Abstract: Extinguishing medium in pasty to solid form for quenching electric arcs, consisting of a silicone polymer or a mixture of such silicone polymers, with the silicone polymer or the mixture of silicone polymers containing a mineral compound or a mixture of such compounds in powder form as a filler; use of the extinguishing medium to quench electric arcs in overcurrent-protection elements, in electronics and microelectronics; in high-voltage engineering; or in repeating fuses, and electrical devices, machines and systems which contain an extinguishing medium according to the invention.

Abstract: Hyperbranched polymers having a plurality of at least two different types of functional groups are described. Specific embodiments include hyperbranched polymers having functional groups of a first type that are substantially uniformly distributed throughout the hyperbranched polymer molecule and a second type of functional group that is substantially uniformly distributed at the terminals of the hyperbranched polymer molecule. The hyperbranched polymers having different types of functional groups are synthesized by reacting one or more monomers having functional groups that are capable of reacting during a set of polymerization conditions to form a hyperbranched polymer, wherein at least one of the monomers contains latent functional groups that are not reactive during polymerization.

Abstract: A film-type adhesive for electronic components comprises a polyimide resin made up of specific repeating units and having a weight-average molecular weight of 5,000-150,000 in combination with an epoxy resin bearing at least two glycidyl groups per molecule. The adhesive has a weight ratio of the polyimide resin to the epoxy resin within a range of 50/50 to 5/95, and a film thickness of 20-150 &mgr;m. Such a film-type adhesive makes it possible to simplify and shorten the duration of assembly operations for electronic components having various types of adherend surfaces.

Abstract: A curable, two-component mortar composition is described, which is based on a curable epoxide resin, at least one reactive diluent for the epoxide resin, an amine curing agent and one or more inorganic fillers, as well as, optionally, curing catalysts, rheological aids, thixotropizing agents, stabilizers, dispersants, agents to control the reaction rate and wetting agents, the amine curing agent of the curable epoxide resin and the reactive diluent being kept separate from one another to inhibit any reaction, wherein the mortar composition contains a cross-linking reactive diluent, which has functional epoxy groups with an epoxy functionality of at least 2. The mortar composition is used to fasten anchoring means in boreholes.

Abstract: A two-component epoxy-based adhesive comprising a resin component and a curing agent. The resin component comprises an epoxy resin, a polymer polyol, and fumed silica. The curing agent comprises a polyoxyalkyleneamine, an amine terminated butadiene-acrylonitrile polymer, tris(2,4,6-dimethlaminomethyl)phenol, polyamide resin, silane and fumed silica. The adhesive composition is particular useful for bonding of metals, plastics and composites and for functions such as laminating, honeycomb bonding, automotive assembly and construction assembly.

Abstract: A corona shielding band having reproducible qualities and allowing only a small increase in dielectric losses in a winding of an insulation of electrical machine is made by impregnating a woven-type support material with an active resin solution containing an inorganic filler with a coating composed of antimony-doped tin oxide and then removing the solvent by a thermal processing to produce the corona shielding band.

Abstract: It is an object of the invention to provide a composition for forming a polishing pad comprising substances having specific functional groups exhibiting excellent hydrophilic properties and the like, a crosslinked body for polishing pad as well as a polishing pad with excellent water resisting and durability which exhibits excellent polishing performance including a high removal rate and method for producing thereof. The composition for forming a polishing pad comprises a crosslinkable elastomer having no carboxyl, amino, hydroxyl, epoxy, sulfonic acid and phosphoric acid groups, and a water-insoluble substance having at least one functional group selected from the group consisting of carboxyl, amino, hydroxyl, epoxy, sulfonic acid and phosphoric acid groups. And a water-soluble substance such as cyclodextrin may be contained. A polishing pad can be manufactured using the composition above or the crosslinked body for polishing pad, and porous polishing pads may also be obtained.

