Patents Examined by Rakesh B Patel
  • Patent number: 11418169
    Abstract: An RF circuit device using modified lattice, lattice, and ladder circuit topologies. The devices can include four resonator devices and four shunt resonator devices. In the ladder topology, the resonator devices are connected in series from an input port to an output port while shunt resonator devices are coupled to the nodes between the resonator devices. In the lattice topology, a top and a bottom serial configurations each includes a pair of resonator devices that are coupled to differential input and output ports. A pair of shunt resonators is cross-coupled between each pair of a top serial configuration resonator and a bottom serial configuration resonator. The modified lattice topology adds baluns or inductor devices between top and bottom nodes of the top and bottom serial configurations of the lattice configuration. These topologies may be applied using single crystal or polycrystalline bulk acoustic wave (BAW) resonators.
    Type: Grant
    Filed: July 17, 2019
    Date of Patent: August 16, 2022
    Assignee: Akoustis, Inc.
    Inventors: Rohan W. Houlden, David M. Aichele, Jeffrey B. Shealy
  • Patent number: 11417937
    Abstract: A phase shifter transmission device includes: a power mechanism, a driving rod, a plurality of transmission assemblies, and at least one row of phase shifters. The power mechanism is connected to the driving rod and configured to drive the driving rod to rotate. The plurality of transmission assemblies are connected to the driving rod, distributed along an axial direction of the driving rod, and driven by the driving rod to rotate synchronously. Each row of phase shifters includes a plurality of phase shifters distributed along the axial direction of the driving rod, and each phase shifter of each row of phase shifters is connected to the corresponding transmission assembly. The at least one row of phase shifters are configured, when being driven by the plurality of transmission assemblies, to synchronously adjust phases of radiated signals corresponding to the phase shifters.
    Type: Grant
    Filed: October 19, 2021
    Date of Patent: August 16, 2022
    Assignees: ROSENBERGER TECHNOLOGIES CO., LTD., ROSENBERGER TECHNOLOGIES LLC
    Inventors: Yongzhong Li, Xu Wang, Ke Zhou, Zhonghao Zou, Jing Sun, Fan Li
  • Patent number: 11411548
    Abstract: A bulk acoustic wave resonator and a bulk acoustic wave filter are provided. The bulk acoustic wave resonator includes: a piezoelectric layer; an electrode layer located at both sides of the piezoelectric layer; and an electrode edge frame structure located at an edge of the electrode layer and located at one side of the electrode layer away from the piezoelectric layer. The electrode edge frame structure includes a laminated structure, the laminated structure includes an edge convex layer and a passivation layer laminated in a longitudinal direction, and the passivation layer is located at one side of the edge convex layer away from the piezoelectric layer; in a transverse direction, the laminated structure includes a cantilever member and a convex structure connected with each other; a cantilever gap is arranged between the cantilever member and at least one of the piezoelectric layer and the electrode layer.
    Type: Grant
    Filed: January 11, 2022
    Date of Patent: August 9, 2022
    Assignee: Newsonic Technologies
    Inventor: Gengjiang Wu
  • Patent number: 11405014
    Abstract: The present invention relates to tunable microresonators, as well as methods of designing and tuning such resonators. In particular, tuning includes applying an electrical bias to the resonator, thereby shifting the resonant frequency.
    Type: Grant
    Filed: June 26, 2020
    Date of Patent: August 2, 2022
    Assignee: National Technology & Engineering Solutions of Sandia, LLC
    Inventors: Darren W. Branch, Christopher Nordquist, Matt Eichenfield, James Kenneth Douglas, Aleem Siddiqui, Thomas A. Friedmann
  • Patent number: 11404210
    Abstract: The present disclosure is generally directed to utilizing capacitors stacks with capacitors mounted in a terminal-to-terminal mounting orientation to reduce overall footprint of capacitor arrays for bypass filtering circuits. In an embodiment, each capacitor stack includes at least a first capacitor, a second capacitor, and a ground plane interconnect. The first capacitor includes first and second terminals disposed opposite each other. The first terminal provides a mating surface to couple to the second capacitor, the second terminal couples to a ground plane. The second capacitor includes first and second terminals disposed opposite each other. The first terminal provides a mounting surface to electrically couple to and support the first capacitor, and the second terminal provides a mating surface to electrically and physically couple to the ground plane. Accordingly, the first capacitor can be inverted and mounted atop the second capacitor to eliminate the necessity of wire bonds, for example.
