Abstract: A vibration damping silicone composition of superior vibration damping properties and superior long-term storage stability contains (A) a silicone oil, and (B) a silicone resin powder. Component (B) is a solid at room temperature, and has a volatile component content of not more than one percent by weight, after being heated for two hours at 200° C.
Abstract: An epoxy resin composition comprising (A) an epoxy resin, (B) a curing accelerator, and (C) an inorganic filler is light transmissive when it satisfies formulae (1) and (2):
[{2(nA2+nC2)−(nA+nC)2}/2]½<3.0×10−3 (1)
[{2(fA2+fC2)−(fA+fC)2}/2]½<1.0×10−5 (2)
wherein nA is the refractive index at T1° C. of the cured unfilled composition, nC is the refractive index at T1° C. of the inorganic filler, fA is a temperature coefficient of the refractive index of the cured unfilled composition, and fC is a temperature coefficient of the refractive index of the inorganic filler. The cured composition has improved heat resistance, humidity resistance and low stress as well as high transparency over a wide temperature range. The composition is suited for the sealing of optical semiconductor devices.
Abstract: The substrate of the invention is coated with a mesoporous film. It is characterized in that chemical molecules, especially hydrophobic/oleophobic molecules, are bonded to the mesoporous film. The invention also relates to a process for manufacturing this substrate, in which: the substrate is brought into contact with a composition formed from organic assembling groups and from a precursor for the mesoporous material; the precursor precipitates around the assembling groups and polymerizes; and the assembling groups are removed. This process is distinguished by the fact that chemical molecules, such as hydrophobic/oleophobic molecules, are then brought into contact with the mesoporous film. The invention also relates to glazing, for buildings or transportation vehicles, which includes this substrate.
Abstract: Curable compositions, reaction products of which are reworkable through thermal decomposition, are provided. Specific compounds useful in such curable compositions, as well as curable compositions and thermosets incorporating such compounds, are provided in the present invention. The compounds include a cyclic hydrocarbon moiety including an oxirane or thiirane group and an aromatic ether moiety including an oxirane or thiirane group. The cyclic hydrocarbon moiety and the aromatic ether moiety are joined to each other through an oxycarbonyl-containing linkage or a thiocarbonyl-containing linkage, preferably a secondary or tertiary linkage. Compositions incorporating such compounds are capable of curing by exposure to a specific temperature, and are decomposable at a temperature in excess of the curing temperature, thus providing a composition which is reworkable.
Abstract: A lightfast epoxy resin is formed by phosgenating Bisphenol A by reaction with phosgene to produce Bisphenol A bischloroformate. The Bisphenol A bischloroformate is then reacted with either epichlorohydrin, glycidol or pinacol and another chemical to produce a lightfast epoxy resin. By phosgenating the Bisphenol A prior to the reaction with either epichlorohydrin, glycidol or pinacol and another chemical, the resulting epoxy resin has improved lightfastness and is not degraded by sunlight. The epoxy resin of the present invention can be used in paints, coatings, and plastics for vehicles.
Abstract: A method for producing a composition for vapor deposition comprising sintering a vapor source mixture prepared by mixing vapor sources that contain titanium dioxide and niobium pentoxide. The method is capable of forming a high-refraction layer even in low-temperature vapor deposition on a substrate. An antireflection film is formed having good scratch resistance, good chemical resistance and good heat resistance, of which the heat resistance decreases little with time, that is useful in a variety of optical elements.
Abstract: The invention relates to polyurethane materials, cross-linked by silane polycondensation, containing alkoxylsilane functional polyurethanes, alkaline fillers, phosphorous compounds aminosilanes, organometallic compounds and optionally additional auxiliary agents, to a method for their production and to the use thereof.
Type:
Grant
Filed:
November 15, 2001
Date of Patent:
September 30, 2003
Assignee:
Bayer Aktiengesellschaft
Inventors:
Lutz Schmalstieg, Ralf Lemmerz, Ulrich Walter, Alexander Eckhardt
Abstract: The present invention discloses a dielectric composition having two steps of laminating temperatures. The composition is comprised of: a diamine curing agent containing asymmetrical chemical structures with different reactivity; an epoxy resin compound, containing at least two epoxy groups; and inorganic powder. In addition, flame retardant and toughener are added dependent on the requirements.
