Abstract: Apparatus, systems, and methods are disclosed that operate to boost an electrical potential of a control terminal of a transistor from a signal on an input terminal of the transistor to render a channel in the transistor more conductive. Additional apparatus, systems, and methods are disclosed.

Abstract: An electrostatic chuck for retaining a substrate. The chuck has a clamping surface for receiving the substrate, where the clamping surface is formed of a hard polymeric material filled with carbon nanotubes. Electrodes are disposed beneath the clamping surface, for inducing localized electrostatic charges in the substrate and thereby retaining the substrate against the clamping surface. A base supports the clamping surface and the electrodes.

Abstract: A superconducting magnet assembly comprises a superconducting magnet which, under working conditions, generates a magnetic field in a working volume. The superconducting magnet is connected in parallel with a series combination of a superconducting fault current limiter and a resistor, and with a DC power source. Under working conditions, the magnet can be energized by the power source to generate a desired magnetic field in the working volume.

Abstract: A control unit has a closed-loop controller which is connected to a regulating electrovalve by way of a feedback branch, forming a closed-loop control circuit, in order to regulate the electrical coil current of the regulating electrovalve. The armature of the electrovalve is used to adjust a desired volume flow in a motor vehicle hydraulic device. The armature of the regulating electrovalve is continuously subjected to an armature oscillation in order to reduce the static friction and/or magnetic hysteresis. Inside the closed-loop controller of the closed-loop control circuit itself, the nominal current, which is supplied to the closed-loop controller on the input side as a command variable, is subjected to a dither signal generated inside the closed-loop controller for producing the armature oscillation, essentially synchronously to the clock cycle of the closed-loop controller.

Abstract: The present invention is disclosed by that the power source device is operatively controlled by the switching device to supply AC power to excite the driving coil thereby producing larger electromagnetic effect to obtain actuating force, and after actuation, the power source device being operatively controlled by the switching device is switched to provide DC power output of lower voltage to the driving coil thereby passing smaller current to maintain excitation while required operating characteristics of the electromagnetic actuating device are still ensured.

Abstract: A device for grounding electrical components arranged in a chain has a grounding point at ground potential and an actuation device connected to the grounding point for connecting the electrical components to the grounding point. In order to provide such a device, with which a simple, safe, and durable grounding is obtained, the actuation device is constructed as a moving part extending in a longitudinal direction and movable in a longitudinal direction. The moving part has an electrically conducting grounding section connected to the grounding point and an electrically nonconducting insulating section arranged on the end of the moving part facing away from the grounding point.

Abstract: To provide a semiconductor integrated circuit including: a detection circuit that detects an occurrence of latch up and can be configured while adopting a layout configuration that suppresses the occurrence of latch up; and a recovery unit that enables a recovery from the latch up without cutting off a positive potential. The semiconductor integrated circuit includes: a n-channel MOS transistor 7 that is formed on a P-type region 3 on a semiconductor substrate; and a latch up detection circuit that detects an occurrence of latch up in the n-channel MOS transistor 7. The latch up detection circuit includes: a n-MOS transistor structure 12 in which a source 10 and a back gate 8 are connected in common with a source 5 and the back gate 8 of the n-channel MOS transistor 7; and an electric current detection unit 15 that detects an electric current flowing to a drain 9 of the n-MOS transistor structure 12.

Abstract: An ionizer includes a fan for blowing air, the fan being provided in an air blowing port which opens in a case, and a plurality of discharge electrodes for generating positive and negative ions by corona discharge, the discharge electrodes being provided in the case at positions facing the air blowing port. The ionizer also includes a plurality of discharge electrode pairs each constituted by two discharge electrodes for generating ions of different polarities. When a tip-center distance denotes a distance from the electrode tip to the center of the air blowing port, the tip-center distances of the two discharge electrodes in the discharge electrode pairs are different from each other.

Abstract: An electronic system can include a switch and a regulator coupled to the switch. The switch can be used to deliver electricity from a first terminal to a second terminal. The switch can also be used to prevent the second terminal from having a level that is higher than a predefined operation level limit by controlling the status of the switch according to a supply signal at the first terminal. The regulator can be used to adjust a regulated signal at the second terminal according to the supply signal.

Abstract: Aspects of a method and system for mitigating risk of electrostatic discharge in a system on chip are provided. In this regard, for an IC comprising a plurality of portions electrically isolated from one another within the IC, ESD current may be routed via one or more paths within and/or on a package to which the IC is bonded. The one or more paths may electrically couple two or more of the portions of the IC. The one or more paths may have low impedance at DC and high impedance at one or more frequencies utilized in the integrated circuit. One of the portions of the IC may be a ground plane for RF circuitry. One of the portions of the IC may be a ground plane for digital circuitry. The one or more paths may be fabricated in one or more metal layers of said package.

Abstract: There is provided a static eliminator capable of improving a sheath effect exerted by shielding a leading end of a discharge electrode by a clean gas so as to prevent the leading end of the discharge electrode from being contaminated, in which a first-stage circumferential chamber, a second-stage circumferential chamber and a first gas pool are arrayed in series along the longitudinal direction of a discharge electrode, the first gas pool is disposed in the mode of diametrically overlapping a gas outflow channel for shielding located on the inner circumferential side of the first gas pool, and a clean gas is supplied to the first gas pool through the chambers disposed at multi-stages by means of the circumferentially spaced multi-stage orifices (the first and second chases).