Abstract: An isocyanate adduct comprising the reaction product of a composition comprising in admixture a polyisocyanate, a silicone having dimethylsiloxane segments containing one or more of an isocyanate-reactive group bonded to said segments through an intermediate organic group, a reactant containing one or more of an isocyanate-reactive group, and one or more acid group or amine group, optionally an organic substance having one or more isocyanate-reactive groups, and compound providing counterion for said acid or amine group, wherein either the silicone, or the reactant, or both, have a single isocyanate-reactive group.

Abstract: Disclosed is a biocompatible membrane comprising a hydrophilic polyurea composition. The hydrophilic polyurea composition comprises the product of a reaction mixture comprising (a) an amino terminated polysiloxane, (b) a hydrophilic polymer selected from the group consisting of a diamino terminated copolymer of polypropylene glycol and polyethylene glycol, polyethylene glycol, polypropylene glycol and diamino polyethylene glycol having an average molecular weight of from about 400 to about 2000, and (c) a diisocyanate selected from the group consisting of hexamethylene-1,6-diisocyanate, dicyclohexylmethane 4,4′-diisocyanate, and isophorone diisocyanate, and constituting about 50 mole % of the reaction mixture. In this mixture, (a) and (b) constitute a polymeric portion of the reaction mixture, and the hydrophilic polyurea composition has a ratio of its diffusion coefficient for oxygen to its diffusion coefficient for glucose of from about 2,000 to about 10,000.

Abstract: An adhesive for semiconductor chips contains a first resin component which is polymerizable, a first hardener for inducing a self-polymerization reaction of the first resin component and a second hardener which is addition-polymerized with the first resin component. When the adhesive is applied on a wiring board and a semiconductor chip is applied thereon and heat is applied, the second hardener is addition-polymerized with the backbone of the three-dimensional network formed by the self-polymerization reaction of the first resin component. The first temperature at which the addition polymerization zone becomes a rubbery structure is lower than the second temperature at which the backbone becomes a rubbery structure, so that the elastic modulus loss sharply increases at the first temperature to reduce the stress between the semiconductor chip and the wiring board.

Abstract: A weldable curable coating composition with improved intercoat adhesion is disclosed comprising a resinous binder comprising a polymer (A) with functional groups and a crosslinking agent with functional groups reactive with those of polymer (A); an electroconductive pigment; and an adhesion promoting compound comprising boron containing compounds. In an alternative embodiment, the adhesion promoting compound may comprise siloxane polymer reacted with aluminates, titanates, zirconates, silicates, siloxanes, silanes, and mixtures thereof, wherein each component is different.

Abstract: A method for making flexible epoxy resins by curing an epoxide and a bis-phenol with an aliphatic secondary diamine having the structural formula (I) or (II): where R1 and R2 are each individually an alkyl, alkenyl, aryl, or arylalkyl group having from about 1 to about 20 carbon atoms, and R3 and R4 are each individually an alkyl or alkenyl group having from about 1 to about 20 carbon atoms, or hydrogen.

Abstract: An optical resolver comprising an optically active substance made of tris-(2,3-epoxypropyl)isocyanurate, is presented. The optical resolver comprises an optically active tris-(epoxyalkyl)isocyanurate or its derivative, or an optically active derivative of a tris-(epoxyalkyl)isocyanurate. Particularly, the optical resolver comprises optically active tris-(2,3-epoxypropyl)isocyanurate or its derivative, or an optically active derivative of tris-(2,3-epoxypropyl)isocyanurate. Having supported on a carrier, an optically active tris-(2,3-epoxypropyl)isocyanurate or its derivative, or an optically active derivative of tris-(2,3-epoxypropyl)isocyanurate, can be made to be a packing for use in high-performance liquid chromatography, whereby efficient optical resolution can be carried out.

Abstract: A multi-layered thermoplastic label comprising: a core layer comprising high density polyethylene (HDPE) wherein said core layer has a first side and a second side; a first skin layer comprising a thermoplastic material wherein said skin layer has a first side and a second side and the second side of the first skin layer is adjacent to the first side of the core layer; wherein said thermoplastic label is oriented in at least one direction.

