Abstract: A computer chassis having tabs extending from the inside of its side panels and springs extending from the bottom panel, for spring-mounting a circuit board, such as a motherboard or other circuit board oriented parallel to the bottom surface of the chassis. The tabs and springs may also be used to ground the circuit board.

Abstract: A screwless technique for mounting a circuit board in a computer chassis is provided in which circular portions of keyhole-shaped mounting openings in the circuit board body are first moved downwardly over notched chassis mounting bosses. The circuit board is then forwardly moved transversely to the bosses to move opening edge portions of the circuit board body into the boss notches in a manner releasably preventing the circuit board from being lifted off the bosses. A retaining bracket is placed adjacent a body edge of the installed circuit board to block the board against rearward releasing movement relative to the chassis bosses.

Abstract: The invention relates to a holding device for sliding contacts. The holding devices so far known require a very high expenditure for mounting or alignment. A flexible printed circuit board with mechanically rigid carrier elements that permit the adaptation to the geometry of the slipring enables a simple and low-cost structure.

Abstract: The invention provides a wire and component management system in an enclosure having a plurality of rack mounted drawers each having an integral component board. Each component board is configured to have a plurality of mounting openings strategically positioned to allow components to be mounted thereto in various orientations. The component mounting board and drawer are movable within the rack so that they can be easily serviced. The component mounting board and drawer are hingably mounted to the rack by a hinged wire manager. The hinged wire manager is formed of two arms joined by a hinge pin. Each of the arms has wire management features and the wire managed therein is routed around the hinge pin in a loop to allow movement of the component mounting board and drawer in and out of the rack while managing a bundle of wires connected to components on the board.

Abstract: A circuit board standoff for use with SMT placement machinery is provided comprising a hollow substantially cylindrical member, a flange extending from a bottom section of the cylindrical member and an opening positioned in the top section of the substantially cylindrical member operable to receive a fastener. The circuit board standoff operates to provide physical connection between two circuit boards while maintaining a minimum distance there between for inclusion of any required electronic components.

Abstract: An electric connection box includes upper and lower cases which accommodate therein bus bars, an insulator for the bus bars, fuses, and first relays. A relay module mounted with second relays is accommodated in the upper and lower cases. The electric connection box includes the relay module, but is compact in size, light in weight, low-priced, and low in heat generation due to contact resistance.

Abstract: A memory card includes: a main body of the memory card in which a notched section is formed; a semiconductor memory; and a write/nonwrite setting element for setting the write/nonwrite state of data in the semiconductor memory, the write/nonwrite setting element being slidably fitted in the notched section, wherein the main body of the memory card includes an upper main body and a lower main body; at least one of the upper main body and the lower main body has an elastic guide formed within the notched section; the write/nonwrite setting element slides along the elastic guide so as to set the write/nonwrite state of the data in the semiconductor memory; and the elastic guide has an engagement portion for engagedly stopping the write/nonwrite setting element so as to select the position of the write/nonwrite setting element with respect to the elastic guide.

Abstract: A dummy module is inserted into an open slot in a modular rack to provide a cover for that slot. The dummy module is formed of the same housing as an operational module and contains a similar PCB as an operational module, without all the electrical and electronic components mounted thereon that an operational module would have. The PCB may have no components and no electrical tracks thereon, or it may be provided with some limited functionality. The PCB may have a memory device, such as an Electrically Erasable Programmable Read only Memory (EEPROM) mounted thereon, with at least an electrical track leading thereto from the connector block to enable a rack controller to interrogate the EEPROM. Thus, the rack controller would receive a positive identification from the EEPROM that the particular slot is empty, rather than simply trying to interrogate the slot and receiving no answer whatsoever.

Abstract: An electronic component module includes: printed-circuit boards on which a shield layer is formed; a spacer positioned between the printed-circuit boards, the spacer equipped with a shielding feature which forms as partitions a first cavity and a second cavity between the printed-circuit boards; a first electronic component positioned in the first cavity and mounted on any one of the printed-circuit boards and used in a first frequency band; a second electronic component positioned in the second cavity and mounted on any one of the printed-circuit boards, the second electronic component used in a second frequency band; a patch antenna formed on the surface of the printed-circuit board opposite that on which the spacer is mounted, the antenna transmitting and receiving radio waves at least one of in the first and second frequency bands; and terminals formed on the surface of the printed-circuit board opposite that on which the spacer is mounted.

Abstract: A mechanism and method are provided for assembling a printed circuit board having a first surface, a second surface and an edge. The printed circuit board may include at least one female member to receive a corresponding male member. The mechanism may include an extension board having an edge to couple to the edge of the printed circuit board. The extension board may include a male member to extend from the edge of the extension board and to couple to the at least one male member so as to couple the extension board to the printed circuit board.

Abstract: An electronic component module includes a mounting substrate including a shield layer and on which a first cavity and a second cavity are formed. A first electronic component positioned in the first cavity is used in a first frequency band. A second electronic component positioned in the second cavity is used in a second frequency band. Lid members seal the first cavity and the second cavity. Patch antennas transmit/receive radio waves in the first and second frequency bands, the antennas being formed on a surface opposite to the electronic components mounting surface. And, connection terminals formed on the mounting substrate are electrically connected to the electronic components through transmission lines.

