Abstract: A superelastic strand used for windings in a golf ball or as strings for a racquet of the type used for racquet sports. The strand is made with at least one fiber of a superelastic material which may be wound into a cable incorporating other fibers of polymeric or superelastic materials. The superelastic material used in the strand can be a nickel-titanium alloy which is heat treated to provide superelastic qualities.

Abstract: An electronic isolation shield mounts on a circuit board, around an electronic component to provide a minimum amount of shielding over a set period of time. The shield has a body made from a shielding material that is sized and shaped to fit around and cover the electronic component. The body has a sealing edge that is adapted to contact an upper surface of the circuit board and surround the electronic component. Resilient downwardly projecting tabs are attached to the body and each includes a securing end that extends past the sealing edge. The tab is securable to the circuit board along a securing axis. The sealing edge of the body is forced into sealing engagement with the upper surface of circuit board. The tab is laterally displaced with respect to the securing axis continuously over the set period of time so that the sealing edge is forced into the circuit board sufficiently to provide the minimum amount of shielding to the electronic component over the set period of time.

Abstract: The invention is directed to a wire cutting and stripping and terminal attaching apparatus and, in particular to an improved wire positioning mechanism for positioning the stripped end of an insulated wire in an open barrel terminal. After the insulated wire is cut and a slug of insulation is removed from the end of the wire, a gripper rotates the wire so that the bare or stripped end of the wire is located above an open barrel terminal supported on a lower die of a terminal attaching unit. An upper die is movable on the terminal attaching unit in a direction toward and away from the lower die to crimp the terminal on the stripped end of the wire. The wire positioning mechanism includes a positioning member which is mounted on the upper die and arranged to contact the gripper and push the stripped end of the wire downwardly into the open barrel terminal before the upper die operates to crimp the terminal.

Abstract: A press-connecting punch (3) for press-fitting the sheathed wire (40) into a slot between each pair of opposed press-connecting blades (33) of the press-connecting terminal (30), supported on a bed (1), is moved downward to act on the sheathed wire (40) prior to the downward movement of a clamping punch (13) for pressing a wire holding portion (35) of the press-connecting terminal (30) into clamping engagement with a sheath (41) of the sheathed wire (40).

Abstract: A through hole 5 formed in a substrate and having an electrode film on an inner surface thereof is cut and divided into two through holes or blind holes each of substantially semicircular arc shape through dicing processing using a rotating blade, and one of the-divided through holes 5 of substantially semicircular arc shape is used as an external connection terminal 3 of substantially semicircular concave arc shape thereby to form a surface mounted electronic parts having a plurality of the external connection terminals 3. The height H of the substantially semicircular arc formed at an inner surface of each of the external connection terminals is set to be equal to or smaller than a value obtained by subtracting twice a thickness t of the electrode film from a radius R of a curvature of the arc.

Abstract: A method of supplying electric components (“ECs”) with an EC supplying apparatus including an EC-supply table including a displaceable table displaceable in a reference direction, and EC-supply units provided on the displaceable table such that respective EC-supply portions of the units are arranged along a line parallel to the reference direction, each of the EC-supply units including a driven member and a carrier-tape feeding device which feeds, based on the driven member being driven, a carrier tape carrying the ECS at a EC-carry pitch, at a tape-feed pitch equal to a quotient obtained by dividing the EC-carry pitch by an integral number, so that the ECs are positioned, one by one, at the EC-supply portion of each unit, a table displacing device which displaces the displaceable table and positions the EC-supply portion of each EC-supply unit, at an EC-supply position, a drive member which is provided near the EC-supply position, and a drive device which drives the drive member which in turn dri

Abstract: An assembly tool for attaching components such as connector plugs or receptacles to a printed circuit board includes a printed circuit board support plate and a sliding member. The sliding member is movable between a first position and a second position relative to the support plate. A holder is pivotally connected to the sliding member and carries a component to be attached to the printed circuit board. A first actuator is connected to a sliding member and moves the sliding member between the first and second positions. A second actuator is connected to the holder and pivots the holder between a receiving position and a mounting position. A component is brought into proximity with the holder and checked for alignment and polarity. Once checked, the component is placed on the holder.

Abstract: A silicon substrate on which a silicon dioxide film having a groove is formed is placed on a sample stage disposed in a vacuum chamber. Subsequently, a titanium film and a tungsten film are deposited sequentially on the silicon dioxide film. The surface of the tungsten film is nitrided by using a plasma under the pressure maintained at 10 Pa or higher inside the vacuum chamber, so as to form a tungsten nitride film. After a copper film is deposited on the tungsten nitride film, the portions of the titanium film, tungsten film, tungsten nitride film, and copper film located outside the groove are removed, thus forming a buried interconnecting wire made of copper.

Abstract: A press-connecting punch (3) for press-fitting the sheathed wire (40) into a slot between each pair of opposed press-connecting blades (33) of the press-connecting terminal (30), supported on a bed (1), is moved downward to act on the sheathed wire (40) prior to the downward movement of a clamping punch (13) for pressing a wire holding portion (35) of the press-connecting terminal (30) into clamping engagement with a sheath (41) of the sheathed wire (40).

Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.

Abstract: The minimum spacing between wires disposed on a printed circuit board of a printed circuit board ball grid array package is reduced. Wiring layers are narrower than in the prior art because they are not plated and because only one metal layer is plated on the wiring layers. The narrower wiring layers can be formed easily with small spaces between wires.

Abstract: An apparatus is provided for crimping a crimpable connector onto at least one electrical conductor. The apparatus includes a pair of crimping arms defining a staging area behind a crimping area. The staging area allows a first connector to be fed thereto and moved to the crimping area to be crimped thereat. A second connector is fed to the staging area, and an ejector moves the second connector into engagement with the first connector to eject the first connector from the crimping area while the second connector moves into the crimping area.

Abstract: This method, offering quiet, pollution-free cutting, consists in emitting at least one pressurized jet of water which is directed at and moved over the vegetation to be cut, the pressurized jet or jets of water being themselves the cause, by mechanical reaction, of their movement, in particular their rotary movement. The cutting device that puts this method into effect comprises means for supplying water at pressure, and a rotating head provided at its periphery with at least one nozzle through which a cutting jet of water is ejected, the jet or jets of water generating, by reaction, rotation of the head and therefore of the jet or jets themselves. This device may be in the form of a portable appliance.

Abstract: A circuit substrate utilizes buried edge connectors. The buried edge connectors are mechanically disposed within the edge of the substrate and have substantial thickness. The configuration and method for making the same provides relatively large edge connectors mechanically constrained in the edge of a circuit substrate.

Abstract: An electronic-component mounting system, including a printed-circuit-board supporting device which positions and supports a printed circuit board, a movable table which is movable, relative to the printed-circuit-board supporting device, in at least one of an X direction and a Y direction which are perpendicular to each other and cooperate with each other to define an X-Y plane parallel to a board-support plane on which the printed circuit board is supported by the supporting device, an electronic-component supplying device which is mounted on the movable table and which includes a component-supply portion from which electronic components are supplied one by one, and an electronic-component mounting device which is mounted on the movable table together with the electronic-component supplying device and which receives the electronic components one by one from the component-supply portion of the supplying device and mounts at least one of the electronic components on the printed circuit board positioned and sup

Abstract: A method is provided for producing a capacitor to be embedded in an electronic circuit package comprising the steps of selecting a first conductor foil, selecting a dielectric material, coating the dielectric material on at least one side of the first conductor foil, and layering the coated foil with a second conductor foil on top of the coating of dielectric material. Also claimed is an electronic circuit package incorporating at least one embedded capacitor manufactured in accordance with the present invention.

Abstract: A connector utilized to electrically connect together conductive pads disposed on different substrates includes a flexible substrate having a plurality of conductive through-holes therein. A conductive line formed in the flexible substrate extends between at least two of the conductive through-holes. A plurality of contacts is mounted in the conductive through-holes of the flexible substrate. Each contact includes a post connected to a base of a crown-shaped head having a plurality of projections around the periphery of the base that extend away from the base in the direction opposite the post. The post of each contact is soldered into one of the plurality of conductive through-holes. A compression mat positioned on a side of the flexible substrate opposite the crownshaped heads includes a plurality of resilient cylinders that extend away from a resilient base. Each resilient cylinder has a distal end alignable in registration with a distal end of the post of one of the plurality of contacts.

Abstract: A circuit-component supplying apparatus including a plurality of feeders each of which stores a plurality of circuit components of a same sort and which supplies the components one by one from a component-supply portion thereof, a movable table which holds the feeders such that the respective component-supply portions of the feeders are arranged along a line and which is movable in a direction parallel to the line, and a table-driving device which moves and stops the movable table to position the component-supply portion of each of the feeders at a predetermined component-supplying position, the feeders including at least one connected feeder which includes a main portion which is held by the movable table and which supports a feeding mechanism which feeds the circuit components one by one to the component-supply portion of the connected feeder, a component-holding portion which holds the circuit components and from which the components are fed to the main portion by the feeding mechanism, and a connecting de

Abstract: A method of manufacturing a printed circuit board with a polymer thick-film (PTF) resistor whose dimensions can be defined with improved precision by providing a circuit board construction having a planar surface where the resistor is to be deposited. To achieve the desired board construction, the interconnect for the resistor is pattern plated using a permanent photodielectric layer as a plating mask instead of a sacrificial plating resist. The interconnect can be patterned before or after the PTF resistor ink is printed. The x and z dimensions (width and thickness, respectively) of the resistor are determined by the deposition process, while the y dimension (electrical length) is accurately determined by copper terminations.

Abstract: An electrical connector which includes an insulative body which has a leg portion and a top portion which extends generally perpendicularly from the leg second portion. A conductive contact which includes a retention section and a resilient section is also included in the electrical connector. The contact is fixed to the top section and the resilient section extends along the leg section. The connector may be interposed between a electrical device and a printed circuit board.