Abstract: A curable epoxy resin composition comprising (a) a cycloaliphatic epoxy resin that is liquid at RT and, suspended therein, a core/shell polymer, (b) a polycarboxylic anhydride and (c) fillers, wherein the composition is flame-retardant because two different fillers (c1) and (c2) are present, the nature of filler (c1) being such that, starting at RT, it is able to release water as the temperature rises, the total proportion of fillers (c1) and (c2) is from 58 to 73% by weight, based on the total amount of components (a), (b), (c1) and (c2), and the ratio by weight of the fillers (c1):(c2) is from 1:3 to 1:1, is suitable as a casting resin, especially in the impregnation of electrical coils and in the production of electrical components, such as air-cooled transformers, bushings, insulators, switches, sensors, converters and cable end seals.

Abstract: A nanopositioner made of novel materials is provided. The materials exhibit desirable properties such as low density and low coefficient of thermal expansion (CTE) derived from their ceramic matrices, but show even better (higher) Young's modulus of elasticity and flexural strength than neat ceramics. The materials are also amenable to wire electric discharge machining.

Abstract: The present invention provides a thermal stable low elastic modulus material, which has high thermal stability, is little in change in dynamic characteristics such as coefficient of thermal expansion and elastic modulus within a temperature of −50° C. to 300° C., has an elastic modulus at room temperature of 2-0.01 GPa and is high in reliability of electric insulation regardless of a temperature fluctuation, and provides a semiconductor device using the same. The present invention also provides a thermal stable low elastic modulus resin composition obtained by heat-curing a mixture containing a polyimide, polyamide-imide or polyamide resin or resin precursor, whose cured product has an elastic modulus measured at −50° C. of 2-0.01 GPa, and an oligomer of an organosilicon compound having a functional group capable of causing addition reaction with an NH and/or COOH group.

Abstract: There is disclosed a rubber composition comprising (A) butadiene rubber and/or (B) isoprene rubber in the form of liquid and (C) silicone rubber at a {(A)+(B)}/(C) ratio by weight in the range of 97/3 to 5/95. The composition is capable of affording an elastic member which has a low hardness and excellent wear resistance, and which is well suited for use in a variety of part items that are installed in an image formation apparatus such as an electrophotographic apparatus and an electrostatic recording apparatus, including copying machinery, printers, facsimile apparatus and the like, in particular a developing roller. There are also disclosed a developing roller which comprises the above rubber composition, is improved in wear resistance for a developer without causing high hardness thereof, and is capable of affording a steadily favorable image without fail for a long period of time; and further a developing apparatus which comprises the above developing roller.

Abstract: Elastomer-modified Epoxy-polysiloxane compositions of this invention are prepared by combining a silicone intermediate, with an epoxy resin, an elastomeric resinous intermediate, a polyfunctional amine, an optional organometallic catalyst, and optional fillers, pigments, and processing agents. The composition is prepared using a sufficient amount of water to promote hydrolysis of the polysiloxane and the polycondensation of the silanols produced by such hydrolysis. In its cured form, the epoxy-polysiloxane composition exists as a uniformly dispersed arrangement of linear epoxy chain fragments that are cross-linked with a continuous polysiloxane polymer chain, wherein either or both of the epoxy and/or polysiloxane polymers are elastomer modified to provide coatings and floorings having significantly improved properties of impact resistance, flexibility, crack resistance, and abrasion resistance with compared to conventional epoxy systems.

Abstract: The present invention provides a thermal stable low elastic modulus material, which has high thermal stability, is little in change in dynamic characteristics such as coefficient of thermal expansion and elastic modulus within a temperature of −50° C. to 300° C., has an elastic modulus at room temperature of 2-0.01 GPa and is high in reliability of electric insulation regardless of a temperature fluctuation, and provides a semiconductor device using the same. The present invention also provides a thermal stable low elastic modulus resin composition obtained by heat-curing a mixture containing a polyimide, polyamide-imide or polyamide resin or resin precursor, whose cured product has an elastic modulus measured at −50° C. of 2-0.01 GPa, and an oligomer of an organosilicon compound having a functional group capable of causing addition reaction with an NH and/or COOH group.