Type:
Grant
Filed:
December 18, 2001
Date of Patent:
September 30, 2003
Assignee:
Industrial Technology Research Institute
Abstract: Siloxane compositions are useful as traction fluids in traction drive systems which are subject to varied operating temperature and pressure conditions. Specific siloxane compositions included contain units of formulae
(I) (R3SiO1/2)(RSiO3/2)(SiO4/2),
(II) (R3SiO1/2)(RSiO3/2),
(III) (R3SiO1/2)(SiO4/2),
(IV) (R3SiO1/2)(R2SiO2/2)(RSiO3/2),
(V) (R3SiO1/2)(R2SiO2/2), and
(VI) (R2SiO2/2)a
in varying mole percents, where a is an integer ranging from 3 to 20 and each R is independently selected from alkyl groups comprising 1 to 18 carbon atoms and aryl groups comprising 6 to 18 carbon atoms.
Type:
Grant
Filed:
December 28, 2001
Date of Patent:
September 23, 2003
Assignee:
Dow Corning Corporation
Inventors:
Kenneth Christopher Fey, Glenn Frederick Viaplana Gordon, Terrence Keith Hilty, Russell Keith King, Tina Marie Leaym, Lori Ann Stark-Kasley, Gary Michael Wieber, Eugene Dale Groenhof
Abstract: The invention provides polyepoxide-based adhesives containing cycloaliphatic-containing polyepoxide resin, aromatic polyepoxide resin, and 9,9-bis(3-methyl-4-aminophenyl)fluorene. The adhesives provide improved peel and shear strength.
Type:
Grant
Filed:
November 8, 2001
Date of Patent:
September 23, 2003
Assignee:
3M Innovative Properties Company
Inventors:
Clayton A. George, William J. Schultz, Wendy L. Thompson
Abstract: Disclosed is a method of preparation of a siloxane-functionalized high 1,4-cis polybutadiene using a siloxane compound, in which the siloxane group expands the usage of the high 1,4-cis polybutadiene.
Abstract: By using a curable composition comprising, (A) per 100 parts by weight of an epoxy resin, (B) from 1 to 50 parts by weight of a reactive silicon group-containing polyoxyalkylene polymer, and (C) from 1 to 90 parts by weight of a curing agent for epoxy resins, the working properties of an existing rubber-modified epoxy resin are improved to thereby give stable adhesion properties (for example, improved peel strength) without worsening the shear strength.
Abstract: A curable underfill encapsulant composition which is especially useful in the no-flow underfill encapsulation process. The composition contains an epoxy resin, a fluxing agent, a linear polyanhydride and a catalyst. In an alternative embodiment, the composition also contains a linear anhydride. Various additives, such as surfactants and coupling agents may also be added to the composition.
Type:
Grant
Filed:
January 31, 2002
Date of Patent:
September 23, 2003
Assignee:
National Starch and Chemical Investment Holding
Corporation
Inventors:
Paul Morganelli, Anthony DeBarros, Brian Wheelock, Jayesh Shah
Abstract: The invention relates to polysiloxanes from cross-linkable monomers based on cyclosiloxanes and their use in polymerizable compositions. The invention relates in particular to polysiloxanes from sol-gel-condensable cyclosiloxane(meth)acrylates as well as resinous compositions, obtainable by hydrolytic condensation of one or more hydrolyzable and condensable cyclosiloxane(meth)acrylates.
Type:
Grant
Filed:
September 19, 2001
Date of Patent:
September 23, 2003
Assignee:
3M Espe AG
Inventors:
Peter Bissinger, Oswald Gasser, Rainer Guggenberger, Wolfgang Soglowek, Gunther Eckhardt
Abstract: The invention relates to new improved double-metal cyanide (DMC) catalysts for the preparation of polyether-polyols by polyaddition of alkylene oxides on to starter compounds containing active hydrogen atoms, the catalyst comprising a double-metal cyanide compound, an organic complexing ligand and 5-80 wt. %, based on the amount of catalyst, of a polyester.
