Abstract: A method of producing a rubber-resin composite whose vulcanized rubber and thermoplastic resin moldings are bonded together by high adhesive strength at low cost, satisfying both moldability and mechanical strength. It comprises: (1) making the vulcanized rubber molding by vulcanization molding, (2) forming an adhesive layer, whose principal ingredient is chlorosulfonated polyethylene, on a surface of the rubber molding to be bonded to the resin, and (3) while arranging the rubber molding in a mold, pouring the thermoplastic resin containing 30˜60 wt. % of glass fiber in a molten state into the mold to form the resin molding.

Abstract: This invention relates to a method of producing urethane-modified air-drying polyester dispersions and to the use thereof in coating media.

Abstract: A phase change composition comprises: a matrix comprising an organofunctional silicone wax, and a thermally conductive filler. The composition can be used as a thermal interface material in electronic devices. The composition is formulated to have any desired phase change temperature.

Abstract: An underfill material is presented that may be used between an electrical component and a substrate. The underfill material may be a cured epoxy resin composition comprising a liquid or semisolid epoxy resin and a polyfunctional anhydride polymer and/or oligomer curing agent. The use of anhydride polymers and/or oligomers decrease the volatilization of the composition, thereby reducing the porosity of the underfill material. By changing substituents of the anhydride polymer and/or oligomer, the underfill material may be designed to modify viscosity, decrease moisture adsorption, volatilization and modulus, improve mechanical properties, and enhance adhesion.

Abstract: A sheet resin composition is adhered to a silicon wafer. The sheet resin composition supports the silicon wafer during back grinding and dicing into chips. Further, the sheet resin composition interfacial underfills between a chip from the wafer and a substrate during subsequent fabrication of a semiconductor device, the chip being flip chip mounted to the substrate.

Abstract: A composition suitable for use in dental medicine and/or dentistry polymerizable by cationic polymerization consists of one or more epoxy compounds, a plasticizer, a catalyst for hardening by ring opening, a catalyst for hardening by light and an accelerator consisting of a non alkaline tertiary amine. At radiation with a light having a wavelength of 340-500 nm the composition hardens practically free of contraction and adhesiveness.

Abstract: The subject matter of the invention is a base sheet for the preparation of a flexible printed circuit board which is a three-layered laminate consisting of (a) an electrically insulating film of a plastic resin such as a polyimide, (b) an epoxy resin-based adhesive layer and (c) a copper foil bonded to the film (a) with intervention of the adhesive layer (b). The base sheet can exhibit excellent performance in respect of peeling resistance, soldering heat resistance, dimensional stability and solvent resistance as well as workability into a printed circuit board only when each of the layers (a), (b) and (c) has a specified thickness in a narrow range of 10-30 &mgr;m, 5-15 &mgr;m and 5-15 &mgr;m, respectively.

Abstract: A composition and method for making a silicone composition is provided which comprises at least one polysiloxane or silicone resin containing at least one linker, and at least one molecular hook.

Abstract: Disclosed is an organic domain/inorganic domain hybrid material comprising: an organic domain comprising at least one water-soluble or water-dispersible organic polymer having a plurality of functional groups, and an inorganic domain, the organic domain and the inorganic domain being ionically bonded to each other through the functional groups of the organic polymer to form an ionically crosslinked structure, the inorganic domain comprising a plurality of inorganic bridges, each of which independently comprises at least one silicon atom, at least two oxygen atoms and at least two divalent metal atoms, wherein the weight ratio of the organic domain to the inorganic domain is at least 1.0.

Abstract: There are provided an inorganic filler, multi-functional filler, an organic compound filler, a modified filler, and a dental coloring filler suitable in use as a filler in a dental composition, compositions having a resin matrix of an organic polymer material, as well as a process for producing the same. Disclosed are an inorganic filler which comprises an inorganic fine particle, wherein the surface of the inorganic fine particle is covered with polysiloxane. Also disclosed is a multi-functional filler which comprises an inorganic fine particle containing an acid reactive element, wherein a cement reactive phase is formed on the surface of the inorganic fine particle, and the cement reactive phase is further covered with polysiloxane. Also disclosed is an organic compound filler which comprises an organic-inorganic polymer particle or an organic polymer particle, wherein the surface of the organic-inorganic polymer particle or an organic polymer particle is covered with an inorganic film.

Abstract: An epoxy resin composition giving a cured resin plate which, after 60 hour standing at 150° C. and at the saturated vapor pressure, has a water absorption of 3.5% by weight or lower; a prepreg which comprises the epoxy resin composition and reinforcing fibers; and a fiber-reinforced resin roll which is 1) a laminate comprising fiber-reinforced resin layers each comprising reinforcing fibers and a matrix resin, wherein the matrix resin is a resin composition giving a cured resin plate which, after 60 hour standing at 150° C. and at the saturated vapor pressure, has a water absorption of 3.5% by weight or lower; or 2) a laminate comprising (i) at least one fiber-reinforced resin layer comprising long reinforcing fibers having an elastic modulus of 600˜800 Gpa and a resin composition and (ii) at least one fiber-reinforced resin layer comprising long reinforcing fibers having an elastic modulus of 140˜300 Gpa and a resin composition.

