Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, a heat source on the substrate, and a heat pipe. The heat pipe includes a plurality of bumps that extend from the heat pipe towards the substrate but do not come into contact with the substrate. The bumps are configured to help mitigate radio frequency interference in the electronic device. More specifically, the bumps can be configured to provide a resonant frequency in a specific radio frequency band and act as a radio frequency filter.

Abstract: A first filter is a hybrid filter including an acoustic wave filter, a plurality of first inductors, and a plurality of first capacitors. A high frequency module further includes a metal electrode layer covering at least part of a resin layer and at least part of an outer peripheral surface of a mounting substrate. Among a plurality of inductors including the plurality of first inductors of the first filter and a plurality of second inductors of a second filter, at least one inductor (the second inductor) is a circuit element including a conductor pattern portion formed in the mounting substrate. The shortest distance between the outer peripheral surface of the mounting substrate and a signal terminal (a third signal terminal) connected to the circuit element is longer than the shortest distance between the outer peripheral surface of the mounting substrate and the circuit element.

Abstract: A phase shifter includes opposite first and second substrates and a dielectric layer between the first and second substrates. The first substrate includes: a first base plate; a signal line and a reference electrode on a side of the first base plate proximal to the dielectric layer. The second substrate includes a second base plate, and at least one patch electrode on a side of the second base plate proximal to the dielectric layer. The phase shifter further includes first and second feeding structures connected to both ends of the signal line, respectively; the first feeding structure changes a transmission direction of a microwave signal through the signal line, so that the microwave signal is transmitted in a first direction; and the second feeding structure changes a transmission direction of the microwave signal through the signal line, so that the microwave signal is transmitted in a second direction.

Abstract: Tiled filters are disclosed. A filter includes an n×m array of sub-filters, where n is a number of sub-filters in parallel and m is a number of sub-filters in series. n and m are non-zero positive integers and at least one of n and m is greater than one. All of the nm sub-filters are bandpass filters with substantially the same passbands.

Abstract: A tunable impedance simulator and impedance multiplier circuit and a system for configuring a second generation voltage-mode conveyor circuit (VCII) as the tunable impedance simulator and impedance multiplier are described. The tunable impedance simulator and impedance multiplier circuit includes one VCII having a positive input terminal connected to a voltage source, a negative input terminal connected to the voltage source, and an impedance terminal Z0. The impedance terminal Z0 can be either positive or negative. When the impedance terminal Z0 is positive, a positive active inductor, a positive capacitance multiplier, and a positive resistance multiplier may be implemented. When the impedance terminal Z0 is negative, a negative active inductor, a negative capacitance simulator, and a negative resistance simulator may be implemented.

Abstract: A surface acoustic wave device includes a piezoelectric substrate and a pair of IDT electrodes. The pair of IDT electrodes includes a pair of busbars and multiple electrode fingers. The pair of busbars are formed on the piezoelectric substrate. The electrode fingers extend in a comb shape from each of the busbars toward the opposing busbar. The pair of IDT electrodes has an intersection region as a region where the electrode fingers connected to one busbar and the electrode fingers connected to another busbar are intersected when viewed along an arrangement direction of the electrode fingers. The electrode finger in a non-intersection region outside the intersection region has a thickness thinner than a thickness of the electrode finger in the intersection region.

Abstract: Fabrication of superconducting devices that combine or separate direct currents and microwave signals is provided. A method can comprise forming a direct current circuit that supports a direct current, a microwave circuit that supports a microwave signal, and a common circuit that supports the direct current and the microwave signal. The method can also comprise operatively coupling a first end of the direct current circuit and a first end of the microwave circuit to a first end of the common circuit. The direct current circuit can comprise a bandstop circuit and the microwave circuit can comprise a capacitor. Alternatively, the direct current circuit can comprise a bandstop circuit and the microwave circuit can comprise a bandpass circuit. Alternatively, the microwave circuit can comprise a capacitor and the direct current circuit can comprise one or more quarter-wavelength transmission lines.

