Abstract: A single-crystal bulk acoustic wave resonators with better performance and better manufacturability and a process for fabricating the same are described. A low-acoustic-loss layer of one or more single-crystal and/or poly-crystal piezoelectric materials is epitaxially grown and/or physically deposited on a surrogate substrate, followed with the formation of a bottom electrode and then a support structure on a first side of the piezoelectric layer. The surrogate substrate is subsequently removed to expose a second side of the piezoelectric layer that is opposite to the first side. A top electrode is then formed on the second side of the piezoelectric layer, followed by further processes to complete the BAW resonator and filter fabrication using standard wafer processing steps. In some embodiments, the support structure has a cavity or an acoustic mirror adjacent the first electrode layer to minimize leakage of acoustic wave energy.

Abstract: Acoustic resonator devices, filter devices, and methods of fabrication are disclosed. An acoustic resonator includes a substrate having a surface and a single-crystal piezoelectric plate having front and back surfaces. The back surface is attached to the surface of the substrate except for a portion of the piezoelectric plate forming a diaphragm that spans a cavity in the substrate. An interdigital transducer (IDT) is formed on the front surface of the single-crystal piezoelectric plate such that interleaved fingers of the IDT are disposed on the diaphragm. The IDT is configured to excite a primary acoustic mode in the diaphragm in response to a radio frequency signal applied to the IDT. At least a portion of an edge of the diaphragm is at an oblique angle to the fingers. The IDT includes a busbar disposed parallel to the edge of the diaphragm such that the interleaved fingers extend at the oblique angle from the busbar.

Abstract: Disclosed herein is a common mode filter that includes a winding core part and first and second wires wound in a same direction around the winding core part. The first and second wires constitute a first winding block on one endmost side in an axial direction of the winding core part, a second winding block on other endmost side in the axial direction of the winding core part, and a third winding block positioned between the first and second winding blocks. The second winding block is a winding block at an odd-numbered position counted from the first winding block. The first and second wires cross each other in an area between the first and third winding blocks and in an area between the second and third winding blocks.

Abstract: Methods of making acoustic resonators and filter devices. A method includes attaching a piezoelectric plate to a substrate, and forming a conductor pattern including an interdigital transducer (IDT) on a portion of the piezoelectric plate that forms a diaphragm spanning a cavity such that interleaved fingers of the IDT are on the diaphragm. The substrate and the piezoelectric plate are the same material.

Abstract: An electronic component includes a package substrate extending in a longitudinal direction, and chip components disposed along the longitudinal direction of the package substrate and each connected to the package substrate by a bump. A height of a bump connecting at least one chip component disposed at an end portion in the longitudinal direction among the chip components and the package substrate is greater than a height of a bump connecting at least one chip component disposed inward relative to the end portion in the longitudinal direction among the chip components and the package substrate.

Abstract: An LC filter includes a first electrode connected to a first via conductor between two ends of the first via conductor, a second electrode connected to a second via conductor between two ends of the second via conductor, a third electrode connected to a third via conductor between two ends of the third via conductor, and a fourth electrode connected to a fourth via conductor between two ends of the fourth via conductor. In a plan view viewed from the laminating direction, the second via conductor and the fourth via conductor are disposed on two sides of a virtual line connecting the first via conductor and the third via conductor, respectively. The second electrode faces the first electrode and the third electrode.

Abstract: First and second coils have winding axes in a laminated direction of base material layers and are magnetically coupled to each other. First and second capacitors are positioned in the laminated direction on layers different from layers on which the first and second coils are provided. The first and second coils are connected so that the winding directions of the first and second coils are opposite. The second capacitor is connected in parallel to a series circuit of the first coil and the second coil. The first capacitor is connected between a position where the first coil is connected to the second coil and a reference potential electrode. Mutual inductance caused by coupling between the first and second coils and the first capacitor provides a first attenuation pole and a parallel connection circuit of the series circuit and the second capacitor provides a second attenuation pole.

Abstract: An adjustable inductor including a core defining a plurality of gaps, a material positioned in the gaps, at least one winding wound on the core, a force-applying structure, and a film substantially covering the adjustable inductor. The force-applying structure is operable to apply a force to the core to adjust the gaps and thereby an inductance of the adjustable inductor. The film is configured to prevent movement of force-applying structure when below a predetermined temperature threshold, and allow movement of the force-applying structure when above the predetermined threshold.

Abstract: An LC filter includes a first capacitor electrode connected to one end of a first via conductor and faces a first ground electrode in a laminating direction. A second capacitor electrode is connected to one end of a second via conductor and faces the first ground electrode in the laminating direction. A third capacitor electrode is connected to one end of a third via conductor and faces the first ground electrode in the laminating direction. A fourth capacitor electrode is connected to one end of a fourth via conductor and faces the first ground electrode in the laminating direction. The second capacitor electrode faces each of the first capacitor electrode, the third capacitor electrode, and the fourth capacitor electrode in a direction orthogonal or substantially orthogonal to the laminating direction.

Abstract: An orthomode junction for separating and/or combining orthogonally-polarized radiofrequency wave signals, comprises a body which has a main cavity forming a main waveguide, which has a blind end, and auxiliary cavities forming auxiliary waveguides, which communicate laterally with the main cavity in the vicinity of the blind end thereof, and a deflection insert situated at the blind end of the main cavity and facing the auxiliary cavities, the deflection insert having different shapes on the side of the auxiliary cavities respectively.

