Patents Examined by P. J. Ryan
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Patent number: 4793993Abstract: Keratinous material, such as human hair, in which disulfide linkages have been ruptured to form disulfide linkages can be set using diimidates, and disuccinimidyl compounds as disclosed herein.Type: GrantFiled: August 24, 1987Date of Patent: December 27, 1988Assignee: Chesebrough-Pond's Inc.Inventors: Patricia Siuta-Mangano, Herbert Edelstein
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Patent number: 4794049Abstract: An electrode supporting conduit tube for electrical heating of underground hydrocarbon resources comprises a metal conduit tube; and an insulative covering adhered on and around the outer peripheral surface of the metal conduit tube, the insulative covering being a laminated body of polyether/ether/ketone resin and glass fiber, which is obtained by confining both polyether/ether/ketone resin and glass fiber wound on and around the metal conduit tube within a metal mold and subjecting the laminated materials to shaping under heat and pressure at a heating temperature of from 350.degree. C. to 450.degree. C. and a pressure of from 10 to 200 kg/cm.sup.2.Type: GrantFiled: January 14, 1987Date of Patent: December 27, 1988Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Ichiro Takahashi, Goro Okamoto, Kazuo Okahashi
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Patent number: 4792500Abstract: A field electroluminescence element has a transparent electrode disposed to form a single-level plane with a substrate surface so that a luminescence layer is provided on the planar surface in order to prevent any irregular crystallization and to improve the reliability of the element.Type: GrantFiled: August 17, 1987Date of Patent: December 20, 1988Assignee: Clarion Co., Ltd.Inventor: Kiyoaki Kojima
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Patent number: 4791047Abstract: A color solid image pickup element is made up of a semiconductor element, and a color filter bonded through a buffer layer to the semiconductor element, so that, when the semiconductor element and the color filter are joined together, the semiconductor element may not be damaged by foreign matter such as shavings.Type: GrantFiled: August 7, 1987Date of Patent: December 13, 1988Assignee: Fuji Photo Film Co., Ltd.Inventors: Jin Murayama, Hiroshi Tamura, Yoshimitsu Kudoh
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Patent number: 4790989Abstract: Certain formulations of pseudomonic acids and their salts have good antifungal activity.Type: GrantFiled: April 10, 1987Date of Patent: December 13, 1988Assignee: Beecham Group p.l.c.Inventors: Pamela A. Hunter, Valerie Berry, Joshua Oduro-Yeboah, Norman A. Orr
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Patent number: 4790894Abstract: A base board having a plurality of semicircular through-holes filled with solder at side walls produced by filling through-holes with solder can be connected electrically to printed circuit boards with large connecting strength and high reliability.Type: GrantFiled: May 6, 1987Date of Patent: December 13, 1988Assignee: Hitachi Condenser Co., Ltd.Inventors: Masaji Homma, Hitoshi Yamauchi
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Patent number: 4788102Abstract: Data-carrying card comprising multiple layers which have been connected to each other with use of an adhesive and excluding the application of heat and pressure. In particular the invention relates to a card as described which incorporates an integrated electronic circuit. The invention also relates to a method for producing a card as described and to a device for carrying out said method.Type: GrantFiled: May 21, 1987Date of Patent: November 29, 1988Assignee: Papier-Plastic-Coating Groningen B.V.Inventors: Anthony A. Koning, Wim Dijkhuizen
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Patent number: 4786545Abstract: A circuit substrate for use in manufacturing integrated circuit devices by the strip-support method in connection with a semiconductor element having conductive pads. The circuit substrate includes a base layer, a conductive circuit layer supported on the base layer for mechanically and electrically coupling to the conductive pads of a semiconductor device. The conductive circuit layer includes a plurality of finger leads with a bump at the end of each finger lead for mechanically and electrically coupling to one of the conductive pads. The coupling surface of each bump has a roughness in a range between 5 and 20 microns. The inherent roughness of the bumps can be augmented by plating the bumps with nickel and gold. A method for forming bumps on the conductive layer of a circuit substrate for attachment of the circuit substrate to conductive pads of a semiconductor element is also provided. The method includes coating a front and a back surface of the conductive layer with photo-resists.Type: GrantFiled: February 24, 1987Date of Patent: November 22, 1988Assignee: Seiko Epson CorporationInventors: Kunio Sakuma, Sadasumi Uchiyama
