Abstract: There is described a method for assembling or repairing a connectorized electrical equipment in an environment. The method comprises connecting an Automated Test Equipment (ATE) to an origin connector of the connectorized electrical equipment to be assembled or repaired, for tracking connections. A connection between the origin connector and a destination electrical component is identified using the ATE and sent to a computing device. The computing device compares the connection identified by the ATE with a connectivity list required for the connectorized electrical equipment to determine a next step of the assembling or the repairing which depends on the connection identified by the ATE. A visual aid representative of the next step is generated and outputted to an apparatus which provides, to a user, the visual aid superimposed with the environment or in a virtual environment. A plurality of workers can receive a personalized visual aid on their own apparatus.

Abstract: A wire harness assembly system is disclosed. The wire harness assembly system includes a grid tile designed to receive repositionable accessories to route wires along the grid tile. The grid tile includes a plurality of keyed holes extending from the top of the grid tile, through the grid tile, to the bottom of the grid tile. The grid tile also includes a locking surface on the bottom of the grid tile. The locking surface complements the plurality of keyed holes to receive the repositionable accessory and to maintain the repositionable accessory in a locked position.

Abstract: A process for constructing a high-tensile strength, high-gradient insulator (HGI) may include stacking alternating layers of conductors and insulators, and vacuum pressure potting the stacked layers onto an insulating rod. The process may also include post machining the stacked layers to form a complete assembly of the HGI.

Abstract: A method for fabricating a magnetic material stack on a substrate, comprises forming a first dielectric layer, forming a first magnetic material layer on the first dielectric layer, forming at least a second dielectric layer on the first magnetic material layer and forming at least a second magnetic material layer on the second dielectric layer. During one or more of the forming steps, a surface smoothing operation is performed to remove at least a portion of surface roughness on the layer being formed.

Abstract: Provided is a method of manufacturing an oscillator, including: arranging an electrode on a piezoelectric ceramics free from being subjected to polarization treatment, to thereby provide a piezoelectric element; bonding the piezoelectric element and a diaphragm to each other at a temperature T1; bonding the piezoelectric element and a power supply member to each other at a temperature T2; and subjecting the piezoelectric ceramics to polarization treatment at a temperature T3, in which the temperature T1, the temperature T2, and the temperature T3 satisfy a relationship T1>T3 and a relationship T2>T3.

Abstract: An assembly device for assembling a screw into a locking hole of a circuit board includes an assembled board and a guiding sleeve. The assembled board is configured to press against a circuit board. The guiding sleeve is movably arranged in the assembled board. A vertical channel is formed in an interior of the guiding sleeve. When the assembled board presses against the circuit board, one end of the guiding sleeve abuts against the circuit board, and the vertical channel is opposite to the screw hole on the circuit board. The screw is accurately assembled into the screw hole of the circuit board, thereby improving assembly efficiency.

Abstract: A system and method are provided to deploy an implant assembly in a vessel. The implant assembly comprises a pressure sensor having a body, and first and second anchoring members coupled to the body of the pressure sensor. A delivery apparatus comprises a shaft having proximal and distal ends, the shaft including a main lumen and a secondary lumen, the main lumen extending along at least a portion of the shaft. The secondary lumen extends along at least a portion of the length of the shaft, the secondary lumen joined with first and second ports provided in a sidewall of the shaft. A tether wire is configured to be slidably positioned within the secondary lumen, the tether wire having a distal portion configured to secure the implant assembly against the sidewall.

Abstract: A rigid-flex PCB includes an array of rigid PCB “islands” interconnected by a flexible PCB formed into flexible connectors. The conductive and insulating layers of the flexible PCB extend into the rigid PCBs, giving the electrical connections to the rigid PCBs added resistance to breakage as the rigid-flex PCB is repeatedly stressed by bending and twisting forces. In addition, the durability of the rigid-flex PCB is enhanced by making the power and signal lines driving the rigid PCBs redundant so that a breakage of a line will not necessarily affect the operation of the rigid PCB to which it is attached. The rigid-flex PCB is particularly applicable to light pads used in phototherapy, wherein LEDs mounted on the rigid-PCBs are powered and controlled through the redundant lines in the flexible PCB.

Abstract: A method for manufacturing an electro-filter for separating a mixture of gas and oil drops including: at least one body including at least one oil/gas separation chamber, at least one emitter electrode, and at least one collector electrode made of an electrically-conductive plastic material. The manufacturing method includes at least the following steps: implementation of a first injection cycle having at least one step of injecting the collector electrode, implementation of an overmolding cycle having at least the following steps: displacement of the injected collector electrode into a second cavity of the same mold or into the cavity of another mold, overmolding at least the oil/gas separation chamber of the body at least on the collector electrode, with an electrically-insulating plastic material.

Abstract: A cable core for a cable, in particular, for an induction cable that includes multiple such cable cores which have a conductor that is interrupted in the longitudinal direction at specified longitudinal positions at multiple separation points, thereby forming two conductor ends. An insulating intermediate piece is provided for connecting the conductor ends, and the conductor ends are arranged on both sides of the intermediate piece. The conductor and the intermediate piece are surrounded together by a continuous insulating jacket in order to form the cable core. In a preferred concept, a respective intermediate piece is arranged between the two conductor ends by two adapter elements. In another preferred concept, a respective intermediate piece, in particular, a ceramic intermediate piece, is connected directly to two conductor ends. A cable is formed from a plurality of such cable cores.

