Abstract: A multilayer printed circuit board and a corresponding fabrication method are disclosed, which circuit board achieves a relatively high degree of wiring density and a relatively high degree of wiring design freedom. These advantages are obtained in the inventive printed circuit board by electrically connecting power conductors or ground conductors using through holes. On the other hand, signal conductors in any two adjacent signal wiring layers are electrically connected using via holes extending only through an intervening electrically insulating layer. Preferably, the electrically insulating layer is a layer of photosensitive resin and the via holes are formed using conventional photolithographic techniques.

Abstract: The specification describes methods for the manufacture of printed circuit cards which allow for final testing, including burn-in if required, of multiples of printed circuit cards as an integrated process panel prior to final packaging and singulation. This desired sequence of operations is made possible by the addition of arrays of test contacts at the edge of the integrated process panel where the test contacts can be accessed with an insertion test apparatus.

Abstract: A method and apparatus for dissipating heat from an electrical component. The method includes providing a planar element including a first electrically and thermally conductive region and a second electrically and thermally conductive region, such that the first and second regions define a spacing therebetween, and wherein the planar element includes at least one mechanically stabilizing tie connected between the first and second regions across the spacing, directly connecting a first terminal of an electrical component to the first region, directly connecting a second terminal of the electrical component to the second regions, such that the electrical component bridges the spacing, and removing the at least one mechanically stabilizing tie from between the first and second regions.

Abstract: An IC socket adapted to establish an electrical connection between an IC package and a printed board includes a socket body having a mount portion on which the IC package is mounted, a number of contact pins disposed on the socket body in substantially equally adjacent arrangement, each of the contact pins having one end to be connected to a terminal of the IC package and another end to be connected to the printed board, and an interval widening member provided for the socket body for widening a pitch interval between the other ends of adjacent contact pins so as to provide a predetermined distance therebetween.

Abstract: A terminal applicator comprising a terminal advancing mechanism which includes a mechanism for reciprocally advancing and retracting a feed finger which resiliently biases a terminal strip from a first position to a second advanced position in alignment with a crimp die, and a device for controlling reciprocal movement of the advancing mechanism by interacting with the feed finger, whereby feed and retract limits are defined.

Abstract: A crimping apparatus for producing sub-harnesses is described that includes a pair of frames, each provided with a centrally disposed crimper. Pairs of movable connector tables are provided on each frame, as well as locking devices for securing the connector tables on both ends of the respective frames. A pair of connector holding poles are provided in each of which a plurality of connectors are arranged to be settable on each of the connector tables.

Abstract: The present invention relates to an improved leadframe and method of attaching leads of a leadframe to contact pads on a carrier. The leadframe includes resilient engaging means or fingers for engaging the carrier and for exerting forces on the carrier to thereby support the carrier and accurately position and align the contact pads on the carrier with the leads. This invention overcomes the expense and inaccuracies of known leadframe designs and techniques in attaching leads to carrier contact pads using such things as fixtures for positioning the leadframe and carrier, visual alignment procedures and retaining tabs.

Abstract: A method for manufacturing a microelectronic assembly to have aligned conductive regions and dielectric regions with desirable processing and dimensional characteristics. The invention is particularly useful for producing integral capacitors, with the desired processing and dimensional characteristics achieved with the invention yielding predictable electrical characteristics for the capacitors. The method generally entails providing a substrate with a first conductive layer, forming a dielectric layer on the first conductive layer, and then forming a second conductive layer on the dielectric layer. A first region of the second conductive layer is then removed to expose a first region of the dielectric layer, which in turn is removed to expose a first region of the first conductive layer that is also removed.

Abstract: The tool is for facilitating installation of a conventional cable connector to the end section of a conventional coaxial cable. The tool has a permanently T-shaped handle defining a handle grasping segment and a handle spacing segment integrally attached to the handle grasping segment at a right angle thereto. A tool fastening sleeve is attached to the handle spacing segment. The tool fastening sleeve has an external thread adapted to engage to the internal thread of the fastening sleeve which is part of the conventional cable connector. The tool fastening sleeve also has a tool fastening sleeve channel for receiving a segment of the inner conductor extending through the conductor fastening sleeve and protruding from the proximal edge of the connector fastening sleeve. The tool is adapted to be releasably secured to the conventional cable connector and used to ergonomically push the latter within the end section of the cable.

Abstract: A method for manufacturing a connecting structure for covered wires is provided at first, a shield wire (1) and a ground wire (2) are prepared. After overlapping the ground wire (2) on the shield wire 1 across each other, respective overlapping portions of the wires (1, 2) are interposed between an upper resin tip (13) and a lower resin tip (14). Next, the upper and lower resin tips (13, 14) are oscillated with ultrasonic waves while compressing the upper and lower resin tips (13, 14) from the outside. Consequently, respective outside rinds (1d, 2b) of the wires (1, 2) are molten for removal, so that a braided wire (1c) comes into electrical contact with a core line (2a) the upper resin tip (13) is provided, on its butt face, with a stopper (13b) for defining the position of a leading end of the ground wire (2), while the lower resin tip (14) is provided, on its butt face, with a recess (14b) for receiving the stopper (13b).

Abstract: In a multi-piece solid golf ball comprising a solid core and a cover consisting of inner and outer layers, the cover inner layer is composed mainly of an ionomer resin, and the cover outer layer is composed mainly of another thermoplastic elastomer. A thermoplastic resin-base adhesive layer is interposed between the cover inner and outer layers, or a thermoplastic resin-base adhesive is blended in the inner and/or outer layer cover stock.