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Patent number: 4786491Abstract: A method of adding a high intensity sweetener such as thaumatin, monellin and the like to chewing gum ingredients. The method comprises forming an emulsion comprising the high intensity sweetener, water, an emulsifier, and a hydrophobic ingredient which is preferably a flavor. Once formed, the emulsion is admixed with the chewing gum ingredients in any suitable manner.Type: GrantFiled: August 5, 1987Date of Patent: November 22, 1988Assignee: Wm. Wrigley Jr. CompanyInventor: Mansukh M. Patel
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Patent number: 4786537Abstract: A dry transfer article comprising an adhesive layer, a graphic pattern contained thereon, an actinic radiation-transmissive, ink-receptive layer between the adhesive layer and the graphic layer, and an application tape over the graphic pattern. The adhesive layer comprises an actinic radiation-responsive composition. Exposure of the article to actinic radiation selectively differentiates the adhesive potential between those portions of the adhesive layer underlying the graphic pattern and the exposed portions of the adhesive layer. After application of the article to a substrate, removal of the application tape causes selective removal of unwanted areas leaving desired graphic pattern on the substrate, i.e., the transfer article if self-weeding.Type: GrantFiled: October 30, 1986Date of Patent: November 22, 1988Assignee: Minnesota Mining and Manufacturing CompanyInventor: Makoto Sasaki
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Patent number: 4784842Abstract: Compositions of matter and method of use of compositions consisting essentially of a mixture, in effective amounts, of (a) a terpene or mixtures thereof, and (b) vitamin E. These compositions are used for treatment of cuts, burns and abrasions of the skin in mammals, particularly humans, to facilitate healing and reduce swelling, bleeding and pain, by applying the mixture to the affected external area of the skin, as by swabbing with an applicator. Alternatively, the treatment mixture can be pressurized by means of a carrier, such as ethylene chloride, for application by spraying.Type: GrantFiled: September 25, 1987Date of Patent: November 15, 1988Inventors: Jean London, James O. Gibson
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Patent number: 4784919Abstract: The present invention provides a transfer paper for imparting stereographic pattern produced by transferring the specified pattern printed on a synthetic sheet to a release layer surface of a release paper formed of a base member and the aforementioned release layer provided on the surface thereof and a manufacturing method of the transfer paper characterized in that a releasable thermoplastic resin is extruded between the base material and the sheet on which the specified pattern has been printed, thereby transferring the pattern on the aforementioned printed sheet to the surface of the aforementioned thermoplastic resin, followed by cooling, and then, said printed sheet is peeled off and separated from the surface of said thermoplastic resin. Thus this invention makes it possible to provide at low price and with ease a transfer paper for imparting stereographic perspective patterns having various grades of lusters and tones in combination.Type: GrantFiled: June 17, 1987Date of Patent: November 15, 1988Assignee: Goyo Paper Working, Ltd.Inventors: Isao Tokuno, Shuzo Ohara
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Patent number: 4784893Abstract: A heat conductive circuit board includes an insulating layer provided on a metal substrate, and an electrically conductive metal foil formed on the insulating layer, and the insulating layer is formed by impregnating an alumina paper with organic polymer. The alumina paper is made by subjecting a material containing alumina fiber as the principal components to a paper-making process. The insulating layer has excellent properties of heat transfer not only in the thickness direction but also in the surface direction, and thus, the heat conductive circuit board is excellent in heat dissipation properties.Type: GrantFiled: February 13, 1987Date of Patent: November 15, 1988Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Yoshio Nishimoto, Kiyoshi Hani, Shohei Etoh
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Patent number: 4783358Abstract: A ceramic wiring substrate has at least one layer of a signal line pattern, a ground electrode pattern layer, and a cavity formed by a region which covers part of or completely the signal line pattern inside ceramic between the signal line pattern and the ground electrode pattern.Type: GrantFiled: February 10, 1987Date of Patent: November 8, 1988Assignee: NEC CorporationInventors: Teruyuki Ikeda, Kazuaki Utsumi
