Abstract: A method and a device for coupling a PCB sheet are disclosed. If a defective PCB is found after the manufacture of continuously arranged circuit patterns, then the defective PCB sheet portion is removed to replace it with a new PCB sheet portion. That is, a defective circuit pattern sheet 2? is removed from continuously arranged circuit patterns of a first PCB sheet 4a. After removal of the defective circuit pattern sheet 2?, the first PCB sheet 4a is position-located by means of a position locating means 12. Then the space which is formed by removing the defective circuit pattern sheet 2? is filled with a second PCB sheet 4b on which a good quality circuit pattern 2b is printed. Then the first PCB sheet 4a and the second PCB sheet 4b are coupled together by using an adhesive means 14.

Abstract: An electrician's tool generally comprises a plate having a hole formed therein, the hole defined by an inner edge. The edge includes means for safely sliding wire through the hole and past the edge. In one embodiment the means for safely sliding the wire includes at least one roller rotatably positioned adjacent the inner edge for safely sliding the wire past the edge. In another embodiment of the invention, the means for safely sliding comprises a round bar or curled inner edge providing a curved surface for safely sliding the wire across the edge.

Abstract: A printed circuit board defective area transplant repair method in which printed circuit boards that are determined to be defective undergo a series of reworking procedures comprised of plotting the printed circuit board area block plan, selecting the printed circuit boards, cutting out the area blocks, cutting the selected area blocks, applying the adhesive and fitting area blocks, adjusting the area block alignment, roller tamping the plastic band, curing the adhesive, and tearing off the plastic band. Following the reworking operations, defective printed circuit boards are restored into a good products capable of continuous use such that printed circuit board fabrication and production is even more economical and environmentally protective and, furthermore, printed circuit board manufacturing reaches maximum utilization rates, thereby effectively increasing practical production value.

Abstract: Solder bump pads are formed on a semiconductor substrate by way of a semiconductor template that has been micromachined to receive solder paste material. The solder paste material is then formed into precisely controlled ball shapes and geometries.

Abstract: An electronic package and method of formation. A thermally conductive layer having first and second opposing surfaces is provided. A first dielectric layer is laminated under pressurization to the first opposing surface of the thermally conductive layer, at a temperature between a minimum temperature T1MIN and a maximum temperature T1MAX. T1MAX constrains the ductility of the first dielectric layer to be at least D1 following the laminating. T1MAX depends on D1 and on a first dielectric material comprised by the first dielectric layer. A second dielectric layer is laminated under pressurization to the second opposing surface of the thermally conductive layer, at a temperature between a minimum temperature T2MIN and a maximum temperature T2MAX. T2MAX constrains the ductility of the second dielectric layer to be at least D2 following the laminating. T2MAX depends on D2 and on a second dielectric material comprised by the second dielectric layer.

Abstract: A preferred method for electrically connecting a first and a second component includes inserting a wire pin through a through hole formed in the first component so that a first portion of the wire pin is located within the through hole and a second portion of the wire pin is located within a retaining feature formed at least in part by the second component. The preferred method also includes moving one of the first and the second components in relation to the other of the first and the second components so that the wire pin resiliently deflects thereby establishing a first contact force between the first portion of the wire and the first component, and a second contact force between the second portion of the wire and the second component.

Abstract: A heat sink hand placement tool for manually installing a heat sink to an integrated circuit (IC). The heat sink tool includes a heat sink interface block having a lower surface adapted to provide a force on a heat sink disposed over an IC. A force transducer interfaces with an upper surface of the heat sink interface block to produce an electrical signal, which is routed to a measurement circuit to measure the electrical signal. A chassis is disposed over the force transducer and the measurement circuit, wherein the chassis is adapted to receive a force from a user, such that the force is transmitted to the lower surface of the heat sink interface block. The measurement circuit then provides an indication of the force being applied within a predetermined range.

Abstract: The present invention provides a production method of a printed circuit board having a circuit pattern with a little variation in the thickness at a low cost without a special step for removal of a dummy pattern. The present invention is characterized in that an insulating layer 2 is formed in a given pattern on one surface of a supporting substrate 1, a circuit pattern 6 is formed on the insulating layer 2 while forming a dummy pattern 7 in an area free of the insulating layer 2 on the one surface of the supporting substrate 1, and an unnecessary part of the supporting substrate 1, which is free of the insulating layer 2 and the circuit pattern 6, is removed by dissolution together with the dummy pattern 7.

Abstract: The present invention is a method for manufacturing an electrical connector comprising an insulative housing with a base side and an opposed side and lateral sides interposed between said base side and said opposed side and at least one conductive contact extending from the base side of the insulation in a first leg and then laterally adjacent the top side of the housing in a second leg. In this method there is provided a mold comprising a first die and an opposed second die all defining an interior cavity and an exterior area. A molding compound input port extends between the exterior area and the interior cavity and a contact receiving aperture extending through the first die from the exterior area to the interior cavity. The conductive contact is then positioned so that the first leg extends upwardly from the exterior area through the contact receiving aperture into the interior cavity. The first leg extends through said interior cavity, and the second leg extends laterally adjacent the opposed die.

Abstract: A method of assembling a disk drive includes providing a disk drive base. The method further includes providing a disk drive cover having an inside face and an outside face. The inside face is coated with an electrically insulative material. The method further includes contacting, continuously during a period, the outside face with an electrically conductive grounding element that is part of an assembly fixture that is not part of the disk drive being assembled. The method further includes attaching the disk drive cover to the disk drive base during the period.

