Patents Examined by Paul D Kim
  • Patent number: 11283231
    Abstract: A clamping module is adapted to clamp a memory module and insert or remove the memory module into/from a slot. The clamping module includes a main body, two jaw clamps and a blocking pressing plate. The two jaw clamps are movably disposed on the main body and adapted to move in relative to each other to clamp or release the memory module. The blocking pressing plate is movably disposed on the main body, wherein after the two jaw clamps clamp the memory module to a position in contact with the slot, the two jaw clamps moves away from each other so that the memory module is released and the blocking pressing plate moves from a first position to a second position in order to press the memory module so that the memory module is inserted into the slot.
    Type: Grant
    Filed: August 13, 2019
    Date of Patent: March 22, 2022
    Assignee: GIGA-BYTE TECHNOLOGY CO., LTD.
    Inventors: Hsing-Feng Tsai, Yen-Yun Chang, Tsung-Ta Wu
  • Patent number: 11282631
    Abstract: A magnetic core is situated in a cavity routed into an insulating substrate. The cavity and magnetic core are coved with a first insulating layer. Through holes are then formed through the first insulating layer and the insulating substrate, and plated to form conductive vias. Metallic traces are added to the exterior surfaces of the first insulating layer and the insulating substrate to form upper and lower winding layers. The metallic traces and conductive vias define the respective primary and secondary side windings for an embedded transformer. At least a second set of the outer conductive vias, are spaced farther from the cavity than a first set, and have greater via hole diameter than the vias in the first set. This reduces the resistance of the windings for a given substrate size and improves the performance of the device.
    Type: Grant
    Filed: July 3, 2019
    Date of Patent: March 22, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Lee Francis
  • Patent number: 11272647
    Abstract: A work machine and a mounting method by which end portions of a wire member can be mounted on connecting sections which are arranged variously are provided. A work head includes a first holding section configured to hold a first end portion and a second holding section configured to hold a second end portion. A control device includes a first mounting section configured to mount the first end portion held by the first holding section on a first connecting section, a moving section configured to cause a work head moving device to move the work head in accordance with a position of the second connecting section after having mounted the first end portion on the first connecting section, and a second mounting section configured to mount the second end portion held by the second holding section on a second connecting section.
    Type: Grant
    Filed: November 14, 2017
    Date of Patent: March 8, 2022
    Assignee: FUJI CORPORATION
    Inventor: Takaji Mukohara
  • Patent number: 11272621
    Abstract: A method for fabricating a flexible electronic device, including the steps of: providing channels on a rigid substrate; adhering a flexible substrate to the rigid substrate with an adhesive; fabricating an electronic device on the flexible substrate; injecting a chemical substance into the channels; and reacting the chemical substance with the adhesive and peeling the flexible substrate from the rigid substrate. The rigid substrate comprises a first surface, a second surface opposite the first surface, and a side wall extending between the first surface and the second surface. The channels are provided on the first surface of the rigid substrate. The channels are in communication with an injection port, the injection port is located on the side wall of the rigid substrate, and a portion of the side wall is located between the injection port and the first surface.
    Type: Grant
    Filed: February 22, 2019
    Date of Patent: March 8, 2022
    Assignee: SHENZHEN ROYOLE TECHNOLOGIES CO., LTD.
    Inventors: Zihong Liu, Xiaojun Yu, Peng Wei
  • Patent number: 11259416
    Abstract: A fitting element includes a first fitting section for connection with a spacer element, and a second arresting section for arresting with a circuit board. A central section is arranged between the fitting section and the arresting section and serves for forming a first stop for the spacer element, and a second stop for the circuit board. The fitting element is connected with an associated spacer element for forming a fitting device. The spacer element is fitted to a first circuit board. A second circuit board is then arrested with the fitting element. In this way two circuit boards can be connected with each other in a simple, flexible and automated way.
