Abstract: A processing system is disclosed, having a multiple power transmission elements with an interior cavity that may be arranged around a plasma processing chamber. Each of the power transmission elements may propagates electromagnetic energy that may be used to generate plasma within the plasma process chamber. The power transmission elements may be designed to accommodate a range of power and frequency ranges that range from 500 W to 3500 W and 0.9 GHz to 9 GHz. In one embodiment, the power transmission elements may include a rectangular interior cavity that enables the generation of a standing wave with two or more modes. In another embodiment, the power transmission elements may have a cylindrical interior cavity that may be placed along the plasma processing chamber or have one end of the cylinder placed against the plasma processing chamber.

Abstract: A microwave plasma reactor for manufacturing synthetic diamond material via chemical vapor deposition, the microwave plasma reactor comprising: a microwave generator configured to generate microwaves at a frequency f; a plasma chamber comprising a base, a top plate, and a side wall extending from said base to said top plate defining a resonance cavity for supporting a microwave resonance mode, wherein the resonance cavity has a central rotational axis of symmetry extending from the base to the top plate, and wherein the top plate is mounted across said central rotational axis of symmetry; a microwave coupling configuration for feeding microwaves from the microwave generator into the plasma chamber; a gas flow system for feeding process gases into the plasma chamber and removing them therefrom; and a substrate holder disposed in the plasma chamber and comprising a supporting surface for supporting a substrate on which the synthetic diamond material is to be deposited in use; wherein the resonance cavity is con

Abstract: A resin container coating device of the present invention includes a plurality of chambers storing a plurality of resin containers respectively in independent states, a plurality of internal electrodes in which gas conductive parts for conducting a source gas are formed to inner peripheral parts thereof and which are respectively inserted inside the plurality of resin containers stored in the chambers, a gas supply unit for supplying the source gas to the plurality of chambers, a high frequency power source for supplying a high frequency electric power to the plurality of chambers, and an electric power switching part capable of switching a supply designation of the high frequency electric power, which is supplied from the high frequency power source, from first and second chambers forming a first unit to third and fourth chambers forming a second unit.

Abstract: There are provided a substrate processing apparatus and a substrate processing method realizing an effective reduction of a voltage change of a substrate on an electrode to reduce the variation of incident energy of ions entering the substrate. The substrate processing apparatus includes: a first electrode holding a substrate on a main surface of the first electrode; a second electrode facing the first electrode; a RF power source applying to the first electrode a RF voltage whose frequency is equal to or higher than 40 MHz; and a pulse voltage applying unit applying to the first electrode a pulse voltage decreasing in accordance with a lapse of time, by superimposing the pulse voltage on the RF voltage.

Abstract: Implementations described herein generally relate to components and methods used in plasma processing, and more specifically relate to grooved surfaces for controlling RF return path lengths in plasma processing chambers and methods for forming the same. In one implementation, a backing plate for a plasma processing chamber is provided. The backing plate comprises a rectangular body. The rectangular body has a front surface, a back surface opposing the front surface, a first axis perpendicular to a center of the rectangular body and a plurality of grooves formed in the front surface. At least one groove of the plurality of grooves has a first length across the groove in a first location and a second length across the groove in a second location.

Abstract: Disclosed is a plasma processing apparatus that processes a processing target substrate using microwave plasma within a processing container. The plasma processing apparatus includes a placing table provided in the processing container, and configured to place the processing target substrate thereon; and an antenna provided above the placing table to face the placing table, and including a dielectric plate, the antenna being configured to radiate microwaves into the processing container through the dielectric plate to generate plasma of a processing gas supplied into the processing container. The dielectric plate includes a flat plate portion provided on a bottom surface of the antenna, and formed in a flat shape at least on a surface facing the placing table; and a rib formed on a surface of the flat plate portion that is opposite to the surface facing the placing table.

Abstract: The present invention provides a method for applying a surface coating on, for example, a sheet of fabric and further provides a plasma chamber (10) for coating a sheet of fabric, e.g. a textile material, with a polymer layer, the plasma chamber (10) comprising a plurality of electrode layers (RF, M) arranged successively within the plasma chamber, wherein at least two adjacent electrode layers are radiofrequency electrode layers (RF) or ground electrode layers (M), thereby providing a surface coating on both sides of a fabric sheet.

Abstract: Provided are a roll, a film forming apparatus, and a film forming method. The present invention provides a roll used in an apparatus which may transfer a substrate, e.g., a flexible substrate such as a plastic film and a fibrous or metallic web or film and may form a film on a surface of the substrate, a film forming apparatus including the roll, and a film forming method using the film forming apparatus.

Abstract: An apparatus, for use in a processing chamber is provided. A pneumatic cylinder is provided. A manifold with a supply and an exhaust is controllably connected to the pneumatic cylinder. A dry gas supply is in fluid connection with and provides positive pressure to the exhaust of the manifold.

Abstract: The present invention provides a SWP (surface wave plasma) processing system that does not create underdense conditions when operating at low microwave power and high gas pressure, thereby achieving a larger process window. The DC ring subsystem can be used to adjust the edge to central plasma density ratio to achieve uniformity control in the SWP processing system.

Abstract: A rotating microwave is established for any resonant mode TEmnl or TMmnl of a cavity, where the user is free to choose the values of the mode indices m, n and l. The fast rotation, the rotation frequency of which is equal to an operational microwave frequency, is accomplished by setting the temporal phase difference ?Ø and the azimuthal angle ?? between two microwave input ports P and Q as functions of m, n and l. The slow rotation of frequency ?? (typically 1-1000 Hz), is established by transforming dual field inputs ? cos ??t and ±? sin ??t in the orthogonal input system into an oblique system defined by the angle ?? between two microwave ports P and Q.

