Patents Examined by Paul D Kim
  • Patent number: 11043324
    Abstract: A method for manufacturing a magnetic core of an electric vehicle motor comprises: providing an electrical steel sheet and a release film; a heating step which heats the electrical steel sheet; an adhering step which adheres the release film to the heated electrical steel sheet; a removing step which removes the release film to leave the glue layer on the electrical steel sheet; a stacking step; a repeating step which repeats the heating step, the adhering step, the removing step and the stacking step to form a multi-layer structure having the electrical steel sheets and the glue layers interleaved stacked; and a solidifying step which heats the multi-layer structure to solidify the glue layers. Through the above steps, the thickness of the glue layer in the magnetic core would be uniform.
    Type: Grant
    Filed: February 14, 2020
    Date of Patent: June 22, 2021
    Assignee: MENG SIN MATERIAL CO., LTD
    Inventor: Meng-Tsung Kao
  • Patent number: 11040191
    Abstract: The invention concerns a method of forming a medical device, the method comprising: forming a graphene film (100) over a substrate (204); depositing, by gas phase deposition, a polymer material covering a surface of the graphene film (100); and removing the substrate (204) from the graphene film (100), wherein the polymer material forms a support (102) for the graphene film (100).
    Type: Grant
    Filed: March 9, 2016
    Date of Patent: June 22, 2021
    Assignees: Centre National de la Recherche Scientifique, UNIVERSITE GRENOBLE ALPES
    Inventors: Dipankar Kalita, Vincent Bouchiat, Laetitia Marty, Nedjma Bendiab
  • Patent number: 11039558
    Abstract: An optimization processing computer, before production starts, sends a production job on which optimization processing was performed but is incomplete to each component mounter, causes an automatic exchanging device to operate so as to change the feeder arrangement of each component mounter to a feeder arrangement specified in the production job, then causes each component mounter to operate so as to start production. After production is started, optimization processing on the production job is continued by the optimization processing computer, and during production, an updated production job for which optimization has progressed is acquired from the optimization processing computer so as to update the production job being executed by each component mounter, then the automatic exchanging device is operated so as to change the feeder arrangement of each component mounter to a feeder arrangement specified in the production job, then production continues.
    Type: Grant
    Filed: November 9, 2016
    Date of Patent: June 15, 2021
    Assignee: FUJI CORPORATION
    Inventor: Yusuke Yamakage
  • Patent number: 11037726
    Abstract: A magnetic core includes a winding core and first and second flanges connected to the winding core. First and second terminal electrodes are connected to a lead frame. The first flange is bonded to the first and second terminal electrodes. Third and fourth terminal electrodes are bonded to the second flange. First and second insulation-coated conductive wires are wound about the winding core. The first and second insulation-coated conductive wires are connected to the first and second terminal electrodes and the third and fourth terminal electrodes. The lead frame is bent so as to rotate the magnetic core by 90 degrees with respect to the lead frame. A magnetic plate is bonded to the magnetic core. The magnetic core is removed from the lead frame by removing the first and second terminal electrodes from the lead frame, thereby providing a common-mode choke coil. The common-mode choke coil having stable electrical performance is produced efficiently by the above method.
    Type: Grant
    Filed: November 8, 2017
    Date of Patent: June 15, 2021
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Yuji Yasuoka, Tomohiro Fujita, Takeyuki Fujii, Toru Inoue, Chikara Nara, Makoto Itou
  • Patent number: 11033192
    Abstract: A pressure sensor is provided that comprises an upper wafer formed from a dielectric material, the upper wafer having channels. The upper wafer includes a first capacitor plate and a second capacitor plate formed on a lower surface of the upper wafer. An inductor is contained within the channels in the upper wafer in fixed relation to the first and second capacitor plates. A lower wafer is formed from the dielectric material. A third capacitor plate is formed on an inner surface of the lower wafer. The upper and lower wafers are fused together to form a monolithic housing such that the first and second capacitor plates are arranged in parallel, spaced-apart relation from the third capacitor plate. The lower wafer comprising a pressure sensitive deflective region underlying the third capacitor plate. The deflective region deflects in response to changes in ambient pressure in the medium.