    Type: Grant
    Filed: September 20, 2019
    Date of Patent: February 22, 2022
    Assignee: Würth Elektronik eiSos GmbH & Co. KG
    Inventors: Micha Brodbeck, Stefan Klingler, Daniel Kübler
  • Patent number: 11251687
    Abstract: A coil segment forming apparatus includes a second bending section for bending a first bent body consisting of a pair of slot insertion portions that are substantially parallel to each other and a linking portion for connecting the pair of slot insertion portions formed in the same plane. The bending of the first bent body is carried out in a plane perpendicular to the aforementioned same plane. The second bending section has a plurality of pairs of press jigs arranged to oppose to each other in directions intersecting with the aforementioned same plane for pinching and pressing the linking portion, and a plurality of drive mechanisms for moving respectively the plurality of pairs of press jigs in directions intersecting with the aforementioned same plane based on moving amounts respectively set depending on forming conditions of the coil segment to be formed.
    Type: Grant
    Filed: December 11, 2018
    Date of Patent: February 15, 2022
    Assignee: ODAWARA ENGINEERING CO., LTD.
    Inventors: Hisayoshi Watanabe, Noburo Miyawaki, Yuji Miyazaki
  • Patent number: 11239028
    Abstract: An apparatus for manufacturing a heat sealing-type rotational laminated core, includes an upper mold and a lower mold, and forming and stacking individual laminar members, the individual laminar members being formed by having a strip which is sequentially transferred on the upper portion of the lower mold undergone a piercing process and a blanking process by punches mounted on the upper mold.
    Type: Grant
    Filed: May 17, 2017
    Date of Patent: February 1, 2022
    Assignee: BMC CO., LTD.
    Inventor: In Gyu Jung
  • Patent number: 11229148
    Abstract: A component mounting machine that performs mounting of components by moving a mounting head attached to slide using linear motor, stator of the linear motor that is forms of magnets arranged side by side is arranged on base, movable element is fixed to a slide so as to pass through the stator, and bracket for holding a portion of wires for supplying power to the linear motor and wire protector is fixed to the movable element. Since the bracket is located at a position close to the axis line of the movable element, the rotational moment acting on the slide due to the deformation resistance of the wires and the wire protector caused by the movement of the slide is reduced, and appropriate movement of the slide is ensured.
    Type: Grant
    Filed: July 18, 2017
    Date of Patent: January 18, 2022
    Assignee: FUJI CORPORATION
    Inventors: Yusuke Yamakage, Yoji Fujita
  • Patent number: 11223259
    Abstract: To effectively cover a coil end with a resin layer. A method for manufacturing a stator includes a first resin layer forming step (ii) of forming a first thermoset resin layer by impregnating the tip end side of a coil end with first thermoset resin, the coil end protruding from the core of the stator, the first thermoset resin having liquidity; a second resin layer forming step (iii) of forming a second thermoset resin layer on the first thermoset resin layer by dropping second thermoset resin from the core side of the coil end toward the tip end side; and a curing step of curing the first thermoset resin and the second thermoset resin.
    Type: Grant
    Filed: November 15, 2018
    Date of Patent: January 11, 2022
    Assignees: TOYOTA JIDOSHA KABUSHIKI KAISHA, DENSO CORPORATION
    Inventors: Masashi Kawai, Yasushi Nishikuma, Hiroaki Takeda
  • Patent number: 11222742
    Abstract: Embodiments are directed to a method of forming a laminated magnetic inductor and resulting structures having anisotropic magnetic layers. A first magnetic stack is formed having one or more magnetic layers alternating with one or more insulating layers. A trench is formed in the first magnetic stack oriented such that an axis of the trench is perpendicular to a hard axis of the magnetic inductor. The trench is filled with a dielectric material.
