Patents Examined by P. J. Ryan
  • Patent number: 4793993
    Abstract: Keratinous material, such as human hair, in which disulfide linkages have been ruptured to form disulfide linkages can be set using diimidates, and disuccinimidyl compounds as disclosed herein.
    Type: Grant
    Filed: August 24, 1987
    Date of Patent: December 27, 1988
    Assignee: Chesebrough-Pond's Inc.
    Inventors: Patricia Siuta-Mangano, Herbert Edelstein
  • Patent number: 4794049
    Abstract: An electrode supporting conduit tube for electrical heating of underground hydrocarbon resources comprises a metal conduit tube; and an insulative covering adhered on and around the outer peripheral surface of the metal conduit tube, the insulative covering being a laminated body of polyether/ether/ketone resin and glass fiber, which is obtained by confining both polyether/ether/ketone resin and glass fiber wound on and around the metal conduit tube within a metal mold and subjecting the laminated materials to shaping under heat and pressure at a heating temperature of from 350.degree. C. to 450.degree. C. and a pressure of from 10 to 200 kg/cm.sup.2.
    Type: Grant
    Filed: January 14, 1987
    Date of Patent: December 27, 1988
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Ichiro Takahashi, Goro Okamoto, Kazuo Okahashi
  • Patent number: 4792500
    Abstract: A field electroluminescence element has a transparent electrode disposed to form a single-level plane with a substrate surface so that a luminescence layer is provided on the planar surface in order to prevent any irregular crystallization and to improve the reliability of the element.
    Type: Grant
    Filed: August 17, 1987
    Date of Patent: December 20, 1988
    Assignee: Clarion Co., Ltd.
    Inventor: Kiyoaki Kojima
  • Patent number: 4791047
    Abstract: A color solid image pickup element is made up of a semiconductor element, and a color filter bonded through a buffer layer to the semiconductor element, so that, when the semiconductor element and the color filter are joined together, the semiconductor element may not be damaged by foreign matter such as shavings.
    Type: Grant
    Filed: August 7, 1987
    Date of Patent: December 13, 1988
    Assignee: Fuji Photo Film Co., Ltd.
    Inventors: Jin Murayama, Hiroshi Tamura, Yoshimitsu Kudoh
  • Patent number: 4790989
    Abstract: Certain formulations of pseudomonic acids and their salts have good antifungal activity.
    Type: Grant
    Filed: April 10, 1987
    Date of Patent: December 13, 1988
    Assignee: Beecham Group p.l.c.
    Inventors: Pamela A. Hunter, Valerie Berry, Joshua Oduro-Yeboah, Norman A. Orr
  • Patent number: 4790894
    Abstract: A base board having a plurality of semicircular through-holes filled with solder at side walls produced by filling through-holes with solder can be connected electrically to printed circuit boards with large connecting strength and high reliability.
    Type: Grant
    Filed: May 6, 1987
    Date of Patent: December 13, 1988
    Assignee: Hitachi Condenser Co., Ltd.
    Inventors: Masaji Homma, Hitoshi Yamauchi
  • Patent number: 4788102
    Abstract: Data-carrying card comprising multiple layers which have been connected to each other with use of an adhesive and excluding the application of heat and pressure. In particular the invention relates to a card as described which incorporates an integrated electronic circuit. The invention also relates to a method for producing a card as described and to a device for carrying out said method.
    Type: Grant
    Filed: May 21, 1987
    Date of Patent: November 29, 1988
    Assignee: Papier-Plastic-Coating Groningen B.V.
    Inventors: Anthony A. Koning, Wim Dijkhuizen
  • Patent number: 4786545
    Abstract: A circuit substrate for use in manufacturing integrated circuit devices by the strip-support method in connection with a semiconductor element having conductive pads. The circuit substrate includes a base layer, a conductive circuit layer supported on the base layer for mechanically and electrically coupling to the conductive pads of a semiconductor device. The conductive circuit layer includes a plurality of finger leads with a bump at the end of each finger lead for mechanically and electrically coupling to one of the conductive pads. The coupling surface of each bump has a roughness in a range between 5 and 20 microns. The inherent roughness of the bumps can be augmented by plating the bumps with nickel and gold. A method for forming bumps on the conductive layer of a circuit substrate for attachment of the circuit substrate to conductive pads of a semiconductor element is also provided. The method includes coating a front and a back surface of the conductive layer with photo-resists.