Abstract: A method and structure relating to multisegmented plated through holes. A substrate includes a dielectric layer sandwiched between a first laminate layer and a second laminate layer. A through hole is formed through the substrate. The through hole passes through nonplatable dielectric material within the dielectric layer. As a result, subsequent seeding and electroplating of the through hole results in a conductive metal plating forming at a wall of the through hole on a segment of the first laminate layer and on a segment of the second laminate layer, but not on the nonplatable dielectric material of the dielectric layer. Thus, the conductive metal plating is not continuous from the first laminate layer to the second laminate layer.

Abstract: An electrical and mechanical connection between (a) a first shielded cable including a metal sheath and electrical conductors and (b) a second cable including a ground conductor and electrical conductors, comprises a zone of interconnection between the first and second cables. In this interconnection zone, a first connection is made between the free end of the metal sheath and the free end of the ground conductor, and second connections are made between the free ends of the electrical conductors of the first cable and the free ends of the electrical conductors of the second cable, respectively. Still in the interconnection zone, the interconnected metal sheath and ground conductor have a first length shorter than second lengths of the interconnected electrical conductors of the first cable and electrical conductors of the second cable whereby, in operation, longitudinal tension in the interconnection zone is totally supported by the interconnected metal sheath and ground conductor.

Abstract: A method for reworking a connector attached to an electronic board and including a plurality of stacked modules thereon. The method comprises providing a tool with a holding structure for holding the board and having first and second jaws for grasping and removing a selected one of the modules from the board, at least one of the jaws having a wedge and a slit for receiving the selected module, the tool having a first drive structure for moving the jaws between an open and a closed position along a direction parallel to the selected module, a second drive structure for moving the jaws along a direction perpendicular to the board and a third drive structure for moving the jaws along a direction parallel to the longitudinal axis of the connector, wherein the wedge separates an adjacent module from the selected module to be removed from the connector.

Abstract: The object of this invention is to provide an improved connection between a TTY keypad and an emergency call box. This is accomplished by lengthening and re-routing the multi-conductor ribbon cable that connects the TTY to the call box. Thus relieving the stress on the cable. This prevents the cable from cracking from fatigue and rendering the TTY box useless.

Abstract: An electric-component mounting system including a component-holding device for holding an electric component, a board-supporting device for supporting a printed-wiring board on which the electric component is mounted, a first relative-movement device operable to move the component-holding device and the board-supporting device relative to each other in a first direction parallel to a surface of the board supported by the board-supporting device, a second relative-movement device operable to move the component-holding device and the board-supporting device relative to each other in a second direction which intersects the surface of the board; and a control device including a positioning portion operable to select one of a plurality of different control targets which is used for the first relative-movement device to establish a predetermined relative position between the component-holding device and the board-supporting device, and wherein the positioning portion selects one of the different control targets, de

Abstract: A method for shaping an object. The method includes the steps of preparing an attachment material having a glass transition temperature lower than that of the object, fixing the attachment material on the object, forming the object into a predetermined shape, heating the attachment material until the temperature is higher than its glass transition temperature, and cooling the attachment material and the object until the temperature is lower than the glass transition temperature of the attachment material. Additionally, shaping of the object and heating of the attachment material can achieve the same results.

Abstract: A corrugated tube includes a tubular body, formed with a slit extending in an axial direction of the tubular body; a plurality of ridge portions, formed on an outer periphery of the tubular body and arranged side by side in the axial direction; and a lap portion, protruded from one of opposed end portions of the tubular body which are separated by the slit and extended toward an inner face of the other opposed end portion of the tubular body. A plurality of fixation members are provided on the outer periphery of the tubular body to fix the corrugated tube onto the panel body in a state that the tubular body is so twisted that the slit is spirally extended.

Abstract: A method for fabricating a semiconductor apparatus using a board frame. A wiring board region of the frame includes an island on which a semiconductor device is mounted. A marginal region of the frame surrounds the wiring board region. A frame region is located around the marginal region. A support region extends between the wiring board region and the frame region to connect the wiring board region and frame region together through the support region. The marginal region is removed from the board frame and then put back to its original position, while maintaining the wiring board region connected to the frame region through the support region. Then, the device is mounted onto the island. Next, transfer-molding is performed on the device using a die set that includes a gate through which a thermosetting resin is guided into a cavity. Then, the marginal region is removed completely from the board frame.

Abstract: A method of making an interconnect structure having an increased chip connector pad and plated through hole density is provided. In particular, the method includes the steps of providing a substrate having at least one plated through hole therein, and positioning a first conductive layer and a second conductive layer over the at least one plated through hole on opposing surfaces of the substrate. The method includes positioning a layer of dielectric material thereon on the first conductive layer. The dielectric layer includes at least one aperture selectively positioned directly over the at least one plated through hole. The substrate further includes a metal layer, and at least a pair of conductive layers that can carry signals, and power.

Abstract: A method of producing a multilayered substrate having: a first face being provided with pads bondable to electrode terminals of a semiconductor element, and a body containing a plurality of wiring line layers and insulation layers successively formed from the side of the multilayered substrate at which the face for mounting a semiconductor element is located, wherein the final insulating layer forms provides a second face of the multilayered substrate. The successive wiring line layers are connected by vias, and the second face has external connection terminal pads. The pads on the first face are formed on a metal sheet, a first layer of insulating material is formed on the metal sheet so as to cover the pads formed thereon, holes are formed through the insulating material to expose the end face of the pad, and a patterned metal layer is formed to provide a layer of wiring lines and vias connecting the pads with the wiring line on the layer of insulating material.