Patents Examined by P. Hampton Hightower
  • Patent number: 6784280
    Abstract: A process for producing a polysuccinimide (co)polymer derivative which permits the reaction of a polysuccinimide (co)polymer with a Lewis base in a wide temperature range (90° to 300° C.) without using a pH-adjusting agent is provided. The process for producing a polysuccinimide (co)polymer derivative of this invention comprises reacting a polysuccinimide (co)polymer with a Lewis base by heating in the presence of a solvent having a low boiling point and high relative permittivity.
    Type: Grant
    Filed: February 8, 2001
    Date of Patent: August 31, 2004
    Assignee: Nippon Shokubai Co., Ltd.
    Inventors: Shinzo Yasuda, Masaharu Mukouyama
  • Patent number: 6780963
    Abstract: The polyamide resin composition of the invention is characterized by having a solder reflow heat-resistant temperature of not lower than 250° C. Since the polyamdie resin composition has low water absorption and is excellent in moldability, heat resistance, shape stability and mechanical strength, it can be suitably used for, for example, automobile parts and electric or electronic parts.
    Type: Grant
    Filed: August 21, 2002
    Date of Patent: August 24, 2004
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Masahiro Sawada, Kunihiro Ohuchi
  • Patent number: 6780941
    Abstract: Blending of thermoplastic polyester with fiber-forming polyamide in the production of melt-colored melt-spun fibers results in improved color strength and aesthetics, and dimensional stability.
    Type: Grant
    Filed: May 7, 2001
    Date of Patent: August 24, 2004
    Assignee: Prisma Fibers, Inc.
    Inventors: Matthew B. Studholme, Arthur Roth, Jr., Brendan Francis McSheehy, Jr.
  • Patent number: 6780960
    Abstract: A method of making a solution of a polyimide from a diamine monomer and a dianhydride monomer is disclosed. A solution or slurry of one of the monomers in a solvent that boils at a temperature between about 80° C. and about 160° C. is prepared. The solution or slurry is heated to a temperature between about 80° C. and about 160° C. and the other monomer is slowly added to the solution or slurry. Polyamic acid that is formed quickly imidizes to form the polyimide.
    Type: Grant
    Filed: July 22, 2002
    Date of Patent: August 24, 2004
    Assignee: Sumitomo Bakelite Company Limited
    Inventors: Michael C. Hausladen, Jin-O Choi
  • Patent number: 6777526
    Abstract: A separating agent that serves as an optical resolution agent is composed of a novel, useful optically active polymer. The separating agent is obtained through anionic polymerization of a novel maleimide and serves to separate optically active compounds.
    Type: Grant
    Filed: August 23, 2002
    Date of Patent: August 17, 2004
    Assignee: Tosoh Corporation
    Inventors: Takumi Kagawa, Hideo Sakka
  • Patent number: 6777525
    Abstract: Polyimides having a desired combination of high thermo-oxidative stability, low moisture absorption and excellent chemical and corrosion resistance are prepared by reacting a mixture of compounds including (a) 3,3′,4,4′-benzophenonetetracarboxylic dianhydride (BTDA), (b) 3,4′-oxydianiline (3,4′-ODA), and (c) 5-norbornene-2,3-dicarboxylic anhydride (NA) in a high boiling, aprotic solvent to give 5 to 35% by weight of polyamic acid solution. The ratio of (a), (b), and (c) is selected to afford a family of polyimides having different molecular weights and properties. The mixture first forms a polyamic acid precursor. Upon heating at or above 300° C., the polyamic acids form polyimides, which are particularly suitable for use as a high temperature coating, adhesive, thin film, or composite matrix resin.
    Type: Grant
    Filed: April 1, 2002
    Date of Patent: August 17, 2004
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventor: Ruth H. Pater
  • Patent number: 6774207
    Abstract: The present invention relates to polyaspartate mixtures containing a) 5 to 70 equiv. %, based on the total equivalents of aspartate groups, of a cyclic polyaspartate corresponding to the formula wherein X1 represents the residue obtained by removing the amino groups from a cyclic polyamine having a functionality of n, R1 and R2 are identical or different and represent organic groups which are inert to isocyanate groups at a temperature of 100° C. or less, R3 and R4 are identical or different and represent hydrogen or organic groups which are inert towards isocyanate groups at a temperature of 100° C. or less and n is 2 to 4, and b) 30 to 95 equiv.