    Type: Grant
    Filed: February 24, 1987
    Date of Patent: November 22, 1988
    Assignee: Seiko Epson Corporation
    Inventors: Kunio Sakuma, Sadasumi Uchiyama
  • Patent number: 4786491
    Abstract: A method of adding a high intensity sweetener such as thaumatin, monellin and the like to chewing gum ingredients. The method comprises forming an emulsion comprising the high intensity sweetener, water, an emulsifier, and a hydrophobic ingredient which is preferably a flavor. Once formed, the emulsion is admixed with the chewing gum ingredients in any suitable manner.
    Type: Grant
    Filed: August 5, 1987
    Date of Patent: November 22, 1988
    Assignee: Wm. Wrigley Jr. Company
    Inventor: Mansukh M. Patel
  • Patent number: 4786537
    Abstract: A dry transfer article comprising an adhesive layer, a graphic pattern contained thereon, an actinic radiation-transmissive, ink-receptive layer between the adhesive layer and the graphic layer, and an application tape over the graphic pattern. The adhesive layer comprises an actinic radiation-responsive composition. Exposure of the article to actinic radiation selectively differentiates the adhesive potential between those portions of the adhesive layer underlying the graphic pattern and the exposed portions of the adhesive layer. After application of the article to a substrate, removal of the application tape causes selective removal of unwanted areas leaving desired graphic pattern on the substrate, i.e., the transfer article if self-weeding.
    Type: Grant
    Filed: October 30, 1986
    Date of Patent: November 22, 1988
    Assignee: Minnesota Mining and Manufacturing Company
    Inventor: Makoto Sasaki
  • Patent number: 4784842
    Abstract: Compositions of matter and method of use of compositions consisting essentially of a mixture, in effective amounts, of (a) a terpene or mixtures thereof, and (b) vitamin E. These compositions are used for treatment of cuts, burns and abrasions of the skin in mammals, particularly humans, to facilitate healing and reduce swelling, bleeding and pain, by applying the mixture to the affected external area of the skin, as by swabbing with an applicator. Alternatively, the treatment mixture can be pressurized by means of a carrier, such as ethylene chloride, for application by spraying.
    Type: Grant
    Filed: September 25, 1987
    Date of Patent: November 15, 1988
    Inventors: Jean London, James O. Gibson
  • Patent number: 4784919
    Abstract: The present invention provides a transfer paper for imparting stereographic pattern produced by transferring the specified pattern printed on a synthetic sheet to a release layer surface of a release paper formed of a base member and the aforementioned release layer provided on the surface thereof and a manufacturing method of the transfer paper characterized in that a releasable thermoplastic resin is extruded between the base material and the sheet on which the specified pattern has been printed, thereby transferring the pattern on the aforementioned printed sheet to the surface of the aforementioned thermoplastic resin, followed by cooling, and then, said printed sheet is peeled off and separated from the surface of said thermoplastic resin. Thus this invention makes it possible to provide at low price and with ease a transfer paper for imparting stereographic perspective patterns having various grades of lusters and tones in combination.
    Type: Grant
    Filed: June 17, 1987
    Date of Patent: November 15, 1988
    Assignee: Goyo Paper Working, Ltd.
    Inventors: Isao Tokuno, Shuzo Ohara
  • Patent number: 4784893
    Abstract: A heat conductive circuit board includes an insulating layer provided on a metal substrate, and an electrically conductive metal foil formed on the insulating layer, and the insulating layer is formed by impregnating an alumina paper with organic polymer. The alumina paper is made by subjecting a material containing alumina fiber as the principal components to a paper-making process. The insulating layer has excellent properties of heat transfer not only in the thickness direction but also in the surface direction, and thus, the heat conductive circuit board is excellent in heat dissipation properties.
    Type: Grant
    Filed: February 13, 1987
    Date of Patent: November 15, 1988
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Yoshio Nishimoto, Kiyoshi Hani, Shohei Etoh
  • Patent number: 4783358
    Abstract: A ceramic wiring substrate has at least one layer of a signal line pattern, a ground electrode pattern layer, and a cavity formed by a region which covers part of or completely the signal line pattern inside ceramic between the signal line pattern and the ground electrode pattern.
