Abstract: An all-pass filtering module of a common mode noise suppressing device includes first and second differential transmission circuits coupled to a reference node. Each of the first and second differential transmission circuits has an input terminal and an output terminal, and includes: first and second capacitive elements coupled in series between the input terminal and the output terminal; a first inductor coupled between the input terminal and the output terminal; and a third capacitive element and a second inductor coupled in series between the reference node and a common node between the first and second capacitive elements.

Abstract: RF communications circuitry, which includes a first RF filter structure and RF detection circuitry, is disclosed. The first RF filter structure includes a first group of RF resonators, which include a first pair of weakly coupled RF resonators coupled to a signal path of a first RF signal. One of the first group of RF resonators provides a first sampled RF signal. The RF detection circuitry detects the first sampled RF signal to provide a first detected signal. The first RF filter structure adjusts a first filtering characteristic of the first RF filter structure based on the first detected signal.

Abstract: A resonator according to the invention includes an Inner conductor. The resonator has a easing comprising walls, a lid and a bottom shell within which there is a resonator cavity. The Inner conductor is in said resonator cavity. The Inner conductor is a conductive material formed with a base portion having a first end and a second end having a first end attached to a surface of the resonator cavity galvanically, in addition, the inner conductor has two or more elongate conductive materials forming resonator parts having a first end and a second end, and the resonator pasts first end is galvanically secured to the base portion at one end and the other end is galvanically separated from the resonator cavity inner surface. The characteristics of the resonator parts are selected so that each produces its own resonance width. These properties Include, for example, size, shape, orientation, material, and their different combinations.

Abstract: Disclosed are a common mode filter and a manufacturing method thereof. The common mode filter in accordance with an aspect of the present invention includes: a substrate; a filter layer including a coil and a dielectric layer and disposed on the substrate and configured to remove a signal noise; and a magnetic layer being laminated on the filter layer, and a surface of the filter layer being joined with the magnetic layer can be formed to be flat by having the coil embedded in a surface of the filter layer being joined with the magnetic layer in such a way that one surface of the coil is exposed.

Abstract: The present subject matter relates to systems, devices, and methods for adaptively tuning antenna elements and/or associated filter elements to support multiple frequency bands. For example, a tunable filter having an input node and an output node can be selectively tunable to define one or more pass bands associated with one or more first signal bands and one or more reject bands associated with one or more second signal bands. The tunable filter can be configured to pass signals having frequencies within the first signal bands between the input node and the output node and to block signals having frequencies within the second signal bands. Furthermore, the tunable filter can be configured to selectively tune the pass bands to have a minimum pass band insertion loss at any of a variety of frequencies, including frequencies that are greater than and less than frequencies within the reject bands.

Abstract: RF communications circuitry, which includes a first RF filter structure and RF detection circuitry, is disclosed. The first RF filter structure includes a first group of RF resonators, which include a first pair of weakly coupled RF resonators coupled to a signal path of a first RF signal. One of the first group of RF resonators provides a first sampled RF signal. The RF detection circuitry detects the first sampled RF signal to provide a first detected signal. The first RF filter structure adjusts a first filtering characteristic of the first RF filter structure based on the first detected signal.

Abstract: Apparatus and methods for tunable filters are provided. In certain configurations, a tunable filter includes a semiconductor die attached to a laminated substrate, such as a substrate of a multi-chip module (MCM). The tunable filter includes a vector inductor implemented using two or more conductors arranged on different conductive layers of the laminated substrate. The vector inductor's conductors are inductively coupled to one another and electrically connected in parallel to provide the vector inductor with high quality factor (Q-factor). The semiconductor die includes a variable capacitor that is electrically connected with the vector inductor to operate as a tunable resonator. Additionally, a frequency characteristic of the tunable filter, such as a passband, can be controlled by selecting a capacitance value of the variable capacitor, thereby tuning a resonance of the resonator.

Abstract: A filter component includes a housing body. A first and at least one second busbar each have a first end section, and a second end section, between which in each case a center section is arranged. The end sections of the busbars each have connections for connecting electrical conductors to the filter component. The first and second end section and the center section of the first busbar are arranged in a first plane and the first and second end section and the center section of the at least one second busbar are arranged in a second plane, which is different from the first plane.

Abstract: A high-Q factor resonator includes a solenoid having an embedded capacitor assembled in a machinable high-frequency dielectric printed circuit board (“PCB”), or other substrate. The solenoid comprises a plurality of surface conductors positioned on upper and lower surfaces of the PCB. The solenoid further comprises a plurality of conductive vias extending through the PCB between the surface conductors, and at least two aligned vias are separated by a capacitive gap. A liquid crystal dielectric is embedded within the capacitive gap in order to control the capacitance. Accordingly, a tunable capacitive filter is achieved by changing the dielectric permittivity of the liquid crystal. In one example, a nematic liquid crystal is sealed in the capacitive gap and has its permittivity changed with a low frequency bias to tune the capacitor.

Abstract: A variable-frequency resonance circuit includes first and second input/output terminals and a resonance circuit portion. The resonance circuit portion includes a first inductor and first and second LC series circuits. The resonance circuit portion is connected between a ground and a transmission line that connects the first and second input/output terminals. The first LC series circuit includes a second inductor and a variable capacitor connected in series with each other. The second LC series circuit includes a third inductor and a fixed capacitor connected in series with each other. The first and second LC series circuits are connected in parallel between the first inductor and a ground. The first and second inductors are configured such that positive-coupling mutual inductance is produced therebetween.