    Type: Grant
    Filed: November 16, 2018
    Date of Patent: June 15, 2021
    Assignee: ST. JUDE MEDICAL LUXEMBOURG HOLDINGS II S.A.R.L. (“SJM LUX 11”)
    Inventors: Florent Cros, David O'Brien, Michael Fonseca, Matthew Abercrombie, Jin Woo Park, Angad Singh
  • Patent number: 11031179
    Abstract: Precision fabrication of 3D objects is used for fabricating passive electrical components. A 3D scaffold is fabricated and then electrically conductive and/or insulating layers are deposited on the scaffold to form the electrical component.
    Type: Grant
    Filed: September 2, 2015
    Date of Patent: June 8, 2021
    Assignee: The Board of Trustees of the Leland Stanford Junior University
    Inventors: Juan M. Rivas Davila, Wei Liang, Luke C. Raymond
  • Patent number: 11032960
    Abstract: A feeder includes a feeder main body, a tape guide provided in feeder main body, a tape separating device to separate cover tape covering component storage sections, a tape conveyance path between the feeder main body and the tape guide and having recessed groove through which the component storage sections of the embossed carrier tape can be inserted, and a pressing device disposed in the recessed groove of the tape conveyance path to press the embossed carrier tape in a direction in which the embossed carrier tape is brought into abutment with the tape guide. The pressing device is positioned at both sides of the component storage sections in a width direction in of the recessed groove and presses flange sections of the embossed carrier tape without pressing the component storage sections.
    Type: Grant
    Filed: July 6, 2016
    Date of Patent: June 8, 2021
    Assignee: FUJI CORPORATION
    Inventors: Hiroyasu Ohashi, Hiroki Murase
  • Patent number: 11031195
    Abstract: An electronic device such as a cover for a portable device or other electronic equipment may have circuitry mounted in a housing. The housing may be formed from layers of material such as fabric and polymer layers. The circuitry of the electronic device may include components mounted on a printed circuit. The components may include movable components such as keys in a keyboard. A fabric layer may overlap the keys. Border regions of the fabric layer that surround each key may be characterized by a stiffness. To ensure that the keys or other movable components in the device exhibit satisfactory stiffness levels, the keys can be tested and selected border regions or other fabric layer portions may be laser ablated or otherwise processed to locally reduce fabric layer stiffness.
    Type: Grant
    Filed: May 15, 2018
    Date of Patent: June 8, 2021
    Assignee: Apple Inc.
    Inventors: Paul X. Wang, Joel N. Ruscher, Christopher T. Lebedeff, Sean Murphy, Melody Kuna
  • Patent number: 11022525
    Abstract: A system for monitoring a crack in a structural member includes a first fixable component having a first plate defining a top surface and a bottom surface. The first plate is at least partially transparent in at least a first area thereof, and the first fixable component further includes a mounting surface disposed away from the bottom surface of the plate. The system also includes a second fixable component having a second plate defining a top surface and a bottom surface defining a mounting area thereon. A distance between the mounting surface and the bottom surface of the first plate is greater than a thickness of the second plate defined between the top and bottom surfaces thereof. A measurement array and a pair of orthogonal crosshairs are disposed on respective ones of the first plate within the at least partially transparent area and the second plate.
    Type: Grant
    Filed: December 11, 2018
    Date of Patent: June 1, 2021
    Inventor: Gregory E. Lowitz
  • Patent number: 11022769
    Abstract: The present invention relates to a pre-terminated (pre-terminated) optical fibre cable assembly (10,90), which is configured to be installed through a duct (20). The pre-terminated optical fibre construction (10,90) includes at least one optical fibre (46). A protective sleeve (26) is added to the optical fibre (46) before adding a terminal connector (24) to the leading end of at least one optical fibre (46). The protective sleeve (26) extends from behind the terminal connector (24) along part of the length of the optical fibre (46). When the cable is installed through a duct, the protective sleeve protects the portion of the fibre that protrudes from the end of the duct, for example in a communications cabinet (16). A residual length (28) of the protective sleeve remains within the duct. Terminal connectors and protective sleeves can be applied at both ends of the cable assembly, or only one end.