    Type: Grant
    Filed: October 10, 2019
    Date of Patent: August 2, 2022
    Assignee: Applied Optoelectronics, Inc.
    Inventors: Yi Liu, Qin Li, Hsiu-Che Wang, Ruru Chen
  • Patent number: 11398806
    Abstract: Disclosed is a device and methods for making same. In one aspect, a device includes a package having at least four pins, and, within the package, a die that includes a filter circuit electrically coupled to the four pins. The filter can: receive, from a first pin, an input signal comprising first and second frequency components, produce, at a second pin, a first output signal of the first frequency component, and produce, at a third and fourth pin, a second output signal of the second frequency component; and/or receive, from a second pin, a first input signal comprising the first frequency component, receive, from a third or fourth pin, a second input signal comprising the second frequency component, and produce, at a first pin, an output signal comprising the first and second frequency components. The second pin is interposed between the third and fourth pins on the package.
    Type: Grant
    Filed: September 9, 2020
    Date of Patent: July 26, 2022
    Assignee: RF360 Europe GmbH
    Inventor: Magnus Olbrich
  • Patent number: 11394365
    Abstract: A SAW device having a stacked design of functional layers is proposed that is build up on a carrier substrate (SUB) that is chosen to provide a high acoustic velocity. The stack further comprises a thin TCF compensation layer (TCL), a thin film piezoelectric layer (PEL) and a set of interdigital electrodes (IDE) on top of the piezoelectric layer. Energy of the desired mode mainly in the high acoustic velocity material. Despite the high possible operating frequencies the SAW device can reliably be manufactured with present lithographic techniques.
    Type: Grant
    Filed: April 25, 2019
    Date of Patent: July 19, 2022
    Assignee: QUALCOMM Incorporated
    Inventors: Matthias Knapp, Christian Huck
  • Patent number: 11394363
    Abstract: A bulk-acoustic wave resonator includes: a first electrode disposed above a substrate; a piezoelectric layer disposed to cover at least a portion of the first electrode; and a second electrode disposed to cover at least a portion of the piezoelectric layer. A plurality of steps are formed in any one or any combination of any two or more of the first electrode, the piezoelectric layer, and the second electrode in an active region in which the first electrode, the piezoelectric layer, and the second electrode are all disposed to overlap one another.
    Type: Grant
    Filed: July 16, 2020
    Date of Patent: July 19, 2022
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Won Han, Tae Yoon Kim, Chang Hyun Lim, Sang Uk Son, Jae Hyoung Gil, Dae Hun Jeong
  • Patent number: 11394359
    Abstract: A filter structure includes a capacitive device and an inductive device. The capacitive device includes a ground plane in a first metal layer of an integrated circuit (IC) package, a plate in a second metal layer of the IC package, and a dielectric layer between the ground plane and the plate. The inductive device includes first and second conductive paths in a third metal layer of the IC package, each of the first and second conductive paths is electrically connected to the plate and has a width w, the first and second conductive paths are separated by a spacing s, and a ratio s/w has a value ranging from 1 to 2.
    Type: Grant
    Filed: December 2, 2020
    Date of Patent: July 19, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventor: Ming Hsien Tsai
  • Patent number: 11394364
    Abstract: An acoustic wave device is disclosed. The acoustic wave device includes a piezoelectric layer, an interdigital transducer electrode positioned over the piezoelectric layer, and an anti-refection layer over a conductive layer of the interdigital transducer electrode. The conductive layer can include aluminum, for example. The anti-reflection layer can include silicon. The anti-reflection layer can be free from a material of the interdigital transducer electrode. The acoustic wave device can further include a temperature compensation layer positioned over the anti-reflection layer in certain embodiments.