    Type: Grant
    Filed: February 10, 1987
    Date of Patent: November 8, 1988
    Assignee: NEC Corporation
    Inventors: Teruyuki Ikeda, Kazuaki Utsumi
  • Patent number: 4783359
    Abstract: A preferably low dielectric constant polymeric bonding layer is applied or bonded (i.e., laminated or coated) to at least one side of a preferably low dielectric constant polymeric delay line substrate. Preferably, the melting or softening point of the bonding film is lower than the melting or softening point of the substrate so that the application (e.g. lamination) step is carried out at a temperature which is above the softening point of the bonding film, but below the softening point of the substrate (thereby insuring the integrity of the delay line circuit). Thereafter, the delay line/bonding layer assembly is rolled up and head sealed so as to melt the bonding layer, thus heat sealing the delay line package. As the package heats up (in, for example, a tightly fitting die), the materials expand and provide sufficient pressure to bond the circuit together.
    Type: Grant
    Filed: November 18, 1986
    Date of Patent: November 8, 1988
    Assignee: Rogers Corporation
    Inventors: Cathy A. Fleischer, Richard T. Traskos
  • Patent number: 4781970
    Abstract: Strengthened ceramic and a method for increasing the mechanical strength of fully sintered ceramic articles, in particular alumina type ceramic and glass-ceramic articles. Such articles are strengthened by forming a compresssive material layer of amorphous silicon dioxide or refractory metal nitride on the surface of the article to be strengthened.
    Type: Grant
    Filed: July 15, 1987
    Date of Patent: November 1, 1988
    Assignee: International Business Machines Corporation
    Inventors: Steven G. Barbee, Hung-Chang Huang, Donald J. Hunt, Jungihl Kim, Jae M. Park, Charles H. Perry, Da-Yuan Shih
  • Patent number: 4781918
    Abstract: An agent for treatment of hair and skin, containing a quarternary ammonium compound of the formula ##STR1## in which R.sub.1 and R.sub.2 may be identical or different and denote C.sub.8 -C.sub.22 -alkyl or C.sub.8 -C.sub.22 -alkenyl, R.sub.3 denotes C.sub.1 -C.sub.3 -alkyl, x denotes a number from 1 to 3, and A.sup..crclbar. denotes the anion of C.sub.2 -C.sub.6 -carboxylic acid, which may contain 1 to 3 hydroxyl groups, or the hydrogen phosphate anion.
    Type: Grant
    Filed: October 7, 1987
    Date of Patent: November 1, 1988
    Assignee: Hoechst Aktiengesellschaft
    Inventors: Manfred Hofinger, Alwin Reng, Jochen M. Quack
  • Patent number: 4781968
    Abstract: A low dielectric constant material for use in the formation of thick film circuits such as VLSI devices. The material comprises a thick film insulation matrix of standard viscosity; a thick film organic vehicle; and a plurality of dry, hollow, glass microspheres. The insulation matrix, vehicle, and microspheres are thoroughly combined into a homogeneous material of standard viscosity.
    Type: Grant
    Filed: February 28, 1986
    Date of Patent: November 1, 1988
    Assignee: Digital Equipment Corporation
    Inventor: David Kellerman
  • Patent number: 4781969
    Abstract: A printed circuit board is provided wherein a composite metal layer is affixed to at least one surface of a flexible dielectric substrate, the composite metal layer comprising an inner aluminum layer and an outer copper layer. Owing to the relatively high elongation of the aluminum layer, when the printed circuit board is flexed the circuit thereon does not crack.
    Type: Grant
    Filed: September 29, 1987
    Date of Patent: November 1, 1988
    Assignee: Junkosha Co., Ltd.
    Inventors: Satoru Kobayashi, Tetsuya Hirose, Masahiro Suzuki
  • Patent number: 4781960
    Abstract: The indicator light, preferably a LED, is mounted in a insulating housing secured by a pair of legs with relatively broad feet which are soldered to conductive pads on the surface of a printed circuit board. Preferably, the printed circuit board uses "surface mount" technology. The leads of the LED are spot welded to the legs to make electrical connections between the LED and the circuit board. The structure elevates the LED above the board surface, and/or allows mounting the LED close to the edge of the circuit board, and/or allows the light from the LED to be directed parallel to the board surface. A particularly advantageous use of the structure is one in which printed circuit boards are arranged in an array with the boards parallel to one another and the LED mounting structures near the end of each board so as to provide maximum visibility of the LEDs from many angles so as to quickly indicate equipment functional status to an operator or trouble-shooter.
    Type: Grant
    Filed: February 27, 1987
    Date of Patent: November 1, 1988
    Assignee: Industrial Devices, Inc.
    Inventor: James M. Wittes