    Type: Grant
    Filed: February 7, 2018
    Date of Patent: June 1, 2021
    Assignee: EMTELLE UK LIMITED
    Inventor: Eben Colin Kirkpatrick
  • Patent number: 11024796
    Abstract: Provided are an ultrasonic probe and a method of manufacturing the same. The method includes: forming a plurality of grooves by removing regions of a first insulating layer and a first silicon wafer from a first substrate including the first silicon wafer and the first insulating layer; bonding a second substrate including a second silicon wafer, a second insulating layer, and a silicon thin layer to the first substrate, such that the plurality of grooves turn into a plurality of cavities; removing the second silicon wafer from the second substrate; forming transducer cells on regions of the second insulating layer corresponding to the plurality of cavities; and forming a plurality of unit substrates by cutting the first substrate, the silicon thin layer, and the second insulating layer.
    Type: Grant
    Filed: January 4, 2018
    Date of Patent: June 1, 2021
    Assignee: SAMSUNG MEDISON CO., LTD.
    Inventors: Young-il Kim, Jong-keun Song, Tae-ho Jeon, Min-seog Choi
  • Patent number: 11020285
    Abstract: A clip-on module having a specialized housing design, probe contacts, switches, various advertising modes, and various configurations of signal repeaters is disclosed. The module is utilized via attachment to a specialized garment worn by a human patient. To properly apply the housing to the garment, a user will squeeze the module to open using tactile features embedded within the housing, locate the module, and then press-clamp the module to close and attach it. A plurality of probe contacts within the module have sharpness requirements for penetrating one or more layers of the garment while still maintaining low resistance, and will work with a backing material for probe.
    Type: Grant
    Filed: November 13, 2020
    Date of Patent: June 1, 2021
    Assignee: BioLink Systems, LLC
    Inventors: Roger King, Doug Jackson, John Naber, Jason Heyl
  • Patent number: 11017950
    Abstract: A ceramic electronic component includes a ceramic body, an inner electrode, an outer electrode, and a connecting portion. The inner electrode is disposed inside the ceramic body. The end portion of the inner electrode extends to a surface of the ceramic body. The outer electrode is disposed on the surface of the ceramic body so as to cover the end portion of the inner electrode. The outer electrode includes a resin and a metal. The connecting portion is disposed so as to extend from an inside of the outer electrode to an inside of the ceramic body. In a portion of the surface of the ceramic body on which the outer electrode is disposed, the length of the connecting portion that extends in a direction in which the inner electrode is extends about 2.4 ?m or more.
    Type: Grant
    Filed: September 22, 2016
    Date of Patent: May 25, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kota Zenzai, Hisayoshi Omori, Takashi Kanayama, Kiyoyasu Sakurada, Naoki Shimizu, Seiji Katsuta, Shinji Otani
  • Patent number: 11011296
    Abstract: A surface mounted inductor is equipped with a coil formed by winding a conductive wire, and a formed body in which the coil is sealed with a sealing material that mainly contains metal magnetic powder and a resin. The coil is embedded so that surfaces of lead-out ends are exposed on surfaces of the formed body. The resin at portions of surfaces of the formed body where external terminals are formed is removed, and the metal magnetic powder and a plating layer forming the external terminals are joined to each other, thereby connecting the external terminals and the lead-out ends of the coil.
    Type: Grant
    Filed: March 1, 2017
    Date of Patent: May 18, 2021
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Keita Muneuchi
  • Patent number: 11005084
    Abstract: A method for manufacturing display apparatus comprises: forming a display panel by forming a plurality of display elements on a substrate having flexibility; providing a holding member at a part of or the entire of an outer edge of the display panel along the outer edge, the holding member engaging with an outer periphery of the display panel; preparing a supporting member having a surface on which the substrate of the display panel is to be placed; placing the substrate on the surface of the supporting member; bonding the holding member to the surface of the supporting member; and bringing the substrate into close contact with the surface of the supporting member at a strength lower than a bonding strength between the holding member and the surface of the supporting member.