    Type: Grant
    Filed: October 3, 2019
    Date of Patent: January 11, 2022
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Hariklia Deligianni, Bruce B. Doris, Eugene J. O'Sullivan, Naigang Wang
  • Patent number: 11222746
    Abstract: A planar magnetic structure includes a closed loop structure having a plurality of core segments divided into at least two sets. A coil is formed about one or more core segments. A first antiferromagnetic layer is formed on a first set of core segments, and a second antiferromagnetic layer is formed on a second set of core segments. The first and second antiferromagnetic layers include different blocking temperatures and have an easy axis pinning a magnetic moment in two different directions, wherein when current flows through the coil, the magnetic moments rotate to form a closed magnetic loop in the closed loop structure.
    Type: Grant
    Filed: October 28, 2019
    Date of Patent: January 11, 2022
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Guohan Hu, Naigang Wang
  • Patent number: 11213678
    Abstract: Catheter apparatuses, systems, and methods for achieving neuromodulation by intravascular access are disclosed herein. One aspect of the present technology, for example, is directed to a treatment device having a therapeutic assembly that includes an elongated tubular shaft having a pre-formed spiral shape when in a deployed state (e.g., a radially expanded, generally spiral/helical shape) and a thermocouple assembly helically wrapped about the shaft. In one embodiment, the thermocouple assembly comprises first and second wires composed of dissimilar metals with the first wire including a plurality of exposed and insulated regions along the distal portion of the treatment device. The exposed regions of the first wire define a plurality of energy delivery portions positioned to deliver electrical energy (e.g., RF energy, pulsed energy, etc.) to target tissue adjacent a wall of an artery (e.g., a renal artery) to heat or otherwise electrically modulate neural fibers that contribute to physiological function (e.
    Type: Grant
    Filed: March 1, 2019
    Date of Patent: January 4, 2022
    Assignee: MEDTRONIC ARDIAN LUXEMBOURG S.A.R.L.
    Inventors: Roman Turovskiy, Maria Veronica Larios
  • Patent number: 11219147
    Abstract: Systems, apparatus, methods, and techniques of assembly of discrete modules of a control panel are disclosed. The modules can be independently wired, tested, and installed into a control panel. Module definitions are defined specifying components to perform the electrical function, a mechanical arrangement of the components, electrical connections, and logical interactions of the module. A bill of materials can be generated based on a designation of a set of modules for a control panel and the module definitions. Modularly assembled control panels are disclosed. An assembly frame is described herein for temporarily mounting components of a module for independent assembly of a control module and for eventual removal and installation into a control panel frame. The assembly frame may include a faceplate frame and side frames and temporary mounting features.
    Type: Grant
    Filed: February 25, 2021
    Date of Patent: January 4, 2022
    Assignee: Schweitzer Engineering Laboratories, Inc.
    Inventors: Michael Barber, Julian M. Alzate, Robert I. Jayne
  • Patent number: 11219146
    Abstract: An adjustment jig for performing position alignment of nozzle holders, including: multiple positioning pins including a primary insertion section configured such that multiple nozzle holders of a primary side device are insertable into the primary insertion section and a secondary insertion section configured such that multiple nozzle holders of a secondary side device are insertable into the secondary insertion section; and a board member configured such that the multiple positioning pins protruding to an opposite side to the primary insertion section and the secondary insertion section can be attached at a specified fixing position via a fixing section, a position of which is adjustable.
    Type: Grant
    Filed: July 12, 2017
    Date of Patent: January 4, 2022
    Assignee: FUJI CORPORATION
    Inventors: Masaki Murai, Toshihiko Yamasaki
  • Patent number: 11207219
    Abstract: A clip-on module having a specialized housing design, probe contacts, switches, various advertising modes, and various configurations of signal repeaters is disclosed. The module is utilized via attachment to a specialized garment worn by a human patient. To properly apply the housing to the garment, a user will squeeze the module to open using tactile features embedded within the housing, locate the module, and then press-clamp the module to close and attach it. A plurality of probe contacts within the module have sharpness requirements for penetrating one or more layers of the garment while still maintaining low resistance, and will work with a backing material for probe.