    Type: Grant
    Filed: February 13, 2020
    Date of Patent: July 19, 2022
    Assignee: Skyworks Solutions, Inc.
    Inventors: Satoru Matsuda, Tatsuya Fujii, Yoshiro Kabe, Kenji Nagano
  • Patent number: 11394360
    Abstract: Certain aspects provide an integrated circuit (IC) including a resonator. One example IC generally includes a substrate, a first oxide region disposed above the substrate, and a resonator. The resonator may include a piezoelectric layer, a second oxide region disposed below the piezoelectric layer and bonded to the first oxide region, and a cavity in the second oxide region, wherein at least a portion of the second oxide region is below the cavity.
    Type: Grant
    Filed: November 22, 2019
    Date of Patent: July 19, 2022
    Assignee: QUALCOMM Incorporated
    Inventors: Je-Hsiung Lan, Jonghae Kim, Ranadeep Dutta
  • Patent number: 11394097
    Abstract: Composite substrate for a waveguide for RF signals having a signal frequency, wherein said composite substrate comprises at least a first layer of dielectric material and a second layer of dielectric material, and at least one conductor layer of an electrically conductive material arranged between said first layer and said second layer, wherein a layer thickness of said at least one conductor layer is smaller than about 120 percent of a skin depth of said RF signals within said electrically conductive material of said conductor layer.
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: July 19, 2022
    Assignee: NOKIA SOLUTIONS AND NETWORKS OY
    Inventors: Senad Bulja, Rose Fasano Kopf, Pawel Rulikowski, Majid Norooziarab
  • Patent number: 11387806
    Abstract: A surface acoustic wave (SAW) filter package structure includes a dielectric substrate having a dielectric layer, a first patterned conductive layer, a second patterned conductive layer, and a conductive connection layer. The conductive connection layer is electrically connected between the first patterned conductive layer and the second patterned conductive layer, which are disposed at opposite sides of the dielectric layer. The second patterned conductive layer has a finger electrode portion. An active surface of a chip is faced toward the finger electrode portion. A polymer sealing frame is disposed between the chip and the dielectric substrate and surrounds the periphery of the chip to form a chamber together with the chip and the dielectric substrate. The mold sealing layer is disposed on the dielectric substrate and covers the chip and the polymer sealing frame. A manufacturing method of the SAW filter package structure is also disclosed.
    Type: Grant
    Filed: November 7, 2019
    Date of Patent: July 12, 2022
    Assignee: PHOENIX PIONEER TECHNOLOGY CO., LTD.
    Inventors: Shih-Ping Hsu, Che-Wei Hsu
  • Patent number: 11387809
    Abstract: An acoustic resonator filter includes at least one series acoustic resonator electrically connected between a first port and a second port in series, through which a radio frequency (RF) signal passes; at least one second shunt acoustic resonator electrically shunt-connected between the at least one series acoustic resonator and a ground; and at least one first shunt acoustic resonator electrically shunt-connected between the at least one series acoustic resonator and a ground and having a resonance frequency higher than a resonance frequency of the at least one second shunt acoustic resonator. At least one shunt acoustic resonator, among the at least one first shunt acoustic resonator and the at least one second shunt acoustic resonator has a temperature coefficient of frequency (TCF) corresponding to resonance frequency sensitivity more insensitive than resonance frequency sensitivity according to a change in temperature of the at least one series acoustic resonator filter.
    Type: Grant
    Filed: November 30, 2020
    Date of Patent: July 12, 2022
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jung Woo Sung, Sung Tae Kim
  • Patent number: 11381214
    Abstract: A reflectionless frequency filter circuit is provided. The reflectionless frequency filter circuit may include a first partial circuit including a first inductor and a first resistor connected in parallel with the first inductor, a first inverter connected in parallel with the first partial circuit, and a third partial circuit connected in series with the first inverter, and the third partial circuit may include a third inductor and a third resistor formed in a branch line between the first inverter and the third inductor.