Abstract: Radio frequency (RF) filter structures and related methods and RF front-end circuitry are disclosed. In one embodiment, an RF filter structure includes a first terminal and a first tunable RF filter path defined between the first terminal and a second terminal. The first tunable RF filter path is tunable to provide impedance matching between the first terminal and the second terminal at a first frequency. The first frequency may be provided within a first frequency band. Additionally, the RF filter structure includes a second tunable RF filter path defined between the first terminal and the second terminal. The second tunable RF filter path is tunable to provide impedance matching between the first terminal and the second terminal at a second frequency. The second frequency may be within a second frequency band. In this manner, the RF filter structure is configured to provide impedance tuning for multiple impedance bands simultaneously.

Abstract: An implementation of the invention is directed to a passive device cell having a substrate layer, and intermediary layer formed above the substrate layer, and a passive device formed above the intermediary layer. The intermediary layer includes a plurality of LC resonators and a plurality of segmented conductive lines, wherein the plurality of segmented conductive lines are disposed between the plurality of LC resonators.

Abstract: The present invention is related to an adjustable harmonic filtering device, mainly comprising a first connecting port, a second connecting port, a harmonic filtering unit, and an adjusting unit, in which a passive network is presented between the first connecting port and the second connecting port, as well as the harmonic filtering unit is connected to the passive network. The harmonic filtering unit comprises a first inductor and a first capacitor. The adjusting unit is adjacent to the first inductor of the harmonic filtering unit, and induced electromagnetically therewith. Thus, frequency-band of the harmonic, to be filtered out by the harmonic filtering unit, may be changed, allowing for reducing loss of signal occurring in the process of transmission between the first connecting port and the second connecting port effectively.

Abstract: A waveguide structure includes a signal line and two static lines. The signal line is disposed between the static lines in a first direction. The static lines and the signal line are disposed parallel to one another. Each static line includes a first conductive pattern, a second conductive pattern, and a third conductive pattern. The first conductive pattern and the signal line are disposed on an identical plane of a dielectric layer. A thickness of the first conductive pattern is substantially equal to a thickness of the signal line. The second conductive pattern is disposed on the first conductive pattern. A width of the first conductive pattern is larger than a width of the second conductive pattern in the first direction. The third conductive pattern is disposed on the second conductive pattern. A width of the third conductive pattern is larger than the width of the second conductive pattern.

Abstract: A semiconductor device comprises a guarded circuit. The semiconductor device also comprises a guard ring surrounding the guarded circuit. The semiconductor device further comprises a resonant circuit coupled with the guard ring. The resonant circuit comprises an input node coupled with the guard ring. The resonant circuit also comprises an inductor. The resonant circuit further comprises a capacitor coupled with the inductor. The resonant circuit additionally comprises a ground node configured to carry a ground voltage. The inductor and the capacitor are coupled between the input node and the ground node.

Abstract: The invention relates to a switchable band-pass filter. In particular, the invention relates to a narrowband switchable band-pass filter over a broad frequency band with two filter elements (including microstripline technology, suitable for use as a cosite filter with a compact structure, which is particularly suitable for efficient mass production and robust in operation. The two filter elements in this context are coupled to one another, on the one hand via a switchable coupling device and, on the other hand, via a direct electromagnetic interaction.

Abstract: An inductor is provided on a substrate that includes a capacitor. The inductor comprises a series of wire loops. An end of the wire loop is wire bonded to the capacitor.

Abstract: RF communications circuitry includes an RF filter structure, which includes a group of resonators, a group of cross-coupling capacitive structures, and a group of egress/ingress capacitive structures, is disclosed. Each of the group of cross-coupling capacitive structures is coupled between two of the group of resonators. A first portion of the group of egress/ingress capacitive structures is coupled between a first connection node and the group of resonators. A second portion of the group of egress/ingress capacitive structures is coupled between a second connection node and the group of resonators.

Abstract: Radio frequency (RF) filter structures and related methods and RF front-end circuitry are disclosed. In one embodiment, an RF filter structure includes a first terminal and a first tunable RF filter path defined between the first terminal and a second terminal. The first tunable RF filter path is tunable to provide impedance matching between the first terminal and the second terminal at a first frequency. The first frequency may be provided within a first frequency band. Additionally, the RF filter structure includes a second tunable RF filter path defined between the first terminal and the second terminal. The second tunable RF filter path is tunable to provide impedance matching between the first terminal and the second terminal at a second frequency. The second frequency may be within a second frequency band. In this manner, the RF filter structure is configured to provide impedance tuning for multiple impedance bands simultaneously.

Abstract: A multilayer filter includes a plurality of mutually coupled resonant circuits provided within a multilayer body. Capacitor internal electrodes, inductor internal electrodes, and inductor via electrodes, ground via electrodes, and input-output via electrodes are arranged within the multilayer body. The ground via electrodes and the input-output via electrodes are provided on a dielectric layer on a mounting surface, or a second dielectric layer on a first dielectric layer provided on the mounting surface. The capacitor internal electrodes arranged towards the side of the mounting surface do not overlap the input-output electrodes when viewed in plan view. With this configuration, degradation in frequency characteristics of a resonant circuit is effectively prevented by controlling one of an inductive component and a capacitive component of the resonant circuit.