Abstract: A substrate processing tool for processing a substrate includes a processing chamber including a substrate support. First and second coils are arranged outside of the processing chamber. Each of the first and second coils includes first and second conductors. A coil driving circuit drives current through the coils to generate plasma in the processing chamber. A coil reversing circuit is configured to selectively reverse a polarity of current flowing through the first and second conductors of the first coil. The coil reversing circuit includes an H-bridge circuit.

Abstract: A plasma processing apparatus includes a process chamber including a sidewall, a mounting table disposed in the process chamber, a shield member which is disposed along the inner surface of the sidewall to surround the mounting table and has an opening facing the transfer port, and a shutter configured to open/close the opening, the shutter being movable up and down. The shutter has a first portion adapted to face the opening, and a second portion adapted to face the shield member at a lower side of the shield member. The shield member has a lower portion including a contact surface facing the second portion. A contactor adapted to contact the contact surface is disposed at the second portion. The first portion of the shutter closes the opening through a gap between the first portion and the shield member. The contact surface and the contactor are formed of HASTELLOY®.

Abstract: A radical source for supplying radicals during atomic layer deposition semiconductor processing operations is provided. The radical source may include a remote volume, a baffle volume, and a baffle that partitions the remote volume from the baffle volume. The baffle volume and the remote volume may be fluidly connected through the baffle via a plurality of baffle holes. The baffle may be offset from a faceplate with a plurality of first gas distribution holes fluidly connected with the baffle volume. A baffle gas inlet may be fluidly connected with the baffle volume, and a first process gas inlet may be fluidly connected with the remote volume. Baffle gas may be flowed into the baffle volume to prevent radicalized first process gas in the remote volume from flowing through the baffle volume and the faceplate.

Abstract: A microwave plasma source for forming a surface wave plasma by radiating a microwave into a chamber of a plasma processing apparatus, which includes: a microwave output part for outputting the microwave; a microwave transmission part for transmitting the microwave; and a microwave radiation member for radiating the microwave into the chamber. The microwave transmission part includes a plurality of microwave introduction mechanisms circumferentially arranged in a peripheral portion of the microwave radiation member and configured to introduce the microwave into the microwave radiation member. The microwave radiation member includes a metal main body, a plurality of dielectric slow-wave members arranged in an overall annular shape in the vicinity of an arrangement surface of the main body, an annular dielectric microwave transmission member arranged in a microwave radiation surface of the main body, and a slot antenna part installed between the slow-wave members and the microwave transmission member.

Abstract: A plasma processing apparatus includes a processing chamber, a table disposed in the processing chamber, a dielectric window provided at the processing chamber, and a surrounding body made of a dielectric material surrounding a processing space between the table and the dielectric window. The dielectric window and the surrounding body are separated from each other in a vertical direction with a predetermined gap therebetween.

Abstract: [Object] To provide a radical generator which can produce radicals at higher density. [Means for Solution] The radical generator includes a supply tube 10 made of SUS, a hollow cylindrical plasma-generating tube 11 which is connected to the supply tube 10 and which is made of pyrolytic boron nitride (PBN). A first cylindrical CCP electrode 13 and a second cylindrical CCP electrode 30 are disposed outside the plasma-generating tube 11. A coil 12 is provided so as to wind about the outer circumference of the plasma-generating tube 11 at the downstream end of the first CCP electrode 13. A thin connecting tube 23 extending from the bottom of the plasma-generating tube 11 is inserted into the supply tube 10.

Abstract: An embodiment of the present disclosure provides a vacuum apparatus, which relates to a display technical field. The vacuum apparatus can eliminate an electrostatic adsorption between a substrate and an electrode so as to avoid damages to the substrate. The vacuum apparatus includes: a vacuum cavity; a first electrode and a second electrode located inside the vacuum cavity and opposite to each other; and positioning structures for positioning the substrate. The substrate is located between the first electrode and the second electrode and is positioned closer to the first electrode or the second electrode. The vacuum apparatus further includes an electrostatic elimination device.

Abstract: Provided is a plasma processing apparatus that performs a processing on a processing target substrate by applying plasma of a processing gas on the processing target substrate. The plasma processing apparatus includes: a processing container configured to accommodate the processing target substrate; a lower electrode disposed in the processing container to mount the processing target substrate thereon; an upper electrode disposed in the processing container to face the lower electrode with a processing space being interposed therebetween; a high frequency power source configured to apply a high frequency power between the upper electrode and the lower electrode; a main magnet unit including one or more annular main electromagnetic coils arranged around a central axis; and an auxiliary magnet unit configured to form a magnetic field that perpendicularly or obliquely crosses the central axis in the processing space.

Abstract: The present invention provides an upper electrode and an etching apparatus including the electrode, both of which can properly reduce the intensity of the electric field of plasma around a central portion of a substrate, thus enhancing in-plane uniformity. In this apparatus, a recess, serving as a space for allowing a dielectric to be injected therein, is provided around a central portion of the upper electrode. Both a dielectric supply passage and a dielectric discharge passage are connected with the space. With such configuration, controlled supply of the dielectric into the recess makes the in-plane electric field intensity distribution uniform over various process conditions, such as the kind of wafer to be etched, the processing gas to be used, and the like.