Abstract: A flexible device that includes a flexible display panel bent to have a curved surface and a supporting member provided at one end of the flexible display panel. The flexible display panel makes contact with a portion of the supporting member and surrounds the supporting member while being bent.

Abstract: Apparatuses, methods and storage media associated with a plurality of cooling devices thermally coupled to a plurality of heat-generating components of an electronic device, such as a server, a configured rack of servers, or a configured rack of server elements, are disclosed herein. Each cooling device may be associated with a unique cooling zone for the components. Logic may be coupled with the plurality of cooling devices, and the logic may be configured to cause a first cooling zone of a first cooling device to overlap a second cooling zone of a second cooling device. Other embodiments may be described and/or claimed.

Abstract: A display device including a display panel having an active area to display an image, and an inactive area provided with a pattern disposed thereto to apply an electrical signal to the active area, a side cover having a peripheral frame disposed at an outer portion of the display panel to form a side portion exterior of the display device, and a support frame extended from the peripheral frame to be disposed at a rear of the display panel and supporting the display panel, and a black matrix disposed at a front of the inactive area to hide a pattern of the inactive area.

Abstract: An electronics rack comprising a frame, a heat sink coupled to the frame, and a cage adapted to support an electronic component. The cage is movable between first and second positions toward and away from the heat sink. The rack further includes an eccentric cam operatively positioned between the frame and the cage and being rotatable to move the cage between the first and second positions. In one embodiment, the cage comprises a cooling brick movable toward and away from the heat sink when the cage moves between the first and second positions. The cooling brick can include a first heat pipe extending generally in a first direction and a second heat pipe extending generally in a second direction transverse to the first direction. For example, the first heat pipe can be embedded in a top plate and the second heat pipe can be embedded in a top cold rail.

Abstract: A power converter includes a stack of a plurality of semiconductor modules, each of which incorporates semiconductor elements, and a plurality of cooling conduits, though each of which a coolant flows to cool the semiconductor modules, at least one electronic component electrically connected to the semiconductor modules, and a cooling plate for cooling the at least one electronic component. The stack, the at least one electronic component, and the cooling plate are arranged in a stacking direction of the stack. The cooling plate is connected to the cooling conduits and has an intra-plate pathway formed therein thorough which the coolant flows in a direction perpendicular to the stacking direction. The cooling plate has a larger area than each cooling conduit when viewed from the stacking direction.

Abstract: Card locks for securing electronics card in card slots within cages and designed and configured to allow each card lock to impart high uniform pressure between an electronics card and the corresponding card slot to maximize heat transfer from the electronics card to the card cage to efficiently sink heat generated onboard the electronics card. In some embodiments, a high-pressure card lock of the present disclosure has a pair of low-angle wedges and a locking mechanism that effectively pushes one of the wedges along the other wedge to put the high-pressure card lock into its locked, high-pressure-exerting state. In other embodiments, a high-pressure card lock of the present disclosure has a pair of low-angle wedges and a locking mechanism that effectively draws one of the wedges along the other wedge to put the high-pressure card lock into its locked, high-pressure-exerting state.

Abstract: Provided is a cooling system capable of improving the cooling performance of an electronic device and being simple and efficient. The cooling system has a cooling tank, and the cooling tank contains in its open space a second cooling liquid having a boiling point T2. An electronic device mounting a processor as a heating element on a board is stored within the open space of the cooling tank and is immersed in the second cooling liquid. A boiling cooling device is a cooling device thermally connected to the processor and encloses a first cooling liquid having a boiling point T1 (provided T1=T2 or T1<T2). A first heat exchanger is immersed in a surface layer portion of the second cooling liquid within the cooling tank. The first heat exchanger encloses therein a third refrigerant having a boiling point T3 (provided T1=T3 or T1>T3).

Abstract: The present invention is notably directed to a printed circuit board, or PCB. This PCB has two main surfaces, each delimited by lateral edges, as well as lateral surfaces, each meeting each of the two main surfaces at one lateral edge. The present PCB further comprises a row of solder pads, which extends along a lateral edge of the PCB. Each solder pad is formed directly at the lateral edge and/or directly on a lateral surface (meeting one of the two main surfaces at said lateral edge). I.e., each pad interrupts a lateral edge and/or an adjoining lateral surface. One or more chips, e.g., memory chips, can be mounted on such a PCB to form an IC package. The above solder pad arrangement allows particularly dense arrangements of IC packages to be obtained. The present invention is further directed to related devices and methods of fabrication thereof.

Abstract: A sealed physical button for use with a portable electronic device that effectively presents ingress of liquids. Embodiments include a button cap having flange portions that interlock with complementary flanges from a button retainer. The button cap may also include a downward oriented central post, proportioned and oriented to interface with the top surface of a button attached to a bracket. The button retainer may include an aperture sized and positioned to receive the central post of the button cap. The button retainer may rest on a shelf within the electronic device housing such that the shelf interposes the bracket and the retainer to form a rigid seal.