    Type: Grant
    Filed: September 26, 2002
    Date of Patent: August 10, 2004
    Assignees: Bayer Polymers LLC, Bayer Aktiengesellschaft
    Inventors: Karsten Danielmeier, Catherine M. Britsch, Rolf Gertzmann, Michele E. Vargo, Terrell Dean Wayt, Edward P. Squiller, Richard R. Roesler
  • Patent number: 6774206
    Abstract: The present invention relates to polyaspartates corresponding to the formula wherein X1 represents the residue obtained by removing the amino groups from a polyether polyamine having a functionality of n and a number average molecular weight of less than 600, wherein the amino groups are attached to primary carbon atoms and the ether groups are separated by at least two carbon atoms, R1 and R2 are identical or different and represent organic groups which are inert to isocyanate groups at a temperature of 100° C. or less, R3 and R4 are identical or different and represent hydrogen or organic groups which are inert towards isocyanate groups at a temperature of 100° C. or less and n is 2 to 4. The present invention also relates to polyureas prepared by reacting the polyaspartates and optionally other isocyanate-reactive compounds with polyisocyanates.
    Type: Grant
    Filed: September 26, 2002
    Date of Patent: August 10, 2004
    Assignees: Bayer Polymers LLC, Bayer Aktiengesellschaft
    Inventors: Karsten Danielmeier, Catherine M. Britsch, Rolf Gertzmann, Michele E. Vargo, Terrell D. Wayt, Edward P. Squiller
  • Patent number: 6774205
    Abstract: A process for the preparation of novel polyamides, the use of such polyamides for the production of fibers, sheets and moldings, and fibers, sheets and moldings obtainable from such polyamides, are provided.
    Type: Grant
    Filed: December 26, 2002
    Date of Patent: August 10, 2004
    Assignee: BASF Aktiengesellschaft
    Inventors: Paul-Michael Bever, Ulrike Breiner, Bernd-Steffen von Bernstorff, Gerhard Conzelmann
  • Patent number: 6770733
    Abstract: A film-formable polyimide copolymer, which comprises two kinds of tetracarboxylic acid dianhydride consisting of (A) pyromellitic acid dianhydride and (B) 3,3′,4,4′-benzophenonetetracarboxylic acid dianhydride, and (C) 6-amino-2-(p-aminophenyl)benzimidazole has a heat-resistant dimensional stability without any deterioration of mechanical properties inherent in the polyimide resin when used as a film.
    Type: Grant
    Filed: January 3, 2003
    Date of Patent: August 3, 2004
    Assignee: Nippon Mektron, Limited
    Inventors: Min Zuo, Jenq-Tain Lin
  • Patent number: 6767987
    Abstract: This invention provides a hydroxyalkyl(meth)acrylate composition modified by a small amount of lactones in which a proportion of monomers having two or more continuous chains of lactone is less than 50% (area % by GPC). This invention also provides methods for synthesizing such a composition. This invention also provides an acrylic polyol resin comprising the hydroxyalkyl(meth)acrylate composition, a carboxylic group-containing acrylate composition modified by a small amount of lactones, and a polyester unsaturated monomer modified by a small amount of lactones. Uses of these materials in curable resins, coating compositions, and finishing agents are also provided.
    Type: Grant
    Filed: October 12, 2001
    Date of Patent: July 27, 2004
    Assignee: Daicel Chemical Industries, Ltd.
    Inventor: Akira Okazaki
  • Patent number: 6767988
    Abstract: Polyamide elastomer comprising a hard segment derived from polyamide having no divalent aromatic group and a soft segment derived from polycarbonate diol having no divalent aromatic group has high flexibility and high heat resistance in addition to good physical characteristics of the known polyamide elastomers.
    Type: Grant
    Filed: April 23, 2002
    Date of Patent: July 27, 2004
    Assignee: UBE Industries, Ltd.
    Inventors: Hiroshi Okushita, Tadao Muramatsu
  • Patent number: 6765081
    Abstract: A thermal responsive, water soluble polymer. The polymer comprises the co-polymerization product of: (a) 5˜95 wt % of N-isopropyl acrylamide (NIP); (b) 0.1˜80 wt % of 1-vinyl-2-pyrrolidinone (VPD); and optionally, (c) 0.1˜30 wt % of acrylic acid (AA). As the proportion of component (b) VPD increases, the Lower Critical Solution Temperature (LCST) and water solubility of the polymer increases. On the other hand, as the proportion of component (c) AA increases, the Lower Critical Solution Temperature (LCST) decreases and the COOH reactive groups increases, which impart high reactivity to the copolymer. By adjusting the proportion of the monomers, a broad range of LCST can be manipulated from about 20 to 80° C.
    Type: Grant
    Filed: May 2, 2002
    Date of Patent: July 20, 2004
    Assignee: Industrial Technology Research Institute
    Inventors: Chih-Hsiang Lin, In-Mau Chen, Wen-Ling Lui
  • Patent number: 6762277
    Abstract: A method of manufacturing a new N-carboxyamino acid anhydride and polyamino acid using a simple process operation. The method for manufacturing N-carboxyamino acid anhydride comprising reacting &agr;-amino acid with di-tert-butyltricarbonate. The method for manufacturing polyamino acid comprising decarboxylating the N-carboxyamino acid anhydride obtained by reacting &agr;-amino acid with di-tert-butyltricarbonate.