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Patent number: 4783359Abstract: A preferably low dielectric constant polymeric bonding layer is applied or bonded (i.e., laminated or coated) to at least one side of a preferably low dielectric constant polymeric delay line substrate. Preferably, the melting or softening point of the bonding film is lower than the melting or softening point of the substrate so that the application (e.g. lamination) step is carried out at a temperature which is above the softening point of the bonding film, but below the softening point of the substrate (thereby insuring the integrity of the delay line circuit). Thereafter, the delay line/bonding layer assembly is rolled up and head sealed so as to melt the bonding layer, thus heat sealing the delay line package. As the package heats up (in, for example, a tightly fitting die), the materials expand and provide sufficient pressure to bond the circuit together.Type: GrantFiled: November 18, 1986Date of Patent: November 8, 1988Assignee: Rogers CorporationInventors: Cathy A. Fleischer, Richard T. Traskos
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Patent number: 4781970Abstract: Strengthened ceramic and a method for increasing the mechanical strength of fully sintered ceramic articles, in particular alumina type ceramic and glass-ceramic articles. Such articles are strengthened by forming a compresssive material layer of amorphous silicon dioxide or refractory metal nitride on the surface of the article to be strengthened.Type: GrantFiled: July 15, 1987Date of Patent: November 1, 1988Assignee: International Business Machines CorporationInventors: Steven G. Barbee, Hung-Chang Huang, Donald J. Hunt, Jungihl Kim, Jae M. Park, Charles H. Perry, Da-Yuan Shih
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Patent number: 4781918Abstract: An agent for treatment of hair and skin, containing a quarternary ammonium compound of the formula ##STR1## in which R.sub.1 and R.sub.2 may be identical or different and denote C.sub.8 -C.sub.22 -alkyl or C.sub.8 -C.sub.22 -alkenyl, R.sub.3 denotes C.sub.1 -C.sub.3 -alkyl, x denotes a number from 1 to 3, and A.sup..crclbar. denotes the anion of C.sub.2 -C.sub.6 -carboxylic acid, which may contain 1 to 3 hydroxyl groups, or the hydrogen phosphate anion.Type: GrantFiled: October 7, 1987Date of Patent: November 1, 1988Assignee: Hoechst AktiengesellschaftInventors: Manfred Hofinger, Alwin Reng, Jochen M. Quack
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Patent number: 4781968Abstract: A low dielectric constant material for use in the formation of thick film circuits such as VLSI devices. The material comprises a thick film insulation matrix of standard viscosity; a thick film organic vehicle; and a plurality of dry, hollow, glass microspheres. The insulation matrix, vehicle, and microspheres are thoroughly combined into a homogeneous material of standard viscosity.Type: GrantFiled: February 28, 1986Date of Patent: November 1, 1988Assignee: Digital Equipment CorporationInventor: David Kellerman
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Patent number: 4781969Abstract: A printed circuit board is provided wherein a composite metal layer is affixed to at least one surface of a flexible dielectric substrate, the composite metal layer comprising an inner aluminum layer and an outer copper layer. Owing to the relatively high elongation of the aluminum layer, when the printed circuit board is flexed the circuit thereon does not crack.Type: GrantFiled: September 29, 1987Date of Patent: November 1, 1988Assignee: Junkosha Co., Ltd.Inventors: Satoru Kobayashi, Tetsuya Hirose, Masahiro Suzuki
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Patent number: 4781960Abstract: The indicator light, preferably a LED, is mounted in a insulating housing secured by a pair of legs with relatively broad feet which are soldered to conductive pads on the surface of a printed circuit board. Preferably, the printed circuit board uses "surface mount" technology. The leads of the LED are spot welded to the legs to make electrical connections between the LED and the circuit board. The structure elevates the LED above the board surface, and/or allows mounting the LED close to the edge of the circuit board, and/or allows the light from the LED to be directed parallel to the board surface. A particularly advantageous use of the structure is one in which printed circuit boards are arranged in an array with the boards parallel to one another and the LED mounting structures near the end of each board so as to provide maximum visibility of the LEDs from many angles so as to quickly indicate equipment functional status to an operator or trouble-shooter.Type: GrantFiled: February 27, 1987Date of Patent: November 1, 1988Assignee: Industrial Devices, Inc.Inventor: James M. Wittes