Abstract: Aspects of this disclosure relate to a surface acoustic wave resonator having a multi-layer substrate with heat dissipation. The multi-layer substrate includes a support substrate, a piezoelectric layer, and a thermally conductive layer configured to dissipate heat associated with the surface acoustic wave resonator. The thermally conductive layer is disposed between the support substrate and the piezoelectric layer. Related surface acoustic wave filters, radio frequency modules, and wireless communication devices are also disclosed.

Abstract: A transmission line substrate includes a line portion, a base including a first main surface and a second main surface opposite to the first main surface, first and second ground conductors, and a signal line. The first ground conductor is on the first main surface side. The second ground conductor is on the second main surface side. The first ground conductor includes first conductor-non-formed portions overlapping the signal line when viewed in the Z axis direction. The second ground conductor includes second conductor-non-formed portions overlapping the signal line when viewed in the Z axis direction. A total area of the second conductor-non-formed portions is less than a total area of the first conductor-non-formed portions.

Abstract: A filter circuit includes a matching network having resistive and capacitive elements, and a transformer in the matching network. The transformer includes a primary side and a secondary side, and has at least one interwinding capacitance coupled from an input on the primary side to a non-inverting output on the secondary side.

Abstract: Aspects of the disclosure relate to an electroacoustic device that includes a piezoelectric material and an electrode structure. The electrode structure includes a first busbar and a second busbar. The electrode structure further includes a first conductive structure connected to the first busbar and a second conductive structure connected to the second busbar. The first conductive structure and the second conductive structure is disposed between the first busbar and the second busbar. The first conductive structure and the second conductive structure each include a plurality of conductive segments separated from each other and extending towards one of the first busbar or the second busbar. The electrode structure further includes electrode fingers arranged in an interdigitated manner and each connected to either the first conductive structure or the second conductive structure. The electrode fingers have a pitch that is different than a pitch of the plurality of conductive segments.

Abstract: An acoustic resonator device includes a conductor pattern formed on a surface of a piezoelectric plate. The conductor pattern includes a first busbar, a second busbar, and n interleaved parallel fingers of an interdigital transducer (IDT), where n is a positive integer. The fingers extend alternately from the first and second busbars. A first finger and an n'th finger are disposed at opposing ends of the IDT. The conductor pattern also includes a first reflector element proximate and parallel to the first finger and a second reflector element proximate and parallel to the n'th finger. When an RF signal is applied between the first and second busbars, the first reflector element is at substantially the same potential as the first finger and the second reflector element is at substantially the same potential as the n'th finger.

Abstract: An acoustic resonator device includes a diaphragm a diaphragm comprising a portion of a piezoelectric plate spanning a cavity. A conductor pattern on a surface of the piezoelectric plate includes an interdigital transducer (IDT) with a first busbar, a second busbar, and a plurality of interleaved IDT fingers extending alternately from the first and second busbars. Overlapping portions of the plurality of interleaved fingers are on the diaphragm. The conductor pattern also includes a first reflector element on the diaphragm proximate and parallel to a first IDT finger, and a second reflector element on the diaphragm proximate and parallel to a last IDT finger. A center-to-center spacing of the first reflector element and the first IDT finger and the second reflector element and the last IDT finger is greater than an average center-to-center spacing between all adjacent pairs of IDT fingers.

Abstract: Provided are a band-stop filter and a multi-frequency band-stop filter. The band-stop filter includes at least one band-stop filtering unit; the at least one band-stop filtering unit includes an input port, an output port, at least two resonators, and at least one inductive element; and the first terminal of the first resonator is connected between the input port and the inductive element, and the first terminal of the second resonator is connected between the output port and the inductive element.

Abstract: An apparatus comprising: at least one cavity filter element wherein the cavity filter element comprises a first support, a second support distinct from the first support, and a coupling element supported by the first support and the second support. In some examples, there is a series of cavity filter elements. In some examples, the cavity filter element(s) are part of a cavity filter.

Abstract: A multilayer substrate includes a via electrode defining and functioning as an end portion on ground terminals side of a first inductor connected to a shield electrode, the end portion on a signal line side is adjacent to or in a vicinity of a first principal surface than the end portion on the ground terminals side is in the lamination direction of base material layers, a via electrode defining and functioning as the end portion on the ground terminals side of a second inductor is connected to the shield electrode, and the end portion on the signal line side is adjacent to or in a vicinity of the first principal surface than the end portion on the ground terminals side is in the lamination direction of the base material layers.

Abstract: A circuit device includes a substrate, and a wiring pattern and a coil component on the substrate. The wiring pattern includes a first land electrode connected to a first electrode of the coil component and a second land electrode connected to a second electrode of the coil component. The wiring pattern includes a wiring line electrically connected to the land electrode at a position shifted along a first side surface from a center of the first side surface by a shifting value and a wiring line electrically connected to the land electrode at a position shifted along a second side surface from a center of the second side surface by a shifting value.