Abstract: A method and apparatus for moving magnetic material includes an electromagnet for lifting the magnetic material where upon its release, the residual magnetic flux of the lifted magnetic material is reduced. The apparatus includes a generator coupled to the electromagnet. The generator includes a control input and an armature having a voltage output. A controller has an output coupled to the generator's control input and armature voltage output, whereupon receiving a release material signal from an operator interface panel to release the magnetic material from the electromagnet, the controller transmits a plurality of control signals, one of which is at least partially dependent upon the duration of a previously transmitted control signal, to effectively alternate the polarity and reduce the magnitude of the magnetizing force of the electromagnet.

Abstract: There is provided an apparatus including: an electrostatic chuck for holding an object; and a base plate which supports the electrostatic chuck and controls a temperature of the electrostatic chuck. The electrostatic chuck is fixed onto the base plate via an adhesive layer. The electrostatic chuck includes: a base; an electrostatic electrode built in the base; and a mounting portion containing a dielectric material and detachably mounted on the base. The object is mounted on the mounting portion.

Abstract: A semiconductor device for ESD protection includes a semiconductor substrate of a first conductivity type and a well region of a second conductivity type formed within the substrate. The well region is characterized by a first depth. The device includes an MOS transistor, a first bipolar transistor, and a second bipolar transistor. The MOS transistor includes a first lightly doped drain (LDD) region of a second depth within the well region, and a drain region and an emitter region within in the first LDD region. The emitter region is characterized by a second conductivity type. The first bipolar transistor is associated with the emitter region, the first LDD region, and the well region, and is characterized by a first trigger voltage. The second bipolar transistor is associated with the first LDD region, the well region, and the substrate, and is characterized by a second trigger voltage.

Abstract: A gate driver 28 performs a normal charging operation for a power MOSFET 14 by driving a charge pump 90 solely, when a low-level control signal S1 (ON signal) is received during a normal state. On the other hand, if a low-level control signal S1 (ON signal) is received during a load anomaly state, an urgent charge FET 92, as well as the charge pump 90, is turned on when a load current IL exceeds a second anomaly threshold current ILfc, so that a rapid charging operation is performed.

Abstract: A power circuit includes a gate drive sever comparator circuit operable to disconnect a pre-drive transistor circuit from ground in response to an over voltage fault condition. A back-up gate drive comparator circuit operable to switch a reference directly into a multiple of shunt MosFets such that the multiple of shunt MosFets are turned on to reverse the over voltage fault condition until voltage drops and the gate drive sever comparator circuit and the back-up gate drive comparator circuit turn off to maintain a regulated voltage between comparator controlled limits.

Abstract: A programmable fuse and fuse panel are described. Unlike conventional fuses and fuse panels, the trip values of the fuses of the panel—i.e., the current values at which the fuse trips—are field programmable. One of many advantages includes the ability to adaptively set the trip value of a fuse—depending on the operating needs of a load device—without having to physically exchange the fuse. In an embodiment, electronic fuses are used.

Abstract: Circuit and method for RC power clamp triggered dual SCR ESD protection. In an integrated circuit, a protected pad is coupled to an upper SCR circuit and a lower SCR circuit; and both are coupled to the RC power clamp circuit, which is coupled between the positive voltage supply and the ground voltage supply. A structure for ESD protection is disclosed having a first well of a first conductivity type adjacent to a second well of a second conductivity type, the boundary forming a p-n junction, and a pad contact diffusion region in each well electrically coupled to a pad terminal; additional diffusions are provided proximate to and electrically isolated from the pad contact diffusion regions, the diffusion regions and first and second wells form two SCR devices. These SCR devices are triggered, during an ESD event, by current injected into the respective wells by an RC power clamp circuit.

Abstract: An air terminal/point base has an air terminal/point plate with upper and lower surfaces and apertures. The upper surface has an upstanding cylinder with a threaded aperture. An air terminal/point has a threaded base coupled to the threaded aperture. A conductive cable couples the air terminal/point to a ground. A patch of roofing material having upper and lower surfaces is in a configuration corresponding to the air terminal/point plate. The patch has a plurality of apertures in axial alignment with the apertures of the air terminal/point plate. A rivet extends through the apertures of the air terminal/point plate and each patch coupling the lower surface of the air terminal/point plate to the upper surface of an associated patch. The method includes the step of cohering the patch to the material through the application of pressure applied for 3 to 5 seconds and heat at a temperature of 122 degrees Fahrenheit.

Abstract: A DC/AC inverter substrate includes a voltage abnormality detector circuit. All of a high voltage side detection sensor, a low voltage side detection sensor, and a high-voltage and low-voltage detection sensor in the voltage abnormality detector circuit are disposed without being electrically connected to a secondary side of a transformer or to a connection point. Those detection sensors are not damaged since overvoltage is not applied to the voltage abnormality detector circuit when abnormal discharge occurs because the detection sensors are not electrically connected.