Abstract: A composite electronic component includes a composite body containing a capacitor and an inductor coupled to each other, the capacitor including a ceramic body having a plurality of dielectric layers and first and second internal electrodes, and the inductor including a magnetic body including a coil part, an input terminal disposed on a first end surface of the composite body and connected to the coil part, an output terminal including first output terminals disposed on a second end surface of the composite body and connected to the coil part and a second output terminal disposed on a second side surface of the composite body and connected to the first internal electrodes, and a ground terminal disposed on a first side surface of the composite body. The capacitor and the inductor are coupled in a vertical direction, and a magnetic metal layer is provided between the inductor and the capacitor.

Abstract: There is provided a filter for receiving a rectangular or stepped source voltage to be filtered and for providing an output voltage, the filter including means arranged to determine the output voltage in dependence on the frequency components of the source voltage within the filter passband, and independent of output current drawn.

Abstract: The invention comprises a high frequency inductor filter apparatus and method of use thereof. In one embodiment, an inductor is used to filter/convert power, where the inductor comprises a distributed gap core and/or a powdered core material. The inductor core is wound with one or more turns, where multiple turns are optionally electrically wired in parallel. In one example, the minimum carrier frequency is above that usable by an iron-steel inductor, such as greater than ten kiloHertz at fifty or more amperes. The core is optionally an annular core, solid rod core, or a core used for multiple phases, such as a ‘C’ or ‘E’ core. Optionally, the inductor is used in an inductor/converter apparatus, where output power has a carrier frequency, modulated by a fundamental frequency, and a set of harmonic frequencies, in conjunction with one or more of a silicon carbide, gallium arsenide, and/or gallium nitride based transistor.

Abstract: A semiconductor device with an inductor-capacitor (LC) resonant circuit includes a first insulation layer, an inductor component, and a capacitor component. The inductor component includes a coil-conductor segment and two extension-conductor segments. The coil-conductor segment and the extension-conductor segments are located on a same surface of the first insulation layer, and the extension-conductor segments are coupled to two ends of the coil-conductor segment, respectively. The extension-conductor segments are arranged at an interval, and extend outwards relative to the coil-conductor segment. A first region is defined by the extension-conductor segments and the coil-conductor segment, and the capacitor component is arranged corresponding to the first region in an embedded manner on the other surface, opposite to the inductor component, of the first insulation layer.

Abstract: A nested multi-stage polyphase filter can comprise: a first filter stage and a second filter stage. The first filter stage can be connected to the second filter stage via first through fourth intermediate connections. The first filter stage and the second filter stage can be laid out in a nested-ring layout. The first through fourth intermediate connections can be laid out so as to not cross over each other.

Abstract: An RF filter assembly comprising a substrate, an RF waveguide filter mounted on the substrate and a pair of alignment/mounting/RF signal transmission pins extending from respective apertures in the substrate into respective through-holes in the RF filter. In one embodiment, the RF waveguide filter is comprised of first and second blocks of dielectric material coupled together in an abutting side-by-side relationship and the pair of through-holes are defined in the first and second blocks respectively. In one embodiment, respective RF signal transmission pads defined on the respective first and second blocks of dielectric material are abutted against respective RF signal transmission pads defined on the substrate and interconnected by an RF signal transmission line in the interior of the substrate for transmitting the RF signal between the first and second blocks of dielectric material.

Abstract: A signal transmission line includes a signal conductor and an array of resonators. The resonators can include split resonators. The array of resonators can partially overlap with the signal conductor of the signal transmission line. In some embodiments, the portion of the signal conductor overlapping with the split ring resonators is wider than the portion of the signal conductor outside the overlapping area. The signal transmission line can be tuned for a range of frequencies. For example, the signal transmission line can be tuned to have an absolute value of a s-parameter less than or equal to 1 dB for a range of frequencies. The signal transmission line can be less than or equal to 200 microns in thickness and may also be flexible.

Abstract: Disclosed herein is a thin film type common mode filter including: a base substrate made of an insulating material; a first insulating layer formed on the base substrate; a coil-shaped internal electrode formed on the first insulating layer; a second insulating layer formed on the internal electrode; an external electrode terminal having a vertical section connected to a side surface of the internal electrode and a horizontal section extended from an upper end of the vertical section toward a horizontal direction to thereby form a parallel surface spaced apart from the internal electrode by a predetermined distance; and a ferrite resin layer formed between the horizontal section of the external electrode terminal and the internal electrode.

Abstract: A filter device for filtering electrical currents or electromagnetic interference, particularly common-mode interference. The filter device has a soft-magnetic core with a passage, a printed circuit board with a plurality of electronic components, and a holding section. The holding section of the printed circuit board can be put through the core passage wherein the passage is designed such that the holding section and the electronic components arranged on the holding section can be put through the passage.

Abstract: Provided is an LC composite component having a multi-layer substrate, a pattern coil, and a chip capacitive element. The multi-layer substrate is configured such that insulating layers are stacked. The pattern coil forms a coiled shape of which the coil axis extends along a stacking direction of the multi-layer substrate, and includes a coil conductor disposed between the insulating layers. The chip capacitive element includes a ceramic body having a relative permittivity higher than that of the insulating layers and counter electrodes. The chip capacitive element is at least partially disposed within the pattern coil.

