Abstract: Process for preparation of conductive circuit utilizing two photohardenable layers on substrate which may contain a conductive circuit, the upper photohardenable layer becoming hardenable and nontacky when exposed to short wavelengths of radiation (ultraviolet) the lower photohardenable layer being tacky and sensitive to long wavelength radiation (visible light). The photohardenable layers are imagewise exposed through a dichromic phototool (black/yellow also having clear areas) and the unhardened image areas are solvent developed revealing tacky areas. The tacky areas are treated with metal or alloy particles or plating catalyst material, and the metallized or catalyzed image is electrolessly plated. Multilayer conductive circuits can be prepared.

Abstract: Disclosed herein is a method and means for replacing upper and lower corrugated rolls in a single facer having a cassette frame for rotatably supporting the upper and lower rolls and a main frame to which the cassette frame is detachably connected. The method comprises the steps of suspending and moving away the cassette frame apart from a predetermined mounting position in the single facer, keeping a spare cassette rotatably supporting other upper and lower rolls waiting in a suspended condition and fixing the spare cassette frame to the predetermined mounting position in the single facer in place of the cassette frame removed. Means for performing the method is disclosed which comprises a cassette frame rotatably supporting the upper and lower rolls; and a main frame carrying a pressure roll and a gluing unit. The cassette frame is detachably connected to the main frame.

Abstract: An interconnection mask which is sandwiched between two members to be bonded together is comprised of a thin sheet of preselected material which has a plurality of apertures therein which are positioned, sized, and shaped to define the common bonding areas between the two members whereby structural failures induced by bonding and loading characteristics of the two members are minimized.

Abstract: The invention pertains to the method and apparatus for vulcanizing retreaded tires wherein an annular precured tread is bonded to a tire carcass by bonding material interposed between the tread and carcass. Grills are attached to the opposite sides of the carcass and each are associated with an annular elastomeric ironing member having a concave surface corresponding to the tire side configuration engaging the tread marginal edges whereby the ironing surface shapes and smooths the transition zone between the tread and tire carcass resulting in improved appearance and integral bonding.

Abstract: A method of selectively tailoring the slope of via hole sidewalls. A first polyimide layer (in which the vias are to be formed) is covered by a strippable layer, and the two layers are isotropically etched. By varying the thickness of the strippable layer with respect to that of the polyimide layer, the slope of the via hole sidewalls can be controlled.

Abstract: Uniformly impregnated liner and medium for making corrugated board are prepared by using a urea-aldehyde impregnating composition to impregnate board in-line and a process where the coated board is treated with an aqueous primer and fully cured to provide board having resin free surfaces.

Abstract: A method of forming the proper metallization contacts in a multilayer epitaxy laser device is provided. By selecting the proper crystal plane orientation in etching nonplanar features like channels for the device, a differential etch rate in a free-etch can be effected to remove only selected portions of the top layer and to provide self-alignment in the metallization process.

Abstract: A vehicle air system (300) for a vehicle equipped with a source of pressurized fluid (302, 306), an air brake system (314), a central tire inflation system (316) and a central tire inflation system pressurized fluid reservoir (336) is provided. Preferably, the central tire inflation system reservoir is defined in part by the vehicle spare tire. The central tire inflation system rservoir is fluidly connected to the source of pressurized fluid, the vehicle air brake system and the central tire inflation system by a pair of parallel conduits (332, 334), one of which is provided with a one way check valve (340) allowing pressurized fluid stored in the reservoir to be supplied to the brake system of the central tire inflation system.

Abstract: A one-sided corrugated cardboard machine having an upper and a lower fluted roller, a pressure roller associated with the lower fluted roller, a suction box essentially extending the width of the lower fluted roller and connected to a vacuum source while being arranged on the side of the lower fluted roller which is not covered by the corrugated material web, said suction box creating a vacuum in annular suction grooves of the lower fluted roller, and sealing sheet metal members engaging within the suction grooves on the side of the suction box facing the pressure roller, with a supporting beam for the sealing sheet metal members retained in the machine stand which is arranged separately of the suction box, said suction box being adapted to be adjusted through a greater distance with the aid of an adjusting device.

Abstract: A gasket made of compressed expanded graphite particles bonded to an apertured reinforcement plate whose apertures are bridged by a relatively narrow area, as in a cylinder head gasket, is made by pressing the graphite particles onto the face of the plate without transverse support of those particles at the periphery of the plate apertures, by pressing between two compressor belts.

Abstract: A method of manufacture of a printed circuit board having plated-through holes interconnecting printed conductors formed on each of two external surfaces, includes the step of masking those areas of the external surfaces where solder will subsequently be required to adhere. The unmasked conductive areas are then coated with a material which prevents wetting by normal soldering techniques. The masking material is subsequently removed. The coating material may be electroless nickel, or electroplated nickel or suitable nickel alloys.

