Abstract: Apparatus and methods for high voltage variable capacitors are provided herein. In certain configurations, an integrated circuit (IC) includes a variable capacitor array and a bias voltage generation circuit that biases the variable capacitor array to control the array's capacitance. The variable capacitor array includes a plurality of variable capacitor cells electrically connected in parallel between a radio frequency (RF) input and an RF output of the IC. Additionally, each of the variable capacitor cells can include a cascade of two or more pairs of anti-series metal oxide semiconductor (MOS) capacitors between the RF input and the RF output. The pairs of anti-series MOS capacitors include a first MOS capacitor and a second MOS capacitor electrically connected in anti-series. The bias voltage generation circuit generates bias voltages for biasing the MOS capacitors of the variable capacitor cells.

Abstract: A notch filter includes a dielectric substrate; and a microstrip transmission line provided on the dielectric substrate and having an arrow-shaped embedded open-circuited stub.

Abstract: In a high frequency filter, a multilayer structure includes a plurality of insulator layers, a first transmission line transmits an input signal, and a second transmission line is electromagnetic coupled with the first transmission line on the same insulator layer and transmits an output signal. A conductor layer defines capacitors with the first transmission line and the second transmission line with the insulator layer in between. A dielectric constant of the insulator layer that comes in contact with the first transmission line and the second transmission line is higher than a dielectric constant of an insulator layer other than the insulator layer.

Abstract: An apparatus and method for a frequency based integrated circuit that selectively filters out unwanted bands or regions of interfering frequencies utilizing one or more tunable notch or bandpass filters or tunable low or high pass filters capable of operating across multiple frequencies and multiple bands in noisy RF environments. The tunable filters are fabricated within the same integrated circuit package as the associated frequency based circuitry, thus minimizing R, L, and C parasitic values, and also allowing residual and other parasitic impedance in the associated circuitry and IC package to be absorbed and compensated.

Abstract: A filter includes a multilayer body including a plurality of insulator layers stacked on top of one another. Outer electrodes are provided on surfaces of the multilayer body. A first resonator is connected to a first one of the outer electrodes and includes a first coil. A second resonator is connected to a second one of the outer electrodes and includes a second coil. A third resonator includes a third coil that is magnetically coupled with the first and second coils. The first and second coils are respectively defined by coil conductor layers provided on an insulator layer. The third coil is defined by via hole conductors that penetrate through the insulator layer in a z-axis direction.

Abstract: A dielectric wave guide filter comprising a block of dielectric material defining a plurality of resonators separated by an interior layer of conductive material. A first direct path for the transmission of an RF signal is defined by the plurality of resonators. An external substrate is coupled to an exterior surface of the block of dielectric material and defines a pair of RF signal input/output transmission vias filled with a conductive material and an interior RF signal transmission line extending between and interconnecting the pair or RF signal input/output transmission vias and providing an indirect cross-coupling path for the RF signal between two of the resonators separated by the interior layer of conductive material.

Abstract: A multiplexer including a housing including an antenna connector coupled to an antenna and a plurality of input and output connectors configured to receive or output a signal transmitted or received via the antenna according to a predetermined frequency band; a plurality of band pass filter units included in the housing and configured to pass a signal of a predetermined frequency band between the antenna connector and the plurality of input and output connectors; and a coupling unit including a plurality of feeding units to couple the antenna connector and the plurality of band pass filter units with one another.

Abstract: A distributed electromagnetic (EM) wave filter includes: a cavity; upper and lower ground planes on top and bottom surfaces of the cavity, wherein the upper and lower ground planes are in electrical contact; a plurality of electromagnetically coupled resonators in said cavity between the upper and lower ground planes that define respective transmission lines, wherein the plurality of resonators are not connected to each other by a conductive connection; an input port coupled to a first one of the plurality of resonators to receive an EM wave; an output port coupled to a last one of the plurality of resonators to output a filtered EM wave; and a plurality of conductive structures between adjacent resonators, respectively and connected to one or more of the upper and lower ground planes.

Abstract: A high power, low passive inter-modulation capacitor is presented, which is formed using metal clad substrates, which are broad-side coupled through a thin air gap. Each substrate may include metal layers affixed on both sides which are electrical coupled together to form a single capacitor plate, or each substrate may have only a single metal layer on the surface adjacent to the air gap. The capacitor has particular application in low cost RF and microwave filters, which may be used in communication equipment and communication test equipment such a diplexers, for low PIM applications.

Abstract: Device (1) for filtering electromagnetic interference, comprising: —a plurality of electrical conductors (5) mounted in parallel, each conductor (5) comprising a first coil (10) disposed between a first (7) and a second (8) end of the conductor (5), said first coils (10) being coupled magnetically together and exhibiting one and the same first number of turns, said first (7) and second (8) ends of the conductors (5) respectively defining first (7) and second (8) terminals for the device, —a plurality of capacitors (13), each capacitor (13) being mounted between the second and (8) of an electrical conductor (5) and a third terminal (15) of the device, and —an additional circuit (20) comprising a second coil (21) coupled magnetically with the first coils (10) and exhibiting a second number of turns, said circuit (20) furthermore comprising an additional coil (23).