Abstract: A noise filter includes: a first bus bar that is electrical wiring of a flat plate, the first bus bar including a first extending wiring portion extending in a first direction, a second extending wiring portion extending in a second direction that is a direction opposite to the first direction, and a first coupling wiring portion connecting the first extending wiring portion and the second extending wiring portion; a first lead conductor having a first end connected with the first coupling wiring portion; a first capacitor having a first end connected with a second end of the first lead conductor and a second end connected with a ground; and a magnetic core having an opening in a central portion, the magnetic core disposed in such a manner that the first coupling wiring portion passes through the opening.

Abstract: Acoustic resonator devices and filters are disclosed. An acoustic resonator includes a substrate and a piezoelectric plate supported by the substrate. A portion of the piezoelectric plate suspended across a cavity in the substrate forms a diaphragm. A decoupling dielectric layer is on a front surface of the diaphragm. An interdigital transducer (IDT) has interleaved fingers on the decoupling dielectric layer over the diaphragm. The IDT and piezoelectric plate are configured such that a radio frequency signal applied to the IDT excites shear acoustic waves in the diaphragm.

Abstract: A radio frequency (RF) device and a multi-band matching circuit thereof are provided. The multi-band matching circuit includes an inductance circuit, a first capacitance circuit, an inductor, and a second capacitance circuit. A first terminal of the inductance circuit is coupled to a RF signal input terminal of the multi-band matching circuit. A first terminal of the first capacitance circuit is coupled to a second terminal of the inductance circuit. A first terminal of the inductor and a first terminal of the second capacitance circuit are coupled to a second terminal of the first capacitance circuit. A second terminal of the inductor is coupled to a first reference voltage. A second terminal of the second capacitance circuit is coupled to a second reference voltage. The second capacitance circuit is controlled by a single-bit control signal to change a capacitance value of the second capacitance circuit.

Abstract: Aspects of this disclosure relate to an acoustic wave device that includes a multi-layer interdigital transducer electrode. The acoustic wave device includes a piezoelectric layer and an interdigital transducer electrode on the piezoelectric layer. The interdigital transducer electrode includes a first interdigital transducer electrode layer positioned between a second interdigital transducer electrode layer and the piezoelectric layer. The second interdigital transducer electrode layer can include aluminum and having a thickness of at least 200 nanometers. The acoustic wave device can include a temperature compensation layer arranged such that the interdigital transducer electrode is positioned between the piezoelectric layer and at least a portion of the temperature compensation layer. Related filters, modules, wireless communication devices, and methods are disclosed.

Abstract: An integrated circuit including a first circuit module and a second circuit module is provided. A layer stack may include one or multiple metal layers with a power segment and a ground segment connected to the first circuit module and the second circuit module, which form a resonant current loop. A pickup loop may be inductively coupled to the resonant current loop to dampen its resonance, thereby making the IC compliant with its EMC requirements or removing functional errors such as problems in the signal or power integrity.

Abstract: Aspects of this disclosure relate to an acoustic wave resonator having at least two resonant frequencies. An acoustic wave filter can include series acoustic wave resonators and shunt acoustic wave resonators together arranged to filter a radio frequency signal. A first shunt resonator of the shunt acoustic wave resonators can include an interdigital transducer electrode and have at least a first resonant frequency and a second resonant frequency. Related acoustic wave resonators, multiplexers, wireless devices, and methods are disclosed.

Abstract: An electronic device includes an insulation material layer provided on a first main surface of a piezoelectric substrate and surrounding a functional element, and a protective layer provided on the insulation material layer. The piezoelectric substrate and the insulation material layer define a hollow portion accommodating the functional element. The protective layer includes a first portion above the hollow portion, a second portion adjacent to the first portion at one end of the second portion, and a third portion adjacent to the second portion at another end of the second portion. A distance between the first main surface and a surface of the protective layer in the thickness direction is greatest at a location where the second portion is adjacent to or in a vicinity of the first portion, and the distance is shortest at a location where the second portion is adjacent to or in a vicinity of the third portion.

Abstract: A high-order filter with a capacitive inner tapping technique is disclosed. The filter includes an inductor and a first resonant circuit including a first portion of the inductor and a first capacitor. The first resonant circuit is configured to attenuate first frequency components of an input signal above a cutoff frequency to generate a filtered signal. The filter further includes a second resonant circuit coupled in parallel with the first resonant circuit and including the first portion of the inductor and a second capacitor. The second resonant circuit is configured to attenuate the first frequency components of the input signal to generate the filtered signal. A third resonant circuit includes a second portion of the inductor and a third capacitor, wherein the third resonant circuit is configured to attenuate second frequency components of the filtered signal above the cutoff frequency to generate an output signal.

Abstract: The present disclosure relates to a ladder-type surface acoustic wave (SAW) device, which includes a piezoelectric layer, two reflective structures, at least one series interdigital transducer (IDT) coupled between a first signal point and a second signal point, and at least one shunt IDT. The at least one shunt IDT is coupled at least between the first signal point and ground, or between the second signal point and ground. Herein, the two reflective structures, the at least one series IDT, and the at least one shunt IDT reside over the piezoelectric layer. The at least one series IDT and the at least one shunt IDT are arranged between the two reflective structures.

Abstract: The present disclosure relates to a ladder-type surface acoustic wave (SAW) device, which includes a piezoelectric layer, two reflective structures, at least one series interdigital transducer (IDT) coupled between a first signal point and a second signal point, and at least one shunt IDT. The at least one shunt IDT is coupled at least between the first signal point and ground, or between the second signal point and ground. Herein, the two reflective structures, the at least one series IDT, and the at least one shunt IDT reside over the piezoelectric layer. The at least one series IDT and the at least one shunt IDT are arranged between the two reflective structures.