Abstract: A method of minimizing the volume of the depressions 240 in aluminum cavity filling processes, by-depositing a conformal first layer of aluminum alloy 220 by chemical vapor deposition, long-throw sputtering, collimated sputtering, or ionized physical vapor deposition, to partially fill the cavity 202. This layer is preferably deposited at low temperature (eg. less than 300 degrees C.) and lower deposition pressure (if deposited by sputtering). Subsequently, a second layer of aluminum alloy 230 is deposited by sputtering at temperatures greater than 350 degrees C. and at high power (e.g. greater than 10 kW) to close the mouth of cavity 202. The second layer of aluminum 230 is then forced into the remaining volume of the cavity 202. As part of the cavity 202 is filled with aluminum, alloy 220 before the high pressure aluminum extrusion/reflow, less material is required to be transported into the cavity 202. Therefore, a smaller depression 240 above the cavity is produced.

Abstract: A technique and machine for transferring discrete areas of material, such as hot stamping foil, from a carrier onto positions spaced apart along a substrate, such as paper. The carrier is dispensed at a rate that is much less than the speed of movement of the substrate. During transfer, a segment of the carrier is moved at the same speed as the substrate while, in between such material transfers, the speed of the carrier is sharply reduced and even reversed in direction in order to maintain the average speed of this carrier segment equal to the reduced speed at which the carrier is being dispensed. This is accomplished by a shuttle mechanism that is moved by its own motor, under control of a microprocessor-based motor control system, in synchronism with the speed of the substrate and transfer operations. This significantly improves the utilization of the material on the carrier, with an improved flexibility to adapt to various substrate speeds and ease of implementation in machinery.

Abstract: A cable holder for holding a flexible flat cable having a film portion, flat wires running in the film portion, a reinforcement portion where a reinforcement sheet is attached and notches formed respectively in opposite side edges of the reinforcement portion, to electrically connecting the flexible flat cable to a connector, the cable holder comprises: a holder body; a holder guide portion provided with the holder body, wherein an inner shape of the holder guide corresponds to an outer shape of the connector; and a cable holding portion having protuberances formed on the cable holding portion, for engaging respectively in the notches for holding the reinforcement portion of the flexible flat cable such that a distal end of the flexible flat cable projects into the holder guide portion.

Abstract: A rotor assembly for a rotating machine includes a substantially cylindrical main rotor body having an outer surface. A plurality of longitudinal ribs project from the outer surface of the main rotor body. A plurality of primary recesses are defined by adjacent ribs and a secondary recess is defined in the outer surface within at least one primary recess. A magnet is positioned within at least one primary recess, and a layer of adhesive between the magnet and the outer surface of the main rotor body fills the secondary recess. Magnet retaining elements. in the form of either an encapsulation layer, star-shaped retainer or elongated retaining members may also be used. The magnet retaining elements may be used alone or in combination with the adhesive layer between the magnets and the main rotor body.

Abstract: A method of mounting a plurality of electric components on a circuit substrate and thereby producing an electric circuit, including the steps of taking, immediately before each of the electric components is mounted on the circuit substrate, a first image of a first portion of the circuit substrate on which the each electric component is to be mounted and a second portion of the circuit substrate that is adjacent to the first portion, mounting the each electric component on the circuit substrate, taking, immediately after the each electric component is mounted on the circuit substrate, a second image of the mounted electric component and the second portion adjacent to the mounted electric component, and inspecting, by comparing the first and second images with each other, a state in which the each electric component is mounted on the circuit substrate.

Abstract: An air bearing slider for a disc drive includes an air bearing surface defined on the disc opposing face at least in part by a first step or cavity. An additional corner step is defined in bar processing, deeper than the first cavity. With the corner step, the first cavity does not extend quite all the way to the corner of the slider. The corner of the slider, formed on one face by dicing of the bar into individual sliders, is at an additional depth due to the corner step. The corner steps are preferably narrow, such as nominally one to two times the tolerance value on the dice cut. If a shock event occurs which causes the air bearing slider to contact the disc at certain roll and pitch angles, the corner step edge will contact the disc rather than the dice cut corner. The corner step thus lessens the probability of contact between the disc and the corners of the air bearing slider, and contact with a dice cut edge of the slider is avoided.

Abstract: An electrode substrate and a recording medium having a smooth surface with surface unevenness of 1 nm or less and a size of 1 &mgr;m□ or more are disclosed. An electrode substrate and a recording medium having a concave-shaped groove for tracking on the surface, which groove has a depth which can detect of the tunnel current from the bottom thereof by a probe electrode for scanning the surface are also disclosed. Information processing devices equipped with the smooth recording medium, an electroconductive probe arranged approximate to the recording medium and a pulse voltage application circuit for recording are also disclosed.

Abstract: A splitting apparatus includes a splitter member with a plurality of blades, and a splitting guide configured to anchor articles so that an article to be split is anchored on a splitting guide when the splitter member is moved across the splitting guide. The apparatus includes a gate which is controlled by a gate controller that selectively opens and closes the discharge aperture positioned adjacent the splitting guide so that the split article can be discharged from the splitting guide. A staging platform is provided adjacent the splitting guide for aligning the articles to be split with the splitting guide and a staging advancer is provided to move articles from the staging platform to the splitting guide, and to discharge the split articles after splitting.

Abstract: The components used in the method comprise a heat-dissipating base plate, one or more three-layer plates (the top layer consisting of copper plates and strips) and a one-piece frame designed to constitute the terminals. After the chips have been soldered onto the upper plates and connected to the strips, the inner ends of the frame are soldered to points of connection with the chips. This is followed by the encapsulation in resin and the shearing of the outer portions of the frame, which, during the process, serve to temporarily connect the terminals.