Abstract: A composite electronic component may include: a composite body including a capacitor formed of a ceramic body in which a plurality of dielectric layers and first and second internal electrodes are laminated, and an inductor formed of a magnetic body including a coil; an input terminal disposed on a first end surface of the composite body; output terminals including a first output terminal disposed on a second end surface of the composite body and a second output terminal disposed on the second end surface of the composite body; and a ground terminal disposed on one or more of upper and lower surfaces and the first end surface of the capacitor of the composite body. The capacitor is adjacent to the inductor.

Abstract: An LC composite component includes one or more inductors, one or more capacitors, a magnetic layer, and a substrate. The substrate has a first surface, and a second surface opposite to the first surface. The magnetic layer is disposed to face the first surface of the substrate. The one or more inductors are disposed between the first surface of the substrate and the magnetic layer. The substrate has a thickness greater than that of the magnetic layer in a direction perpendicular to the first surface of the substrate. The substrate has a complex permeability having a real part and an imaginary part that are respectively smaller than the real part and the imaginary part of the complex permeability of the magnetic layer.

Abstract: An electrical component, e.g., a diplexer or a duplexer, can have one of a number of diverse arrangements for terminal surfaces on the substrate bottom. For example, the terminal surfaces for first and second filters are not disposed at the maximum distance from one another. First and second filters can be disposed as one or two discrete components on the substrate, wherein one filter can be implemented as being integrated in a multilayer substrate.

Abstract: Apparatus and methods for high voltage variable capacitors are provided herein. In certain configurations, an integrated circuit (IC) includes a variable capacitor array and a bias voltage generation circuit that biases the variable capacitor array to control the array's capacitance. The variable capacitor array includes a plurality of variable capacitor cells electrically connected in parallel between a radio frequency (RF) input and an RF output of the IC. Additionally, each of the variable capacitor cells can include a cascade of two or more pairs of anti-series metal oxide semiconductor (MOS) capacitors between the RF input and the RF output. The pairs of anti-series MOS capacitors include a first MOS capacitor and a second MOS capacitor electrically connected in anti-series. The bias voltage generation circuit generates bias voltages for biasing the MOS capacitors of the variable capacitor cells.

Abstract: An electronic component includes a device body and first through n-th LC parallel resonators connected in series with each other. The first through n-th LC parallel resonators respectively include first through n-th inductors and first through n-th capacitors. The first through n-th inductors are disposed in the device body such that they are arranged in a first direction in this order. The first and n-th inductors are provided with a spiral shape such that they turn around respective winding axes extending along the first direction. At least one of the second through (n?1)-th inductors is provided with a helical shape such that it turns around a winding axis extending along the first direction.

Abstract: Embodiments of the present invention disclose a filter, including: a conductive box body, and an insulating substrate, a first conductor, and a second conductor that are arranged inside the conductive box body. The insulating substrate includes a first surface and a second surface. The first conductor is arranged on the first surface of the insulating substrate. A position on the second surface corresponding to the first conductor contacts with the conductive box body. The second conductor is arranged on the first surface or the second surface of the insulating substrate. The second conductor and the conductive box body form a coaxial resonant cavity together. Further, an end of the second conductor is coupled with the first conductor, and the other end of the second conductor is coupled with the conductive box body. The filter has advantages of a microstrip filter of simple manufacturing process and small volume.

Abstract: Radio frequency (RF) filter structures and related methods and RF front-end circuitry are disclosed. In one embodiment, an RF filter structure includes a first terminal and a first tunable RF filter path defined between the first terminal and a second terminal. The first tunable RF filter path is tunable to provide impedance matching between the first terminal and the second terminal at a first frequency. The first frequency may be provided within a first frequency band. Additionally, the RF filter structure includes a second tunable RF filter path defined between the first terminal and the second terminal. The second tunable RF filter path is tunable to provide impedance matching between the first terminal and the second terminal at a second frequency. The second frequency may be within a second frequency band. In this manner, the RF filter structure is configured to provide impedance tuning for multiple impedance bands simultaneously.

Abstract: RF communications circuitry, which includes a first tunable RF filter and a second tunable RF filter, is disclosed. The first tunable RF filter is coupled to the second tunable RF filter. The RF communications circuitry operates in one of a first operating mode and a second operating mode. During the first operating mode, the second tunable RF filter receives and filters an upstream RF signal to provide a filtered RF signal. Further, during the first operating mode, the first tunable RF filter augments a frequency response of the second tunable RF filter.

Abstract: A resonance device and a filter including the same are provided. The resonance device includes a case having a first ground surface and a second ground surface which are facing each other, and a first conductive layer located in the case, and the first conductive layer includes a main part grounded via the first ground surface, and a protruding part which has a width different from that of the main part and is located to be spaced apart from the second ground surface.

Abstract: A radio-frequency (RF), base station notch filter includes an integral, conductive RF notch filter structure having one or more notch filter elements, where the notch filter elements may be circular in shape. The integral notch filter reduces insertion losses and passive intermodulation distortion.