Abstract: The present invention aims at an improvement in temperature-cycle resistance after packaging in semiconductor devices and also an improvement in moisture-absorbed reflow resistance, and provides an adhesive having a storage elastic modulus at 25° C. of from 10 to 2,000 MPa and a storage elastic modulus at 260° C. of from 3 to 50 MPa as measured with a dynamic viscoelastic spectrometer, and also a double-sided adhesive film, a semiconductor device and a semiconductor chip mounting substrate which make use of the adhesive, and their production process.

Abstract: Aqueous coating material comprising (A) water-dispersible hydroxy-functional binder component containing urethane groups, (B) water-dispersible binder component containing urethane groups and blocked isocyanate groups, (C) water-dispersible amino resin, and optionally (D) water-dispersible hydroxy-functional polyester, the binder component (B) being preparable by (B1) preparing a polyurethane prepolymer containing isocyanate groups from at least one polyol and at least one polyisocyanate, (B2) reacting the polyurethane prepolymer (B1) containing isocyanate groups with a chain extender to give a hydroxyl-containing chain-extended polyurethane prepolymer, (B3) reacting the hydroxyl-containing chain-extended polyurethane prepolymer (B2) with at least one polyisocyanate to give a further polyurethane prepolymer containing isocyanate groups, and (B4) blocking some or all of the isocyanate groups of the chain-extended polyurethane prepolymer (B3) containing isocyanate groups with a blocking agent to give a polyuret

Abstract: The present invention relates to a nitrogen-containing epoxy resin of the following formula: wherein R's are the same or different and each represents a hydrogen atom or —R13—C6-10 aryl-(OR14)p, and the aryl group is optionally substituted with C1-6 alkyl group, in which R13 represents a C1-6 alkylene group or a phenylene —CH2— group optionally substituted with a hydroxy group, R14 represents a glycidyl group, and p is an integer of 1 or 2, provided that at least one R group is not a hydrogen atom; R1 represents a phenyl group or —N(R)2 group in which R is defined as above. The resin is produced from sequentially reacting melamine derivatives with aldehydes, phenolic compounds, and epihalohydrin.

Abstract: A thermosetting resin composition usable for sealing a gap formed between a printed circuit board and a semiconductor element in a semiconductor package having a face-down structure; a semiconductor device comprising a printed circuit board, a semiconductor element, and the thermosetting resin composition mentioned above, wherein a gap formed between the printed circuit board and the semiconductor element is sealed by the thermosetting resin composition; and a process for manufacturing the semiconductor device.

Abstract: The present invention relates to linear polyalkylorgano-siloxanes having polyoxyalkylene and amino-functional groups which additionally have terminal alkoxy groups, and to the preparation and use thereof.

Abstract: An adhesive composition for semiconductor devices contains as essential components (A) epoxy resin, (B) phonolic resin, (C) epoxidized styrene-butadiene-styrene block copolymer and (D) diaminosiloxane compound. The adhesive composition is excellent in heat resistance, thermal cycle test and humidity resistance. An adhesive sheet employing the above adhesive composition is also provided.

Abstract: The present invention provides a device for selective molecular recognition, the device comprising a sensing portion, wherein said sensing portion includes a substrate having coated thereon a layer comprising a dendrimeric compound having: (1) a core portion; (2) at least one unsaturated arms extending radially from the core portion; and (3) at least one halogen substituted alcohol substituted at the terminus, the interior, or both of each; The device is used to detect the molecules of a hydrogen bond accepting vapor such as organophosphorus or nitroaromatic species.

Abstract: The invention relates to a process for coating a substrate with a nitrogen-free compound corresponding to formula (I) and/or a hydrolysis product or condensation product [R1(R2)j]iSiR3k(OR4)4−k−i  (I), wherein i represents the number 1, 2 or 3, j represents an integer from 1 to 10, k represents the number 0, 1 or 2, k+i is ≦3, and R1 represents OH, OR, SH, SR, OOC—R, R represents C1-C10-alkyl or C6-C12-aryl, R2 is an unsubstituted, singly substituted, or doubly substituted methylene group, R3 is a substituted or unsubstituted C1-C10-alkyl or C6-C12-aryl group, R4 represents a C1-C10-alkyl or C6-C12-aryl group, and wherein if j represents from 2 to 10 the methylene groups in the chain may optionally be interrupted once or several times by hetero atoms.

Abstract: This invention provides, at a low cost, a low-pollution type cationic electro-coating bath composition which contains neither lead nor chromium, and which comprises cationic electrodeposition paint and, contained therein, a bismuth oxide paste, the amount of the bismuth oxide paste being within a range of 0.1 to 0.3% by weight as metal bismuth on the basis of total solid content of said cationic electro-coating bath composition, and the bismuth oxide paste being prepared by dispersing bismuth oxide (B) in an organic acid-neutralized aqueous dispersion of diethanol amine-added alicyclic epoxy resin (A).