Abstract: The optoelectronic device includes a sleeve, an insert body, a ferrule, a lens, an optical subassembly, an electrical connector, a substrate, a cover, and a panel nut. The sleeve includes seating surface, an aperture, and thread form. The panel nut has a thread form, and a seating surface. The thread form of the panel nut is complimentary to the thread form of the sleeve so that the panel nut is removeably mountable on the sleeve. In a mounted position, the thread form of the panel nut fully engages the thread form of the sleeve so that the seating surface of the of the panel nut contacts a first one surface of a bulkhead and the seating surface of the sleeve contacts another surface of the bulkhead so that the device is securely mounted to the bulkhead.

Abstract: A ruggedized inverter structure or chassis has an integral frame with a right, rear and left vertical wall formed in the shape of a channel or U from a single plate of aluminum. A rectangular base also formed from a single plate has a front, right, rear and left side bordering a rectangular base plate. A front, right, rear and left vertical wall is formed on the rectangular base plate, each with a single bend. The front and rear walls are bent to form front and a rear mounting flanges. The base plate right and left vertical walls are coupled to the inner surface of the corresponding integral frame right and left vertical walls. A base plate rear wall is coupled to the integral frame rear wall. A transformer mounting plate is coupled to the front and rear mounting flanges. Right and left power modules are mounted.

Abstract: An electrical module assembly includes an electrical module located in the module housing (1) and having an explosion-proof contactless switch (4) including a movable switching element (7) and an actuation element (6) for actuating the switching element (7) from outside, and a sensory electronics (8) for sensing movement of the switch element (7), with the sensory electronics (8) being spatially separated from the switching element (7) by a separation section (9) of the wall (2) of the module housing (1).

Abstract: In connecting a connecting substrate 4 to a flexible substrate 5 connected to a terminal portion of one of substrates constituting a liquid crystal display panel through an anisotropic conductive film (ACF) 20, a bonding assist member 17 formed of the same material as that of an internal wiring or a connecting terminal of the connecting substrate and having substantially the same height as that of the connecting terminal is provided between adjacent terminal groups each including a plurality of connecting terminals 4b in a terminal forming region of a non-coating portion 14 in the vicinity of the connecting substrate 4, to absorb a difference in height between the terminal groups and the non-coating portion by the bonding assist member 17 to thereby make the ACF in an intimate contact with the terminal groups as well as the exposed regions uniformly throughout thereof during a temporary press-bonding step of the ACF and prevent a peeling-off and/or breakage of the ACF between the terminal groups and improve t

Abstract: Miniaturized circuit housing to encapsulate and provide external contacts for at least one integrated circuit, in particular of the flip-chip or wafer-level-package type, with a housing floor, the lower surface of which bears housing contact elements for making external contact and the upper surface of which is electrically connected to circuit contact elements on the lower surface of the circuit, wherein a housing lid is provided, in particular opposite the housing floor, which presses the circuit with the circuit contact element resiliently against the upper surface of the housing floor, and between the circuit contact elements and the housing floor there is no connection that fixes their materials permanently together.

Abstract: An electronic apparatus has a housing having one end, components contained in the housing, and a door which is lockable at a closed position to hide one end of the housing. The housing has a base to support the door, and a cover connected removable to the base. The cover is removed from the base by sliding toward the door, and hooked on the base by sliding away from the door. The door prevents the cover from sliding in the direction of separating the cover from the base, as long as being locked at the closed position.

Abstract: An electrostatic discharge protection cover is described. The electrostatic discharge protection cover enhances the strength of an upper cover of a PC card socket and protects the socket from electrostatic discharge pulse. The electrostatic discharge protection cover has a protection plate assembled on a PC card socket upper side for guiding the pulse of electrostatic discharge to a ground, and a stair-type enhancing edge to enhance the strength of the protection plate. The stair-type enhancing edge further couples with a metal crossbeam of a computer to enhance the strength and electrostatic discharge protection capacity.

Abstract: An electronic equipment contains a circuit board in a casing. The casing encloses a spacing and has a top panel covering the spacing. The circuit board has a pair of end portions and a major surface extending between the pair of the end portions for mounting electronic parts on the major surface. The circuit board is disposed in the spacing of the casing in opposed relation to the top panel. A stay member has an elongated shape extending between the pair of the end portions of the circuit board for reinforcing the major surface of the circuit board. The stay member has a bottom coupling portion disposed in contact with the major surface of the circuit board for coupling with the circuit board, and a top contact portion disposed in contact with a back surface of the top panel for engagement with the casing.

Abstract: A motherboard assembly includes a motherboard, a circuit board, and an ejector assembly. The motherboard has a motherboard connector extending from a planar surface of the motherboard. The circuit board has a circuit board connector extending from a planar surface of the circuit board and coupled to the motherboard connector of the motherboard such that the planar surface of the circuit board orients substantially parallel to the planar surface of the motherboard. The ejector assembly orients between the motherboard and the circuit board. During an ejection procedure, the ejector assembly separates the motherboard connector and the circuit board connector while minimizing bending of either the circuit board or the motherboard. By limiting bending of either the circuit board or the motherboard, the ejector assembly minimizes damage to electrical traces or components carried by either the circuit board or the motherboard during the separation process.