Abstract: An inductor component includes a plurality of conductive elements, each formed as an individual patch of conductive material, with the conductive elements arranged in a vertical stack and tightly coupled to one another. Dielectric is disposed between more adjacent conductive elements, the dielectric has a permittivity and is sufficiently thin so as to provide a mutual inductance factor of at least one-half or greater between adjacent ones of the conductive elements. The dielectric is typically thinner than the adjacent conductors.

Abstract: A second conductor plane (102) is formed in a layer different from a layer in which a first conductor plane (101) is formed, and faces the first conductor plane (101). A first transmission line (104) is formed in a layer different from the layers in which the first conductor plane (101) and the second conductor plane (102) are formed, and faces the second conductor plane (102), and one end thereof is an open end. A conductor via (106) connects the other end of the first transmission line (104) and the first conductor plane (101). An insular conductor (112) is connected to a portion of the first transmission line (104) other than a portion thereof at which the transmission line (104) is attached to the conductor via (106), is located in a layer different from the layer in which the second conductor plane (102) is located, and faces the second conductor plane (102).

Abstract: A multi-mode cavity filter comprises: a dielectric resonator; a coupling structure for at least one of coupling input signals to the dielectric resonator and extracting filtered output signals from the dielectric resonator; a covering of conductive material around the dielectric resonator and comprising an aperture; and a printed circuit board structure having at least one ground plane layer arranged over said aperture and electrically coupled to the covering of conductive material.

Abstract: The present invention provides a dielectric waveguide input/output structure for connecting to a coaxial connector a plurality of dielectric waveguide resonators each comprising an approximately parallelepiped-shaped dielectric block, wherein the plurality of dielectric waveguide resonators include a first dielectric waveguide resonator and a second dielectric waveguide resonator each having an exterior coated with an electrically conductive film, except for a coupling window, wherein each of the coupling window is formed with a probe composed of an electrically conductive film, the probe having one end connected to a feeding point, and the other end connected to the electrically conductive film, and wherein the first dielectric waveguide resonator and the second dielectric waveguide resonator are arranged in such a manner that the one side surfaces thereof are located in opposed relation to each other.

Abstract: Various embodiments relate to an apparatus and related method for transmission and reception of a plurality of a carrier signals comprising one or more dual-band channels through a same-band combiner. A device such as a base station may include a same-band combiner that comprises a plurality of dual-bandpass filters and a combining element to transmit and receive the carrier signal. Each of the dual-bandpass filters may transmit and receive a channel, with each dual-bandpass filter including separate reception and transmission passbands for the separate frequencies in the dual-band channel. The combining element may separate and combine the one or more dual-band channels, with each of the dual-bandpass filters connected in parallel processing separate dual-band channels.

Abstract: A choke for an EMI filter is provided. The EMI filter includes a first filtering circuit and a second filtering circuit. The choke includes a magnetic core assembly and four winding coils. The magnetic core assembly includes a first magnetic core and a second magnetic core. The first winding coil and the second winding coil are directly wound around the first magnetic core. The third winding coil and the fourth winding coil are directly wound around the second magnetic core. The first winding coil is serially connected with a first positive path of the first filtering circuit. The second winding coil is serially connected with a second positive path of the second filtering circuit. The third winding coil is serially connected with a first negative path of the first filtering circuit. The fourth winding coil is serially connected with a second negative path of the second filtering circuit.

Abstract: There is provided a band pass filter including: a first substrate including a plurality of capacitors and a plurality of conductive patterns provided thereon; and a second substrate laminated with the first substrate and connected to the plurality of first conductive patterns through a plurality of via holes, wherein an attenuation frequency is determined according to the amount and shape of the plurality of via holes.

Abstract: Contrary to phase shifters which require complimentary polarity control voltages, a phase shifter may be driven with a single polarity control voltage. The phase shifter comprises an input node in communication with both a high pass network and a low pass network which are both in communication with an output node, where the phase shifter further comprises a first single pole double throw switch and a second single pole double throw switch configured to selectively pass an RF signal from the input node to the output node by way of one of said high pass network and said low pass network. Furthermore, the first and second single pole double throw switches are configured to select between the high pass network and the low pass network based on a single control signal having a voltage greater than or less than a reference voltage.

Abstract: A multilayer chip electronic component may include: a ceramic body including a plurality of dielectric layers; an inductor part disposed within the ceramic body; a capacitor part disposed within the ceramic body; a first dummy electrode disposed within the ceramic body and a second dummy electrode disposed within the ceramic body; and first to sixth external electrodes disposed on first and second main surfaces of the ceramic body, a first connection terminal disposed on the second main surface and first end surface of the ceramic body, and a second connection terminal disposed on the second main surface and second end surface of the ceramic body. The inductor part may include first and second inductor parts, and the inductor part and the capacitor part are connected to each other.

Abstract: Apparatus and methods for high voltage variable capacitors are provided herein. In certain configurations, an integrated circuit (IC) includes a variable capacitor array and a bias voltage generation circuit that biases the variable capacitor array to control the array's capacitance. The variable capacitor array includes a plurality of variable capacitor cells electrically connected in parallel between a radio frequency (RF) input and an RF output of the IC. Additionally, each of the variable capacitor cells can include a cascade of two or more pairs of anti-series metal oxide semiconductor (MOS) capacitors between the RF input and the RF output. The pairs of anti-series MOS capacitors include a first MOS capacitor and a second MOS capacitor electrically connected in anti-series. The bias voltage generation circuit generates bias voltages for biasing the MOS capacitors of the variable capacitor cells.