poly-o-hydroxyamides provide effective filling of trenches. In particular, the poly-o-hydroxyamides can fill trenches having a width of less than 100 nm and an aspect ratio of more than 4. Further, the polybenzoxazoles of the invention are very suitable for the damascene process. A dielectric can be made from the polybenzoxazole. In turn, semiconductor devices can include the dieletric. Processes for making the poly-o-hydroxyamides, polybenzoxazoles, and semiconductor devices are included.

Abstract: The present invention is to provide a laminated resin molding comprising a polyamide-based resin composition as an outer layer and being excellent in interlayer adhesion strength, in particular a laminated resin molding comprising a fluorine-containing resin as an inner layer. The present invention is a laminated resin molding which comprises a layer (A) comprising a polyamide-based resin composition and a layer (B) laminated to said layer (A), said layer (B) comprising a fluorine-containing ethylenic polymer having a carbonyl group, and said polyamide-based resin composition having a functional group, in addition to an amide group, selected from the group consisting of hydroxyl group, carboxyl group, ester group and sulfonamide group in a total amount of 0.05 to 80 equivalent percent relative to the amide group.

Abstract: Oxygen barrier films having a greatly improved dynamic coefficient of friction, and specifically, oxygen barrier films having an exceptionally low dynamic coefficient of friction, reduced moisture sensitivity and good oxygen barrier properties over a wide range of relative humidities. The low coefficient of friction is obtained by using film layers which are blends of a polyamide component and a high density polyethylene which surround an oxygen barrier layer, such as an ethylene vinyl alcohol layer.

Abstract: Anionic polymerization initiators useful in the preparation of polymers having a protected amine functional group. The amine functionality includes a first protecting group, which can be aralkyl, methyl, allyl or tertiary alkyl group. The other of the amine protecting groups can be the same as the first protecting group. Alternatively, the second protecting group can be different from the first protecting group, in which case it is selected to have differential stability to agents used to remove the aralkyl, methyl, allyl or tertiary alkyl protecting group.

Abstract: The present invention provides a laminate for automobile parts having a layer A made from a polyamide resin composition containing 70-99 wt % of (a) a specific polyamide polymer, and 1-30 wt % of (b-1) an ethylene copolymer containing an epoxy group and/or (b-2) an ethylene copolymer modified by an acid anhydride, and a layer B made from a resin composition containing (c-1) a polyethylene resin modified by an acid anhydride and/or (c-2) a polyethylene resin containing an epoxy group, wherein the layer A and the layer B are heat-sealed, except when (1) the layer A contains (b-1) alone as the ethylene copolymer and the layer B contains (c-2) alone as the polyethylene resin; and when (2) the layer A contains (b-2) alone as the ethylene copolymer and the layer B contains (c-1) alone as the polyethylene resin. The laminate of the present invention is superior in strength, stiffness and gasoline barrier property that the automobile parts are required to have.

Abstract: An adhesive polyimide resin which comprises a siloxane polyimide resin obtained from (A) an aromatic tetracarboxylic dianhydride and (B) a diamine ingredient comprising (B1) a diamine having a phenolic hydroxyl group, carboxyl group, or vinyl group as a crosslinkable reactive group and (B2) a siloxanediamine and has a glass transition temperature of 50 to 250?C and a Young's modulus (storage modulus) at 250?C of 105 Pa or higher; and a laminate which comprises a substrate comprising a conductor layer and an insulating supporting layer having at least one polyimide resin layer and, disposed on a surface of the substrate, an adhesive layer comprising a layer of the adhesive polyimide resin. The adhesive polyimide resin and the laminate have satisfactory adhesion strength even after exposure to a high temperature of up to 270?C and further have excellent heat resistance in reflow ovens. They are hence suitable for use in the bonding of electronic parts.

Abstract: A thermosetting polyimide resin composition is provided which comprises a polyimide resin and an epoxy resin, which has excellent heat resistance, low dielectric constant and low dielectric loss tangent and also yields a cured article having good mechanical properties such as tensile strength and tensile elongation. Also, a process for producing a polyimide resin used in the polyimide resin composition is provided. The thermosetting polyimide resin composition comprises a polyimide resin (X), which has a carboxyl group and a linear hydrocarbon structure having a number-average molecular weight of 300 to 6,000, and an epoxy resin (Y).

Abstract: The invention concerns copolyamides obtained by using multifunctional monomers. It consists in using at least one multifunctional monomer comprising at least three reactive functions and at least another multifunctional monomer, in amounts such that the terminal group concentrations are balanced. The copolyamides are more particularly high viscosity copolyamides. The invention also concerns compositions based on said copolyamides.