Abstract: A process is provided for making a conductive structure for a semiconductor circuit, such as a one device dynamic random access memory cell, which includes the steps of depositing a conductive layer on a surface of a semiconductor substrate having a given type conductivity spaced from a storage node, depositing a layer of polysilicon over the conductive layer, depositing a layer of photoresist over the polysilicon layer, defining an opening in the photoresist layer and implanting ions of a conductivity type opposite to that of the given type conductivity through the opening and the polysilicon layer into the semiconductor substrate to form therein a conductive pocket or region having the opposite type conductivity resulting in, e.g., a highly conductive bit/sense line of a memory cell.

Abstract: A method and system for tensioning and applying a foam core tape having pressure sensitive adhesive faces to a body side molding. The method is effected to obtain the necessary stretch in the foam core tape to coordinate with any dimensional changes which may occur in the body side moldings to which it is bonded. The system includes a tensioning roll disposed between a supply roll and the point of application of the tape to the body side molding. The peripheral surface of the tensioning roll frictionally engages the foam tape and the rotation of the tensioning roll is controlled by suitable braking mechanism to effect a desired stretch in the tape prior to its application to the body molding.

Abstract: A method of lining a pipeline or passageway with a flexible tubular liner. The liner is caused to evert in the pipeline by a fluid under pressure, and a former is used to smooth out the everting face of the liner and evenly apply resin over the everting face.

Abstract: An etch stopped layer portion overlying a (100) or (110) major face of a diamond cubic semiconductor material is undercut anisotropically etched by orienting a side edge of the etch stopped layer portion which is to be undercut, at an angle to the most nearly parallel {111} trace on the (100) or (110) face. The etch time is further reduced by slotting through the etch stopped layer with slots oriented at an angle to the {111} traces on the underlying (100) or (110) face. Undercut bridge structures are formed by undercutting quadrilateral etch stopped layer portions from opposite sides of the quadrilateral or from the sides plus slots forming diagonals of {111} trace quadrilaterals having combined areas coextensive with the area to be undercut.

Abstract: A method for bonding a thin metal sheet to a rigid body utilizes pneumatic cylinders compressing a spreader bar against components to be bonded. C clamps specially designed to hold the pneumatic cylinders are used to hold the components in place. Heat is applied to the bonding surfaces for curing for a predetermined period of time.

Abstract: A method of filming the surface of a plywood used for formwork, the method comprising dispersing a first dose of an adhesive polyolefine resin powder on the surface of the plywood, heating the dispersed resin powder on the plywood, thereby enabling the resin powder to spread thereon in a molten state, dispersing a second dose of non-adhesive polyolefine resin powder, heating the second dose of resin powder on the film produced by the first dose of resin powder, flattening the resin layers on the plywood by passing same through press rollers, and finally cooling the flattened resin layer.

Abstract: Three dimensional single crystalline structures, such as folded cantilever beams supported from a frame and supporting a central structure free to move relative to the frame, are fabricated by anisotropically etching through openings in etch stop layers on opposite sides of the substrate wafer. The openings are patterned and aligned so that the etch stop layers are undercut to define etch stop portions interconnected by unetched substrate material.

Abstract: An apparatus for laminating multilayered printed circuit boards while radically reducing the volume of inert gas that must otherwise be used to effect the lamination process. The invention employs a novel ring assembly, each such assembly disposed on a moveable, horizontally disposed shelf. Each such ring assembly comprises a hollow circular cylinder, the interior of which is adapted to radially enclose a multiple layer circuit module mounted on a heating platen. The axial surfaces of the cylinder are capped by a pair of seal plates and O-rings to form a gas-tight laminating chamber. Each shelf is adapted to travel vertically along a pair of support tubes whereby the entire array of shelves may be compressed relative to the respective shelves by a hydraulic or pneumatic cylinder the rod of which is affixed to the bottom surface of the lowermost shelf.

Abstract: In a method of installing a septum (18) at a desired depth within a section of honeycomb core (12) for use in a sound attenuation panels, the septum is sandwiched between two layers (20, 24) of support material having a melting temperature intermediate between the fusing and curing temperatures of the septum material. The honeycomb core (12) is pressed into supporting materials and septum to segment and position the septum (18) therein, after which the resultant assembly is heated sufficiently to allow the septum to fuse and adhere to the honeycomb core. The resultant assembly is then heated sufficiently to melt the support material and allow it to be drained away, leaving the segmented septum (18) in place within the honeycomb core.