    Type: Grant
    Filed: April 30, 2021
    Date of Patent: December 28, 2021
    Assignee: BioLink Systems, LLC
    Inventors: Roger King, Doug Jackson, John Naber, Jason Heyl
  • Patent number: 11212935
    Abstract: Mechanisms are provided for cabling a set of enclosures. Using a set of cables that comprises eight physical layers (PHYs), the set of enclosures are coupled together such that: for a first enclosure and each intermediate enclosure in the set of enclosures, at least four PHYs of the eight PHYs terminate within a Serial Attached Small Computer System Interface (SCSI) (SAS) expander of the first enclosure and a SAS expander of each intermediate enclosure white passing through a remaining four PHYs of the eight PHYs without connecting to the respective SAS expander; and, for a last enclosure in the set of enclosures, all of the eight PHYs terminate in the SAS expander of the last enclosure.
    Type: Grant
    Filed: January 17, 2020
    Date of Patent: December 28, 2021
    Assignee: International Business Machines Corporation
    Inventors: Daniel S. Critchley, Gordon D. Hutchison, Gareth P. Jones, Jonathan W. L. Short
  • Patent number: 11205882
    Abstract: A crimping module suited to a crimping hand tool is provided. The crimping module includes a base adapted to be moved along an axis, an adjustment member rotatably disposed at the base along the axis, and a crimping member movably assembled to the base along the axis. The crimping member penetrates and is screwed with the adjustment member. The adjustment member is adapted to be rotated about the axis to drive the crimping member to move along the axis, so as to adjust a position of the crimping member in the crimping hand tool. After a cable and a connector are received in the crimping hand tool, the crimping hand tool is adapted to drive the base by a force and crimp the cable and the connector together via the crimping member.
    Type: Grant
    Filed: December 11, 2018
    Date of Patent: December 21, 2021
    Assignee: JETOOL CORP.
    Inventor: Kai-Yen Lin
  • Patent number: 11205353
    Abstract: There is described a method for assembling or repairing a connectorized electrical equipment in an environment. The method comprises connecting an Automated Test Equipment (ATE) to an origin connector of the connectorized electrical equipment to be assembled or repaired, for tracking connections. A connection between the origin connector and a destination electrical component is identified using the ATE and sent to a computing device. The computing device compares the connection identified by the ATE with a connectivity list required for the connectorized electrical equipment to determine a next step of the assembling or the repairing which depends on the connection identified by the ATE. A visual aid representative of the next step is generated and outputted to an apparatus which provides, to a user, the visual aid superimposed with the environment or in a virtual environment. A plurality of workers can receive a personalized visual aid on their own apparatus.
    Type: Grant
    Filed: December 4, 2018
    Date of Patent: December 21, 2021
    Assignee: Ziota Technology Inc.
    Inventor: Alain Lussier
  • Patent number: 11205528
    Abstract: A wire harness assembly system is disclosed. The wire harness assembly system includes a grid tile designed to receive repositionable accessories to route wires along the grid tile. The grid tile includes a plurality of keyed holes extending from the top of the grid tile, through the grid tile, to the bottom of the grid tile. The grid tile also includes a locking surface on the bottom of the grid tile. The locking surface complements the plurality of keyed holes to receive the repositionable accessory and to maintain the repositionable accessory in a locked position.
    Type: Grant
    Filed: April 4, 2019
    Date of Patent: December 21, 2021
    Assignee: Panduit Corp.
    Inventors: Rodney G. Rouleau, Janina B. Nebes, Robert W. Kossak
  • Patent number: 11205530
    Abstract: A process for constructing a high-tensile strength, high-gradient insulator (HGI) may include stacking alternating layers of conductors and insulators, and vacuum pressure potting the stacked layers onto an insulating rod. The process may also include post machining the stacked layers to form a complete assembly of the HGI.
    Type: Grant
    Filed: December 11, 2018
    Date of Patent: December 21, 2021
    Assignee: Triad National Security, LLC
    Inventors: Scott Avery Watson, Nicola Maree Winch, Eric Byron Sorensen, Lawrence Eugene Bronisz, David Platts, Michael L. Krogh, Marcelo Norona, Phillip A. Duran