Abstract: Aspects of this disclosure relate to a surface acoustic wave device. The surface acoustic wave device includes a piezoelectric layer and an interdigital transducer. The interdigital transducer electrode includes a pair of electrodes, each electrode having a bus bar and fingers extending from the bus bar. The interdigital transducer electrode has an interdigital region defined by a portion of the fingers of the electrodes that interdigitate with each other. A dielectric layer is disposed over the interdigital transducer electrode outside the interdigital region and configured to reduce a loss of the surface acoustic wave device.

Abstract: A SAW transducer and a SAW resonator are proposed composed of consecutively arranged unit cells of length L. Slight geometry or material variations such as variations of the metallization ration or the unit cell length L affecting the pitch) between these unit cells result in improved spurious mode suppression while the main mode performance is unaffected.

Abstract: A high power thin film filter is disclosed includes a substrate having a substrate thickness in a Z-direction between a first surface and a second surface. A thin film capacitor may be formed over the first surface. A thin film inductor may be spaced apart from the thin film capacitor by at least the thickness of the substrate. A via may be formed in the substrate that electrically connects the thin film capacitor and the thin film inductor. The via may include a polymeric composition.

Abstract: Acoustic filters are disclosed. An acoustic filter device includes a substrate having a surface and a single-crystal piezoelectric plate having front and back surfaces and a thickness ts, the back surface attached to the surface of the substrate except for portions of the piezoelectric plate forming a plurality of diaphragms that span respective cavities in the substrate. A conductor pattern is formed on the front surface of the piezoelectric plate, the conductor pattern comprising a plurality of interdigital transducers (IDTs) of a plurality of acoustic resonators, interleaved fingers of each IDT of the plurality of IDTs disposed on a respective diaphragm of the plurality of diaphragms. The interleaved fingers of all of the plurality of IDTs are substantially aluminum with a common thickness tm, where 0.12 ts?tm?0.32 ts.

Abstract: A polarization tracker and use thereof are provided. The polarization tracker includes a waveguide housing, and a signal input end, a first directional coupler connected to the signal input end, a first reflective phase shifter and a second reflective phase shifter that are coupled to the first directional coupler, a second directional coupler, and a signal output end connected to the second directional coupler disposed in the waveguide housing.

Abstract: This application relates to the field of communications component technologies, and provides a band-stop filter and an electronic device. The band-stop filter includes: a waveguide transmission line, configured to transmit electromagnetic waves; and a plurality of dielectric resonance units, sequentially arranged along an extension track of the waveguide transmission line, and configured to be coupled to the waveguide transmission line, where the dielectric resonance units each include at least one dielectric resonator; the dielectric resonator includes a first dielectric block and a first conductive layer covering an outer surface of the first dielectric block; and a first surface of the first dielectric block has a blind hole, and the first conductive layer covers an inner surface of the blind hole; where a dielectric constant of a material that forms the first dielectric block is greater than 1.

Abstract: A multilayer filter includes first and second ground electrodes and first and second LC resonators. The first LC resonator includes a first line electrode, a first capacitor electrode, a first via conductor, and a second via conductor. The second via conductor extends from the first line electrode to a first capacitor electrode side and connects the first line electrode and the first ground electrode. The second LC resonator includes a second line electrode, a second capacitor electrode, a third via conductor, and a fourth via conductor. The fourth via conductor extends from the second line electrode to a second capacitor electrode side and connects the second line electrode and the second ground electrode.

Abstract: This invention focuses on minimizing the hot spots on a filter chip by creating thermal radiators using the mechano-acoustic structures and connection circuitry. A gradual increase of metal to wafer relation is made to provide better heat dissipation and heat sinking. Preferably the shunt lines of the ladder type arrangement of SAW resonators (RS1, RS2, RS3) comprise a broadened section (BBCN).

Abstract: A bulk acoustic resonator filter includes: a series bulk acoustic resonator electrically connected, in series, between first and second ports through which a radio frequency (RF) signal passes; a second shunt bulk acoustic resonator, electrically shunt connected between the series bulk acoustic resonator and a ground and having a resonance frequency lower than that of the series bulk acoustic resonator; and a first shunt bulk acoustic resonator electrically connected to the second shunt bulk acoustic resonator in series and having a resonance frequency higher than that of the second shunt bulk acoustic resonator. One or both of the series bulk acoustic resonator and the first shunt bulk acoustic resonator includes a first electrode disposed above a substrate; a piezoelectric layer disposed on the first electrode; a second electrode disposed on the piezoelectric layer; and a trench formed in an upper surface or above the second electrode and recessed downwardly.

Abstract: Radio frequency filters are disclosed. A filter includes a first transversely-excited film bulk acoustic resonator (XBAR) having a first sub-resonator and a second sub-resonator connected in parallel. A pitch of the first sub-resonator is not equal to a pitch of the second sub-resonator and/or a mark of the first sub-resonator is not equal to a mark of the second sub-resonator.