Abstract: A clip-on module having a specialized housing design, probe contacts, switches, various advertising modes, and various configurations of signal repeaters is disclosed. The module is utilized via attachment to a specialized garment worn by a human patient. To properly apply the housing to the garment, a user will squeeze the module to open using tactile features embedded within the housing, locate the module, and then press-clamp the module to close and attach it. A plurality of probe contacts within the module have sharpness requirements for penetrating one or more layers of the garment while still maintaining low resistance, and will work with a backing material for probe.

Abstract: Embodiments of the invention are directed to a method of fabricating a yoke arrangement of an inductor. A non-limiting example method includes forming a dielectric layer across from a major surface of a substrate. The method further includes configuring the dielectric layer such that it imparts a predetermined dielectric layer compressive stress on the substrate. A magnetic stack is formed on an opposite side of the dielectric layer from the substrate, wherein the magnetic stack includes one or more magnetic layers alternating with one or more insulating layers. The method further includes configuring the magnetic stack such that it imparts a predetermined magnetic stack tensile stress on the dielectric layer, wherein a net effect of the predetermined dielectric layer compressive stress and the predetermined magnetic stack tensile stress on the substrate is insufficient to cause a portion of the major surface of the substrate to be substantially non-planar.

Abstract: Cantilever probes are produced for use in a test apparatus of integrated electronic circuits. The probes are configured to contact corresponding terminals of the electronic circuits to be tested during a test operation. The probe bodies are formed of electrically conductive materials. On a lower portion of each probe body that, in use, is directed to the respective terminal to be contacted, an electrically conductive contact region is formed having a first hardness value equal to or greater than 300 HV; each contact region and the respective probe body form the corresponding probe.

Abstract: A method for producing a printed circuit board structure comprising at least one insulation layer, at least one conductor layer, and at least one embedded component having a contact pad that has an outer barrier layer, in which structure at least two conductor paths/conductor layer are connected to at least two connections using vias, and each via runs from a conductor path/conductor layer directly to the barrier contact layer of the corresponding connection of the component.

Abstract: A method of manufacture for an acoustic resonator or filter device. In an example, the present method can include forming metal electrodes with different geometric areas and profile shapes coupled to a piezoelectric layer overlying a substrate. These metal electrodes can also be formed within cavities of the piezoelectric layer or the substrate with varying geometric areas. Combined with specific dimensional ratios and ion implantations, such techniques can increase device performance metrics. In an example, the present method can include forming various types of perimeter structures surrounding the metal electrodes, which can be on top or bottom of the piezoelectric layer. These perimeter structures can use various combinations of modifications to shape, material, and continuity. These perimeter structures can also be combined with sandbar structures, piezoelectric layer cavities, the geometric variations previously discussed to improve device performance metrics.

Abstract: A coil-integrated-type yoke for realizing a deflector that can accurately deflect an orbit of an electron beam and a manufacturing method thereof are provided. There is provided a manufacturing method of a coil-integrated-type yoke, the manufacturing method including: a step of sequentially inserting a molding agent, a coil, and a spacer into a groove heading from a first surface toward a second surface of the yoke; and a step of polishing the first surface of the yoke and the spacer together.

Abstract: A housing assembly is adapted for housing fully pre-wired printed circuit boards populated with diverse electrical components. The housing assembly includes multiple nipples and an optimized geometry for mounting to or mounting within commonly available conduit-related fixtures in a variety of installation configurations. These installation configurations allow for simpler wire routing where voltage separation is required, for greater accessibility to gang junction box cover plates on gang junction boxes to which the housing assembly is mounted, and for more installation options for wide range of common gang junction boxes as compared to existing housings.

Abstract: Embodiments of the invention include a dye and pry process for removing a surface mount technology (SMT) dual in-line memory module (DIMM) from card assemblies. Aspects of the invention include immersing a semiconductor package assembly in a solution comprising dye and placing the immersed semiconductor package assembly under vacuum pressure. Vacuum conditions ensure that the dye solution is pulled into any cracks in the solder formed between the semiconductor package assembly and the SMT DIMM. The package assembly is dried, and a dummy card stock is installed in the SMT DIMM using an epoxy. The SMT DIMM is then removed by applying a force to an exposed cavity between the dummy card stock and the semiconductor package assembly. The semiconductor package assembly and the SMT DIMM can then be inspected for the dye to locate cracks.

Abstract: A mandrel formed of urethane is inserted into a hollow shaft and is compressed axially by a die and a pad. The shaft is then fit in a shaft through hole of a rotor core. Thereafter, compression of the mandrel is released or reduced, and the mandrel is removed from the shaft. Thus, in fitting the hollow shaft in the shaft through hole of the rotor core, deformation of the shaft is reduced.

Abstract: A connector device having a multiple of connector connection terminals of differing connector frontage forms is such that when there is a change in a disposition of a connector frontage, or when using a different connector connection terminal, there is a need to newly prepare a molding die for the whole device. Because of this, the invention includes a first step of fabricating an integrally molded article including a connector connection terminal, forming a connector housing by integrating a multiple of integrally molded articles fabricated in the first step, and forming a connector frontage corresponding to each integrally molded article.