    Type: Grant
    Filed: April 26, 2002
    Date of Patent: July 13, 2004
    Assignee: JSR Corporation
    Inventors: Hiroto Kudoh, Takeshi Endoh
  • Patent number: 6759505
    Abstract: There is provided a process for the continuous polymerization of polyamides which is carried out under conditions of pressure, temperature and polymer concentration in water that will ultimately yield multiple phases (including a second liquid polymer phase or a polymer precipitate). However, a single phase operation is achieved under these conditions by appropriate management of residence time and using a well-mixed reaction environment in early stages of the polymerization.
    Type: Grant
    Filed: September 28, 2001
    Date of Patent: July 6, 2004
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: Jocelyn Willis-Papi, Turget Mutel
  • Patent number: 6756472
    Abstract: A process for producing a biodegradable polymer having free carboxyl at the &ohgr;-end charcterized by polymerizing a cyclic ester compound in the presence of a hydroxymonocarboxylic acid derivative having protected carboxyl or a hydroxydicarboxylic acid derivative having protected carboxyl, and then deprotecting the thus obtained polymer having protected carboxyl at the &ohgr;-end. Use of the above process makes it easy to control the molecular weight of the target biodegradable polymer and the content of free carboxyl therein, thereby enabling the efficient production of a polymer having a high purity and being contaminated with littel catalyst remaining therein.
    Type: Grant
    Filed: June 12, 2001
    Date of Patent: June 29, 2004
    Assignee: Takeda Chemical Industries, Ltd.
    Inventors: Yoshio Hata, Yasutaka Igari
  • Patent number: 6756474
    Abstract: The present invention is generally directed to a polyaniline/high molecular weight polymeric sulfonic acid complex made by oxidative polymerization, and aqueous polyaniline dispersions, where the viscosity of the dispersion has been increased by the presence of the high molecular weight polymeric sulfonic acids during the polymerization process.
    Type: Grant
    Filed: January 23, 2002
    Date of Patent: June 29, 2004
    Assignee: E. I. du Pont de Nemours and Company
    Inventor: Che-Hsiung Hsu
  • Patent number: 6750312
    Abstract: A method for preparing a solid support material for carrying out a chemical reaction, said method comprising the following steps: (i) reacting an amino functionalised solid material with a carboxylic acid having at least two similarly protected amino groups to form amide bonds between them, (ii) removing protecting groups in a single step, (iii) optionally repeating steps (i) and (ii) one or more times using the product of the preceding step as the amino functionalised solid material, and (iv) connecting a linkage agent to at least some of the free NH2 groups of the product. The method increases the loading capacity of the solid support material. It is particularly useful in connection with peptide synthesis.
    Type: Grant
    Filed: March 26, 2002
    Date of Patent: June 15, 2004
    Assignee: Avecia Limited
    Inventors: Craig Stephen Harris, Donald Alfred Wellings, Francis Joseph Montgomery, Richard John Brown
  • Patent number: 6750320
    Abstract: A process for producing a polyimide platy object includes (a) providing a solution containing a solvent and a solute (i.e., a polyimide precursor or polyimide); (b) pouring the solution onto a supporting member; (c) removing a portion of the solvent from the solution at a first temperature lower than boiling point of the solvent, thereby forming a precursory platy object thereon, the precursory platy object having a self-supporting property and a first surface in contact with the supporting member and a second surface away therefrom and a first content of the solvent at the first surface and a second content (less than the first content by 2-10 wt %) of the solvent at the second surface; and (d) detaching the precursory platy object therefrom; and (e) heating the precursory platy object at a second temperature higher than boiling point of the solvent and is lower than decomposition temperature of the polyimide.
    Type: Grant
    Filed: February 20, 2002
    Date of Patent: June 15, 2004
    Assignee: Central Glass Company, Limited
    Inventors: Yoshihiro Moroi, Hidehisa Nanai, Yuji Yamamoto, Shigeki Sakaguchi
  • Patent number: 6750318
    Abstract: The polyamide resin of the present invention is produced by the polycondensation of a dicarboxylic acid component and a diamine component containing xylylenediamine and bisaminomethylcyclohexane in a total amount of 70 mol % or higher. The polyamide resin contains impurities having a boiling point of from 150 to 300° C. at ordinary pressure and a solubility parameter of from 8 to 16 in a total amount of 0.3% by weight or lower based on the weight of the polyamide resin. The polyamide resin is free from various inconveniences due to inclusion of the impurities, and suitably used in applications for molding materials, bottles, sheets, films and fibers.
    Type: Grant
    Filed: July 11, 2002
    Date of Patent: June 15, 2004
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Kazumi Tanaka, Takatoshi Shida, Hideyuki Kurose