    Type: Grant
    Filed: September 9, 2020
    Date of Patent: July 5, 2022
    Assignee: Korea University Research and Business Foundation
    Inventors: Ju Seop Lee, Jongheun Lee
  • Patent number: 11381221
    Abstract: Filter devices. A first chip includes a first interdigital transducer (IDT) of a first acoustic resonator formed on a surface of a first piezoelectric wafer having a first thickness, interleaved fingers of the first IDT disposed on a portion of the first piezoelectric wafer spanning a first cavity in a first base. A second chip includes a second IDT of a second acoustic resonator formed on a surface of a second piezoelectric wafer having a second thickness less than the first thickness, interleaved fingers of the second IDT disposed on a portion of the second piezoelectric wafer spanning a second cavity in a second base. A circuit card coupled to the first chip and the second chip includes at least one conductor for making an electrical connection between the first IDT and the second IDT.
    Type: Grant
    Filed: November 12, 2020
    Date of Patent: July 5, 2022
    Assignee: Resonant Inc.
    Inventors: Sean McHugh, Gregory L. Hey-Shipton, Garrett Williams
  • Patent number: 11381213
    Abstract: A noise filter includes a magnetic core including a magnetic material; and a distance adjusting member that accepts adjustment of a distance between a loop portion and the magnetic core, the loop portion being a portion of one or more conductor wiring lines wired in loop shape out of a first conductor wiring line and a second conductor wiring line.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: July 5, 2022
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Kenji Hirose, Satoshi Yoneda
  • Patent number: 11380969
    Abstract: An on-chip microwave filter circuit includes a substrate formed of a first material that exhibits at least a threshold level of thermal conductivity, wherein the threshold level of thermal conductivity is achieved at a cryogenic temperature range in which a quantum computing circuit operates. The filter circuit further includes a dispersive component configured to filter a plurality of frequencies in an input signal, the dispersive component including a first transmission line disposed on the substrate, the first transmission line being formed of a second material that exhibits at least a second threshold level of thermal conductivity, where the second threshold level of thermal conductivity is achieved at a cryogenic temperature range in which a quantum computing circuit operates. The dispersive component further includes a second transmission line disposed on the substrate, the second transmission line being formed of the second material.
    Type: Grant
    Filed: July 30, 2020
    Date of Patent: July 5, 2022
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Patryk Gumann, Salvatore B. Olivadese, Markus Brink
  • Patent number: 11381220
    Abstract: Acoustic wave filter devices is disclosed. The device includes a piezoelectric layer, an input electrode and an output electrode located on a top surface of the piezoelectric layer and physically separated from one another, and a counter electrode having a top surface connected to a bottom surface of the piezoelectric layer. The input and output electrodes each include a base and at least one extension extending from the base. The at least one extension of the input electrode extending alongside and in a generally opposite direction to and separated by a gap width from an adjacent extension of the at least one extensions of the output electrode. In some embodiments, the at least one extension of the input or output electrodes has a width that can changes from a first end of the at least one extension to a second end.
    Type: Grant
    Filed: August 21, 2020
    Date of Patent: July 5, 2022
    Assignee: VTT Technical Research Centre of Finland Ltd
    Inventors: Tapani Makkonen, Tuomas Pensala, Markku Ylilammi
  • Patent number: 11380973
    Abstract: The invention discloses a cavity-based dual-band filtering balun, which includes a first cavity resonator and a second cavity resonator which are connected by a metal plate, the first cavity resonator is provided with an input PCB board, a metal ground layer of the input PCB board is provided with an input through line, the other side of the input PCB board is provided with an input microstrip line, and the first cavity resonator is provided with an input slot corresponding to a position of the input through line; and two opposite outside surfaces of the second cavity resonator which are adjacent to the metal plate are each provided with an output PCB board, metal ground layers of the two output PCB boards are respectively provided with an output through line, the other sides of the two output PCB boards are each provided with an output microstrip line, and the second cavity resonator is provided with an output slot corresponding to a position of the output through line and communicated with the output throug
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: July 5, 2022
    Assignee: SOUTH CHINA UNIVERSITY OF TECHNOLOGY
    Inventors: Yuanchun Li, Xin Fang