For the preparation of polyether-polyols, the new improved catalysts have significantly shortened induction times and at the same time a greatly increased activity.
Abstract: Coating compositions are provided which include a polysiloxane comprising at least one reactive functional group, at least one material comprising at least one reactive functional group, and at least one boron-containing compound. Also provided are multi-layer composite coatings formed from a basecoat deposited from a pigmented coating composition and a topcoat applied over the basecoat, the topcoat deposited from the aforementioned coating composition. Methods for repairing a multi-layer composite coating and coated substrates are also provided. The compositions of the invention provide highly scratch resistant coatings, particularly highly scratch resistant color-plus-clear coatings, which have excellent intercoat adhesion to subsequently applied coating layers.
Type:
Grant
Filed:
July 31, 2001
Date of Patent:
September 23, 2003
Assignee:
PPG Industries Ohio, Inc.
Inventors:
Richard J. Sadvary, Lawrence G. Anderson, Shiryn Tyebjee, Thomas R. Hockswender
Abstract: There are provided articles coated with high-performance water-repellent films with high hardness that can withstand outdoor use, which are water-repellent film-coated articles that comprise a substrate and a water-repellent film composed mainly of silicon oxide and having a water-repellent group coated on the surface of the substrate, and are characterized by containing at least one type of metal oxide selected from the group consisting of magnesium oxide, calcium oxide, strontium oxide and boron oxide, as well as a process for preparation of such water-repellent film-coated articles at a high rate of productivity and a coating liquid composition for preparation of such water-repellent film-coated articles.
Abstract: The method consists in hydrolyzing an initial volume Vsi of a precursor material comprising at least one polyalkoxysilane with a quantity of water such that
x
⁢
⁢
H
2
⁢
O
x
⁢
Si
≥
10
where x H2O and x Si represent the number of moles of H2O and Si present, respectively, the concentration of the hydrolysate up to a volume substantially equal to the initial volume Vsi, leaving the concentrated hydrolysate until segregation into an aqueous phase and an organo-silicon phase, and recovery of the organo-silicon phase.
Type:
Grant
Filed:
June 15, 2001
Date of Patent:
September 23, 2003
Assignee:
Essilor International Compagnie Generale d'Optique
Inventors:
John Biteau, Jean-Pierre Boilot, Frédéric Chaput
Abstract: A curable composition comprising (A) a fluorinated amide compound having alkenyl radicals, (B) a fluorinated organohydrogensiloxane having SiH radicals, (C) a platinum group compound, (D) a silica powder, (E) an organosilane or organosiloxane having a monovalent perfluorooxyalkyl or perfluoroalkyl, divalent perfluorooxyalkylene or perfluoroalkylene radical and a hydroxy and/or alkoxy radical, and (F) an organosilane or organosiloxane having an alkenyl radical, a monovalent perfluorooxyalkyl or perfluoroalkyl, divalent perfluorooxyalkylene or perfluoroalkylene radical, and a hydroxy and/or alkoxy radical cures into a fluorinated elastomer that has good solvent resistance, chemical resistance, heat resistance, low-temperature properties, mold release, water and oil repellency and weather resistance as well as significantly improved mechanical strength and compression set.
Abstract: A liquid thermosetting insulating resin composition and a method for permanently filling holes in a printed circuit board by the use of the composition are provided. The liquid thermosetting insulating resin composition comprises (A) an epoxy resin assuming a liquid state at room temperature, preferably in combination with (B) a phenolic resin assuming a liquid state at room temperature, (C) a curing catalyst, and (D) a filler, wherein the filler (D) contains a spherical filler and a ground filler. Preferably the spherical filler includes a spherical fine filler and a spherical coarse filler. In a method for permanently filling holes in the printed circuit board, the composition is applied to the board so as to fill the holes in the printed circuit board and precured by application of heat. Thereafter, the parts of the precured composition protruding from a surface defining the holes is removed by polishing and then the precured composition is further heated to cause final curing thereof.