Abstract: An acoustic wave device includes a support substrate, a piezoelectric layer provided on the support substrate, at least a pair of comb-shaped electrodes provided on the piezoelectric layer, each of the comb-shaped electrodes including a plurality of electrode fingers, and an insulating layer provided between the support substrate and the piezoelectric layer, the insulating layer having, in at least a part thereof, a plurality of void regions of which extending directions are different from each other when viewed from a thickness direction of the support substrate, a width in the corresponding extending direction of each of the void regions being longer than a width in a direction orthogonal to the corresponding extending direction when viewed from the thickness direction of the support substrate.

Abstract: An acoustic wave filter component can include an acoustic wave device including a multi-layer piezoelectric substrate. The multi-layer piezoelectric substrate can include at least a support substrate and a piezoelectric layer. The acoustic wave device can include an interdigital transducer electrode on the piezoelectric layer. An additional layer can be located over the interdigital transducer electrode. The acoustic wave filter component can also include a bulk acoustic wave resonator supported by the additional layer. The acoustic wave device can be a boundary wave resonator, and one or more boundary wave resonators may be provided in a stacked arrangement, with the bulk acoustic wave resonator in the top layer of the stacked arrangement. The acoustic wave device can also be a temperature-compensated surface acoustic wave device.

Abstract: An acoustic wave device includes a piezoelectric substrate, a first interdigital transducer (IDT) electrode, reflectors on both sides of the first IDT electrode in a propagation direction of an acoustic wave, and a second IDT electrode facing the first IDT electrode with a reflector interposed therebetween. The first and second IDT electrodes include first and second intersecting areas in which electrode fingers overlap in the propagation direction. The first and second intersecting areas overlap in the propagation direction. A third busbar of the second IDT electrode is coupled to a first busbar of the first IDT electrode. A fourth busbar of the second IDT electrode is coupled to a ground potential. A resonant frequency of the second IDT electrode is in a frequency band of an interference wave signal.

Abstract: An architecture for, and techniques for fabricating, a thermal decoupling device are provided. In some embodiments, thermal decoupling device can be included in a thermally decoupled cryogenic microwave filter. In some embodiments, the thermal decoupling device can comprise a dielectric material and a conductive line. The dielectric material can comprise a first channel that is separated from a second channel by a wall of the dielectric material. The conductive line can comprise a first segment and a second segment that are separated by the wall. The wall can facilitate propagation of a microwave signal between the first segment and the second segment and can reduce heat flow between the first segment and the second segment of the conductive line.

Abstract: Disclosed herein is a common mode filter that includes a winding core part and first and second wires wound in a same direction around the winding core part. The first and second wires constitute a first winding block on one endmost side in an axial direction of the winding core part, a second winding block on other endmost side in the axial direction of the winding core part, and a third winding block positioned between the first and second winding blocks. The second winding block is a winding block at an odd-numbered position counted from the first winding block. The first and second wires cross each other in an area between the first and third winding blocks and in an area between the second and third winding blocks.

Abstract: Provided are balun circuit structure and balun device, the balun circuit structure comprises unbalanced terminal, first and second balanced terminals, grounded power terminal, first, second, third and fourth inductors. The first terminal of the first inductor is connected to the first terminal of the second inductor, the second terminal of the first inductor is connected to the unbalanced terminal, the second terminal of the second inductor is open-circuited, the first terminal of the third inductor and the first terminal of the fourth inductor are connected to the grounded power terminal, the second terminal of the third inductor is connected to the first balanced terminal, the second terminal of the fourth inductor is connected to the second balanced terminal, the first, second, third and fourth inductors are located in different planes, respectively, the first inductor is coupled to the third inductor, and the second inductor is coupled to the fourth inductor.

