Abstract: Alignment-enhancing electrically conductive feed-through paths are provided for the high-speed low-loss transfer of electrical signals between integrated circuits of a plurality of silicon-on-sapphire bodies arrayed in a stack. The alignment-enhancing feed-throughs are made by a process involving the drilling of holes through the body, double-sided sputtering, electroplating, and the filling of the holes with solder by capillary action. The alignment-enhancing feed-throughs are activated by forming a stack of wafers and remelting the solder whereupon the wafers, and the feed-through paths, are pulled into alignment by surface tension forces.

Abstract: A circuit board assembly wherein the assembly includes a dielectric substrate, at least one radiation sensitive switch, and at least one conductive member in electrical contact with the switch. Portions of the switch and the conductive member are die-stamped into the dielectric substrate to achieve the contact without severing the switch material.

Abstract: In accordance with this invention a porcelain coated metal board is provided which has flat surfaces and further has electrical connections between the face and reverse surfaces of the board. In accordance with a further aspect of this invention the boards of this invention are obtained by a method in which the connecting pins are sealed in a spaced relationship in apertures in the metal core of the board and insulated from the core prior to the application of the porcelain to the surfaces of the core.

Abstract: In manufacturing a fine-patterned thick film conductor structure, a thin film conductor layer having a film thickness of 0.1-10 .mu.m is formed on an insulating substrate and conductive material is then electroplated on the thin film conductor layer to the thickness of 34.9-190 .mu.m under the condition of a cathode current density of no less than 5 A/dm.sup.2. In patterning the conductors, a film thickness-to-conductor interspacing ratio is selected to be no less than 1.4 to prevent widthwise thickening of the conductors in the electroplating process. Resulting conductor structure has a circuit density of no less than 5 lines/mm and a film thickness of 35-200 .mu.m. It is useful for a high density printed circuit board and a miniature coil.

Abstract: A row of connectors 14 is assembled on a printed circuit board 11 by inserting a leg section 41 of each terminal 14 into a mounting aperture 32 and bending a flat contact portion 42 of each terminal 14 to fit into a pocket 47 formed in the surface of the board. Printed circuit conductors 13 are next screened onto the board 11 with a portion of the conductors positioned over some of the contact portions 42 of terminals 14 to provide edge connections for the printed circuits 12. Metal strips conductors 13 are then fastened to the board 11 and end portions thereof are welded to the contact portions 42 of other terminals 14 to provide edge connections for the metal strips conductors 13.

Abstract: A non-consumable electrode for use in arc and plasma devices in an inert gas atmosphere comprising a holder and an active portion made of a refractory metal with emission admixtures, the active portion being connected with the holder so that its outer side surface is exposed to a height exceeding 1/4 of a diameter thereof.

Abstract: Polypropylene glycol dielectric fluids are used to impregnate electrical capacitors and particularly metallized capacitors for improved performance.

Abstract: A printed circuit board assembly usable in a transceiver microphone is disclosed. The assembly comprises a first printed circuit board having components mounted thereon which is fixed to one side of a circuit board carrier by retaining tangs. Second and third printed circuit boards also having components thereon are mounted on an opposite side of the circuit board carrier also by retaining tangs. The first circuit board is connected to the second and third circuit boards via pluralities of bare jumper wires extending between end portions of the first circuit board and adjacent end portions of the second and third circuit boards. The carrier is substantially planar and has integral end projections which form associated notches for receiving each of the jumper wires.

Abstract: A cathode ray tube display terminal includes a printed circuit logic board permanently mounted in a molded plastic enclosure assembly during "on the shelf" storage and shipment of the enclosure as a spare part and during normal operation of the CRT display terminal. The enclosure assembly includes a top portion and a lower portion which snap together. The printed circuit logic board is assembled between the upper and lower portions of the enclosure which are secured by a single screw. A snap-out section allows replacement of a read only memory on the logic board.

Abstract: A protective cover formed from sheet aluminum, which is used to provide both electrical shielding and mechanical protection for a printed circuit board and its components. The abutting edges of the tubular cover are held in contiguous relationship when the cover is in place, by inturned edges which engage small notches in end plates which are affixed to the printed circuit board.

Abstract: A vibration adjustable spacer (10) is disclosed. In a preferred implementation spacers 10, 10', 10" are used to damp the vibrational resonance of a number of printed circuit boards (42, 44, 46) in an assembly (40). The spacer (10) has an adjustable snubbing means (30) which extends to abut an essentially stationary surface (7) when the board is accelerated in one direction and a pivotable means (22) operating such that retraction of the snubbing means is impeded when the board is accelerated in the opposite direction.