Abstract: The invention relates to a liquid initiator for carrying out anionic lactam polymerization. The liquid initiator contains a conversion product of isocyanate (1) with a protic compound (P) and a base (B) in an aprotic solvation agent (S).

Abstract: A method for the synthesis of poly(etherimide)s comprises the reaction of 4-halotetrahydrophthalic anhydride with an activating primary amine to yield an activated 4-halotetrahydrophthalimide. Activated 4-halotetrahydrophthalimide may then be aromatized and treated with the disodium salt of a bis(phenol) to yield an activated bisimide. The activated bisimide may then be directly treated with a diamine to yield poly(etherimide)s.

Abstract: A method is disclosed for producing a polyamide molding compound which includes the following method steps: addition and dissolving of m-xylylene diamine and dicarboxylic acids, which include adipic acid and aromatic dicarboxylic acids, with water and additives in a dissolving chamber and production of a mixture, the sum of the aromatic dicarboxylic acids added being 2 mol-percent to 15 mol-percent (in relation to the addition of dicarboxylic acids); transfer of the mixture into a reaction vessel and polycondensation of the mixture in this reaction vessel; granulation of the polycondensate; drying of the granulate. This method is distinguished in that the polycondensation is performed at a pressure of at most 10 bar and a temperature of 255° C. to 270° C., the pressure being built up while heating the reaction vessel to 255° C. to 270° C. and—immediately after the mixture has reached the maximum temperature—being reduced to atmospheric conditions while maintaining a temperature of 255° C. to 270° C.

Abstract: A process for producing alkali metal polymaleimide salts by alkaline hydrolysis of maleimide polymers prepared by polymerization of maleimide monomers in the presence of a metal oxide and alcohol initiator or a base. In particular, the process produces alkali metal polymaleimide salts with particular ratios of C—N and C—C connected maleimide-derived monomer units which are dependent on the particular initiator used to synthesize the maleimide polymer. The alkali metal polymaleimide salts, which have chelating and anti-scaling properties, are useful as chelating agents and detergent builders and as such are suitable biodegradable replacements for synthetic polymers and sodium polyaspartate.

Abstract: A process for preparing a polymer, which comprises a) reacting a mixture (I) containing 6-aminocapronitrile and water in the presence of a catalyst to obtain a mixture (II) containing caprolactam, ammonia, water, high boilers and low boilers, then b) removing ammonia from mixture (II) to obtain a mixture (III) containing caprolactam, water, high boilers and low boilers, then c) removing all or some of the water from mixture (III) to obtain a mixture (IV) containing caprolactam, high boilers and low boilers and then d) feeding mixture (IV) to a polymerization reaction, and also the polymer obtainable by this process, the use of the polymer for producing fibers, sheetlike structures and moldings, and also fibers, sheetlike structures and moldings obtainable using such a polymer.

Abstract: Process for providing a binder for mineral fibers, comprising the steps of: mixing together under reactive conditions an amine and an anhydride whereby water is added thereto, once substantially all the anhydride is dissolved and/or reacted in the amine.

Abstract: A multilayer comprising at least one layer A) of at least one thermoprocessable polymer containing at least 5% by weight of chlorinated polyvinyl chloride (CPVC) and one layer B) based on polyamides having an amount of —NH2 end groups in the range 20-300 ?eq/g.

Abstract: Disclosed is a process for reducing low molecular weight impurities, namely caprolactam and its oligomers, from Nylon-6 pre-polymer during the preparation of Nylon-6 polymer.

Abstract: The invention relates to hyperbranched copolyamides (HBPAs), to their production and to their use as additives, in particular as melt viscosity modifiers in thermoplastic polymer compositions. This copolyamide is obtained by a reaction between a monomer (I): A—R—Bf with A and B=polymerization functions of a 1st and 2nd type, respectively, which are capable of reacting with each other, R=hydrocarbon-based species and f=total number of B per monomer (preferably 2?f?10); and a monomer (II) A?—R?—B? or the corresponding lactams, with A?, B? and R? having the same definition as that given above for A, B and R, respectively. This HBPA has a I/II molar ratio such that 0.125?I/II?2. One of the species R or R? of (I) or (II) is aliphatic, cycloaliphatic or arylaliphatic. For example: A=NH2 and B=COOH or A=COOH and B=NH2 with F=2. A?=NH2 and B?=COOH or A?=COOH and B?=NH2. A—R—B2, e.g.: 5-aminoisophthalic acid or 3,5-diaminobenzoic acid and A?—R?—B?=?-caprolactam.