Abstract: A display panel comprising a structural layer of rigid material having a plurality of holes extending therethrough, a plurality of laminate sections fastened to the structural layer in parallel relationship, a fastening material fastened to the structural layer in an area between the laminate sections, and an attachment cleat affixed to the side of the structural layer opposite the laminate section. The fastening material is a VELCRO-type material that covers a linear array of holes in the structural layer. The structural layer is a sheet of pegboard material. The laminate sections extend longitudinally across the surface of the structural layer. The attachment cleat is fixedly attached to the side of the structural layer opposite the laminate sections. The attachment cleat has an angle cut along its lower edge for engaging a complementary angle cut in a support structure.

Abstract: A procedure for preparing a palatable aerosol foam of unpleasant edible oil containing up to 80% oil is disclosed. This has been achieved by incorporating an inorganic complexing agent, water, a sweetening agent, a sensory masking agent and a propellant present in an amount sufficient by itself to function as the whipping agent and propellant into the oil to form a pleasant tasting suspension without an oily mouthfeel, unpalatable taste and unpleasant odor. Each teaspoon of aerosol foam will contain from about 2 to 4 grams of oil.

Abstract: An electrophotographic image transfer paper for a copier including a fixing operation, comprises a sheet of raw paper, and a receiving layer on the paper for reducing blistering of the sheet during fixing of an image on the sheet, the receiving layer including a coating on at least one side of the sheet, having a center-line-average surface roughness not more than 2.0 micrometer and an air permeability less than or equal to 4,000 seconds.

Abstract: A process of forming on a substrate a copper coating which has excellent mechanical properties, comprising depositing copper on the substrate by chemical plating, and forming at least one silver-rich layer during the deposition of copper, each silver-rich layer has a higher content of silver than the other portion of the copper coating. Also disclosed is a process of producing a printed-wiring board by forming such a copper coating.

Abstract: A breathable polyolefin film is prepared by melt embossing a highly filled polyolefin film to impose a pattern of different film thickness therein and by stretching the melt embossed film to impart greater permeability in the areas of reduced thickness in comparison to the areas of greater thickness.

Abstract: A composition for a ceramic substrate comprising from 30 to 70% by weight of glass powder, from 28 to 70% by weight of refractory filler powder and an oxidizing agent, said glass powder consisting essentially of from 38 to 48% by weight of SiO.sub.2, from 1 to 8% by weight of Al.sub.2 O.sub.3, from 0 to 10% by weight of MgO, from 18 to 28% by weight of BaO, from 1 to 8% by weight of CaO, from 0 to 15% by weight of SrO, from 0.5 to 15% by weight of B.sub.2 O.sub.3, from 0 to 20% by weight of PbO, from 10 to 20% by weight of ZnO, from 0 to 7% by weight of TiO.sub.2 plus ZrO.sub.2 and from 0 to 5% by weight of Li.sub.2 O plus Na.sub.2 O plus K.sub.2 O, and said refractory filler powder comprising from 20 to 60% by weight of alumina, from 0 to 40% by weight of zircon, from 0 to 30% by weight of cordierite and from 0 to 30% by weight of forsterite.

Abstract: A covering member of keyboard prepared by separately fixing the push button elements to a base plate instead of integral molding is disclosed in which the plate has openings arranged conforming to the pattern of the fixed contact points on the circuit board. Fixing is carried out by using a silicone rubber-based adhesive or a pressure-sensitive adhesive optionally with the aid of tailing of protrusions on the base plate into the cavity of the base of the push button elements. A method of using unit bodies carrying push button elements is alternatively used. A base plate having openings arranged in the pattern corresponding to the fixed contact points is also disclosed for use in fixing the push button elements.

Abstract: A multilayer printed circuit board which reliably and economically marries conventional copper clad printed circuit board technology with polymeric conductors and insulators. Reliability is enhanced by forming all solder pads of copper, providing conductive tails on solder pads which are to be connected by polymeric inks, and ultimately forming a solder resist over all but the solder pads. As a result, polymer inks can be applied to both sides of the board, and the completed board can be subject to conventional solder dipping or wave soldering operations. According to one feature of the invention, a thin dielectric layer can be applied as intermediate to planar conductive layers which form a power plane having built-in distributed capacitance for decoupling.

Abstract: This invention is particularly directed to the preparation of inorganic ceramic laminated structures for use as substrates in integrated circuit packages. One lamina is composed of a high thermal conductivity material, the second lamina is composed of a low thermal conductivity material having a dielectric constant below 10, a sintering temperature below 1050.degree. C., and a linear coefficient of thermal expansion compatible with that of the other lamina, and a bonding medium sealing the two laminae together exhibiting flow at a temperature below the sintering temperature of the second lamina and a linear coefficient of thermal expansion compatible with those of the two laminae.

Abstract: A molded extensible-collapsible container having a series of flutes, in the generic sense, in its side to permit the container when subjected to an external force to move to a collapsed position or to the extended position when preferably the yield point of the plastic is no greater than about 5% and it has an ASTM modulus of elasticity greater than about (6.895.times.10.sup.8 pascals) and less than about (2.758.times.10.sup.9 pascals) and preferably about (1.034.times.10.sup.9 pascals to 2.069.times.10.sup.9 pascals). The plastic of the blow molded container can be a blow moldable polyester of less than 5% elongation at yield with polyethylene terephthalate being most preferred.

Abstract: A low cost thermoplastic material having a low heat distortion (HDT) thermoplastic material forms the main structural component of a structural member. A relatively high cost high HDT thermoplastic material is attached to the low cost main structural component and is plated with a solderable metallic coating. The coating can be attached to other structures with relatively higher temperature molten solder with negligible distortion. The structural member may be, for example, an electrical shield to be soldered to a printed circuit board or a printed circuit board whose core is low HDT material and exterior is high HDT material.

Abstract: A pattern of conductive material is formed on a substrate of dielectric material. The substrate comprises a layer of flexible dielectric material having a layer of dimensionally-stable material adhered to one main face. The pattern is formed on the opposite main face of the layer of flexible dielectric material.

Abstract: A printed wiring board comprising a plastic material is formed with a through opening for mounting electronic parts therein, and the end of the opening on the rear side of the board is closed by a metal sheet bonded to the area around the opening end on the rear of the board through an adhesive layer. The inside wall and bottom face of the opening in the board are coated with an integral plating film as are the rear surfaces of the board an metal sheet. According to this board structure, the heat generated from electronic parts mounted on the bottom of the opening is dispersed by the metal sheet, and also penetration of moisture into the opening through the plastic material and the adhesive layer, as occurs with conventional boards, is prevented by the plating film.

Abstract: The device comprises a mounting frame adapted to receive and support the hybrid circuit and a pair of wing frames, one at each end of the thin frame for supporting it at a predetermined angle in relation to the printed circuit board. The wing frames may be angled outwardly away from the mounting frame thereby allowing a plurality of the devices to be nestled adjacent one another in close proximity.