Abstract: A burn-in tape (48) includes a backing (50) and a pair of rectangular openings (56, 58) positioned transversely on the backing (50). Power conductors (52, 54) extend longitudinally on backing (50) outboard of the openings (56, 58). Additional conductor lines (104, 106) extend longitudinally along backing (50) between the openings (56, 58). Conductor strips (62, 70, 80, 88) connect the conductors (104, 52, 106, 54) to bonding pads (12, 20, 30, 38) on an integrated circuit (10). Signal conducting strips (64, 66, 68, 72, 74, 76, 78, 82, 84, 86, 90, 92, 94, 96) extend from corresponding test pads on backing (50) to bonding pads on the integrated circuit (10). The backing (50) is provided with sprocket holes (98) for precisely aligning the burn-in tape (48) with the integrated circuit (10). The conductors on the tape (48) provide a means for operating and thereby burning-in the components of the integrated circuit (10).

Abstract: To prevent breakage of flexible conductors of a flat cable soldered to the printed circuit on a printed circuit board, a strain relief member is provided through which the conductors pass, prior to passing through the board to the printed circuit. The relief member has a longitudinal groove extending part way through the member and apertures extending from the bottom of the groove to the bottom surface of the relief member. Bared conductors pass through the apertures and through the board to be soldered to the printed circuit. The end of the insulated portion of the cable is positioned in the groove. The relief member is held in firm contact with the printed circuit board during soldering. Use of the relief member moves the flexing position of the cable away from the end of the "wicking" of the solder up the conductors during soldering.

Abstract: An electronic circuit interconnection system permitting high density mounting of ceramic chip-carrier integrated circuit devices or other beam-lead, dual-in-line (DIP), tape-automated-bonded (TAB), flip-chip, or direct-mounted i.c. devices with wire-bonded interconnects or the like has economical, dimensionally-stable, interconnection substrate which has high heat dissipating properties. The substrate has glass components which are fused onto etched metal patterns and which are proportioned relative to the metal patterns so that the heat-expansion properties of the substrate correspond to those of the i.c. devices to maintain bond integrity between the i.c. leads and circuit paths on the substrate and so that the substrate has sufficient heat-dissipating properties to permit the high density i.c. mounting.

Abstract: A cable assembly having a shielded conductor. The shielded conductor is formed by bonding a thin layer of conductive material to the outer surface of an insulated wire. The bonding may be achieved by coating the outside surface of the insulated wire with a metallic particle and solvent solution, and then heating the coated wire to flash off the solvent and achieve the desired bond. The outer conductive layer may be grounded by positioning a grounding conductor adjacent thereto prior to encapsulation in an outer insulating jacket. The grounding conductor may take the form of an insulated multi-strand metal wire which has an outer diameter approximately equal to the outer diameter of the shielded conductor. The equal diameters of the shielded and grounding conductors enable the cable assembly to be easily terminated in a miniature modular plug.

Abstract: An electric high voltage cable in which the insulation sheath of the current-conducting cores is provided over the entire cable length on the side remote from the core with a coating of SiC particles embedded in the insulation coating and constituting a voltage-dependent resistive coating.

Abstract: Several flat cable embodiments (10, 10', 10", 10'", 10"") are disclosed, as are methods and apparatus (30) for the selective manufacture and connectorization of same. In accordance with one preferred flat cable embodiment (10), adapted for telephone under carpet applications, two precisely offset arrays of rectangularly shaped conductors (13, 14) are separated by a center film (16), with each array being adhesively bonded through an associated adhesive coating (21 or 22) to only the respectively adjacent one of two outer films (18 or 19).

Abstract: A dielectric fluid for a capacitor includes a mixture of phthalate ester, polychlorinated benzene and a linear alkylbenzene.

Abstract: A printed circuit lead frame is provided as a carrier for integrated circuits. The conventional frame comprises a foil pattern that is provided with a plurality of fragile delicate lead fingers which are often bent and displaced laterally or vertically before they can be connected to the terminal pads of a semiconductor chip. The present invention provides a removable stabilizing connecting frame which is made from the same conductive foil as the lead fingers and is provided with tear links which innerconnect the removable frame and each of the lead fingers so that the stabilizing frame may be removed after the lead fingers are bonded to the terminal pads of the semiconductor chip.

Abstract: Two embodiments of a triboelectric transducer cable for generating a signal in response to movement or deformation of the cable each include multiple insulated central conductors, a semi-conductive wrapping separately surrounding each of the insulated central conductors with an additional conductor arranged in electrically conductive contact with the semi-conductive wrapping and a protective jacket surrounding the cable assembly.