    Type: Grant
    Filed: April 14, 2020
    Date of Patent: May 11, 2021
    Assignee: SAKAI DISPLAY PRODUCTS CORPORATION
    Inventor: Katsuhiko Kishimoto
  • Patent number: 10998120
    Abstract: Devices and methods including a though-hole inductor for an electronic package are shown herein. Examples of the through-hole inductor include a substrate including at least one substrate layer. Each substrate layer including a dielectric layer having a first surface and a second surface. An aperture included in the dielectric layer is located from the first surface to the second surface. The aperture includes an aperture wall from the first surface to the second surface. A conductive layer is deposited on the first surface, second surface, and the aperture wall. At least one coil is cut from the conductive layer and located on the aperture wall.
    Type: Grant
    Filed: October 17, 2018
    Date of Patent: May 4, 2021
    Assignee: Intel Corporation
    Inventors: William J. Lambert, Mihir K Roy, Mathew J Manusharow, Yikang Deng
  • Patent number: 10998129
    Abstract: A method for manufacturing a laminated coil component including an element and a conductor configuring a coil in the element includes a step of forming a conductor pattern including a configuration material of the conductor on a first base material by a photolithography method, a step of forming an element pattern including a configuration material of the element on a second base material by a photolithography method, the element pattern being formed such that a shape corresponding to a shape of the conductor pattern has been removed, a step of laminating the conductor pattern and the element pattern in a predetermined direction by repeatedly transferring the conductor pattern and the element pattern onto a support, and a step of performing thermal treatment for a laminate obtained by the step of laminating.
    Type: Grant
    Filed: February 13, 2018
    Date of Patent: May 4, 2021
    Assignee: TDK CORPORATION
    Inventors: Yuya Ishima, Shinichi Kondo, Shunji Aoki, Yasushi Matsuyama, Yusuke Onezawa, Hajime Azuma
  • Patent number: 10992209
    Abstract: A locator-equipped clamp jig capable of suppressing interference between base sections of segments when clamped by the clamp jig, a stator manufacturing device, and a method for manufacturing a stator. The locator-equipped clamp jig has a locator that is provided to part of a main clamp body on a stator core side and has a plurality of protrusions arranged on an upper surface of an electrical conductor that is adjacent, in the radial direction of the stator core, to an electrical conductor being clamped by the main clamp body, the width of the protrusions in the radial direction of the stator core being at least the width of one of the electrical conductors.
    Type: Grant
    Filed: March 17, 2017
    Date of Patent: April 27, 2021
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Kenichiro Murata, Kazuhito Hiraga, Takeshi Yanagisawa, Akifumi Sudo
  • Patent number: 10993355
    Abstract: A ground strap for grounding electrical cables for protection against at least one of EMI, RFI or ESD and method of construction thereof is provided. The ground strap has a wall with opposite edges extending along a lengthwise direction between opposite ends. The wall is formed from a plurality of interlaced filaments, with at least some of the plurality of interlaced filaments including a plurality of electrically conductive filaments interlaced in electrical communication with one another.
    Type: Grant
    Filed: December 13, 2017
    Date of Patent: April 27, 2021
    Assignee: Federal-Mogul Powertrain LLC
    Inventors: Julien Deltor, Melanie Veronneau, Amelie Simoens, Patrick Thomas, Gaylord Etrillard
  • Patent number: 10991503
    Abstract: An inductor is laid out on a multi-layer structure, the inductor having a multi-turn coil including a plurality of metal traces laid out on at least two metal layers and a plurality of vias configured to provide inter-layer connection, wherein the multi-turn coil includes a first half configured to conduct a current flow between a first end and a center tap and a second half configured to conduct a current flow between a second end and the center tap; and an additional metal laid out on a metal layer below a lowest metal layer of the multi-turn coil, wherein the additional metal is laid out beneath the first half if the second half has a greater parasitic capacitance, or alternatively beneath the second half if the first half has a greater parasitic capacitance.
    Type: Grant
    Filed: July 24, 2018
    Date of Patent: April 27, 2021
    Assignee: REALTEK SEMICONDUCTOR CORP.
    Inventor: Chia-Liang (Leon) Lin