Abstract: A semiconductor device including a first functional module arranged on a first substrate and having a chip, an electrical connection component and a sealing ring, where the sealing ring surrounds the chip, and the chip is electrically connected to the electrical connection component; a second functional module having a packaging substrate, where the packaging substrate includes at least two metal layers and a dielectric layer between the metal layers; a third functional module having multiple redistribution lines and multiple micro through holes for electrical connection between the first functional module and the second functional module, where the electrical connection component in the first functional module is electrically connected to the third functional module; and a second substrate, where the second substrate is sealed with the first substrate.

Abstract: Filter devices and methods of fabrication are disclosed. An acoustic filter device includes a substrate and a piezoelectric plate, a first portion of the piezoelectric plate spanning a first cavity in the substrate and a second portion of the piezoelectric plate spanning a second cavity in the substrate. A decoupling dielectric layer on a front surface of the first and second portions of the piezoelectric plate has a first thickness td1 on the first portion and a second thickness td2, greater than the first thickness, on the second portion. Interleaved fingers of a first interdigital transducer (IDT) are on the decoupling dielectric layer over the first portion of the piezoelectric plate, and interleaved fingers of a second IDT are on the decoupling dielectric layer over the second portion of the piezoelectric plate.

Abstract: A method for packaging chips includes: flip-chip bonding a plurality of filter chips to be packaged on a substrate to be packaged; applying a first mold material layer on the filter chips to be packaged; applying a second mold material layer on a side of the first mold material layer away from the filter chip to be packaged, the first mold material layer and the second mold material layer forming a first mold layer; thinning the first mold material layer and the second mold material layer to expose substrates of the filter chips to be packaged, and thinning the substrates of the filter chips to be packaged to a preset thickness; applying a second mold layer on the exposed substrates of the filter chips to be packaged to obtain a mold structure; and cutting the mold structure into a plurality of particle chips.

Abstract: An acoustic resonator device is formed using a wafer-to-wafer bonding process by etching recesses into a first surface of a piezoelectric substrate, a depth of the recesses greater than a target piezoelectric membrane thickness; then wafer-to-wafer bonding the first surface of the piezoelectric substrate to a handle wafer using a releasable bonding method. The piezoelectric substrate is then thinned to the target piezoelectric membrane thickness to form a piezoelectric plate and at least one conductor pattern is formed on the thinned piezoelectric plate. The side of the thinned piezoelectric plate having the conductor pattern is bonded to a carrier wafer using a metal-to-metal wafer bonding process and the handle wafer is removed.

Abstract: A signal transmission circuit includes a common frequency filter configured to filter a signal centering on a common frequency that is an anti-resonance frequency; a first frequency filter configured to filter a signal centering on a first frequency that is an anti-resonance frequency; a second frequency filter configured to filter a signal centering on a second frequency that is an anti-resonance frequency; a first route connected to a first signal wiring line configured to transmit a digital signal; and a second route connected to a second signal wiring line configured to transmit a digital signal.

Abstract: A filter comprising a linear array of a plurality of TL-inspired T-networks connected in series by capacitors, each TL-inspired T-network typically comprising a pair of conventional transmission lines connected in series with a circuit comprising pair of inductors and a single capacitor, the conventional transmission lines associated with each TL-inspired T-network being optionally combinable together or with conventional transmission lines in neighboring TL-inspired T-networks, wherein the circuit comprising a pair of inductors and a single capacitor is an artificial transmission line providing target characteristic impedance, which is same as that of the conventional transmission lines, and phase delay.

Abstract: Filter devices. A first chip includes a first interdigital transducer (IDT) of a first acoustic resonator formed on a surface of a first piezoelectric wafer having a first thickness, interleaved fingers of the first IDT disposed on a portion of the first piezoelectric wafer spanning a first cavity in a first base. A second chip includes a second IDT of a second acoustic resonator formed on a surface of a second piezoelectric wafer having a second thickness less than the first thickness, interleaved fingers of the second IDT disposed on a portion of the second piezoelectric wafer spanning a second cavity in a second base. A circuit card coupled to the first chip and the second chip includes at least one conductor for making an electrical connection between the first IDT and the second IDT.