Abstract: A vehicular power conversion device is provided with a semiconductor that converts power. The power conversion device is provided with: coolers that are arranged in an array in a vehicle advancement direction and cool the semiconductor; and a cooler cover having the coolers located therein and provided with ventilation openings serving as an intake port and a discharge port for travel-generated airflow. A cavity serving as a passageway for the travel-generated airflow is provided in at least one of above, below, and to the side of the plurality of coolers inside the cooler cover. The ventilation openings are disposed in the vehicle advancement direction from the cavity. The airflow-receiving plate is located in the cavity and, when the travel-generated airflow flows from the ventilation opening into the cavity, changes the direction of the incoming travel-generated airflow to a direction toward the coolers.

Abstract: A first thermal management approach involves an air flow through cooling mechanism with multiple airflow channels for dissipating heat generated in a PCA. The air flow direction through at least one of the channels is different from the air flow direction through at least another of the channels. Alternatively or additionally, the airflow inlet of at least one channel is off-axis with respect to the airflow outlet. A second thermal management approach involves the fabrication of a PCB with enhanced durability by mitigating via cracking or PTH fatigue. At least one PCB layer is composed of a base material formed from a 3D woven fiberglass fabric, and conductive material deposited onto the base material surface. A conductive PTH extends through the base material of multiple PCB layers, where the CTE of the base material along the z-axis direction substantially matches the CTE of the conductive material along the x-axis direction.

Abstract: A flexible device that includes a flexible display panel bent to have a curved surface and a supporting member provided at one end of the flexible display panel. The flexible display panel makes contact with a portion of the supporting member and surrounds the supporting member while being bent.

Abstract: A support apparatus is configured to support electronic components. The support apparatus includes a tray and a plurality of recessed structures. The tray has a cavity therein and at least one intake hole communicated with the cavity. The recessed structures are disposed on the tray and recessed toward the cavity. Each of the recessed structures is configured to accommodate at least a part of a corresponding one of the electronic components and includes a support surface and a plurality of first spacers. The support surface has an exhaust hole communicated with the cavity. The first spacers are disposed on the support surface of a corresponding one of the recessed structures. When a corresponding one of the electronic components is supported on the first spacers, any adjacent two of the first spacers and the corresponding electronic component form a first flow channel.

Abstract: An electronic device includes an outer housing having an upper enclosure and a foot coupled thereto, a heat generating component, and a fan assembly integrated into the foot and situated proximate a bottom surface of the heat generating component. The foot can include inlet and outlet vents. The fan assembly can include an inlet, outlet, impeller with blades, shroud and fin stack. The electronic device can also include a heat pipe, a heat transfer stage, a PCB, and a bottom shield. Airflow through the electronic device can be directed across the fin stack, heat pipe, heat transfer stage, and bottom shield. Airflow can occur over a substantially level path through the electronic device from the inlet to outlet vents.

Abstract: A series fan with support frame includes a first fan, a second fan and a hollow support frame. The support frame has a first receiving space, a second receiving space, an inlet, an outlet and an inclined passage in communication between the first and second receiving spaces. The first and second receiving spaces are respectively positioned in the support frame in adjacency to the inlet and the outlet. The first and second fans are respectively correspondingly received in the first and second receiving to spaces. A first virtual central line of the first fan and a second virtual central line of the second fan intersect each other in the inclined passage.

Abstract: A handheld computing device that includes an enclosure having structural walls formed from a glass material that can be radio-transparent. The enclosure can be formed from a hollow glass tube or two glass members bonded together. A laser frit bonding process may be used to hermetically seal the two glass members together to create a water resistant electronic device.

Abstract: Provided is a cooling device, and methods of fabricating and operating such cooling devices, for electromagnetic induction (EMI) filters. Specifically, a cooling device is provided which comprises a housing enclosing the electromagnetic induction filter. The housing may comprise one or more of the following: one or more exterior chambers, one or more central flow channels, and peripheral flow channels. The one or more exterior chambers surround an exterior surface of the EMI filter. The one or more central flow channels extend the length of the center of the EMI filter. The peripheral flow channels extend the length of the exterior of the electromagnetic induction filter. The peripheral flow channels may be disposed between one or more exterior chambers and open into the one or more exterior chambers. The one or more central flow channels, the peripheral flow channels, and the one or more exterior chambers are interconnected.

Abstract: Cooling units are configured to be installed in a datacenter, such as in a row configured to receive server racks. The cooling units include chilling coils configured to cool air passing across the chilling coil. The cooling units when installed supply cooled air. Units can be coupled together to expand cooling capacity, such as by forming a shared volume between adjacent units. Cooling provided through one or more coupled units can be controlled by another of the coupled units.

Abstract: A telescoping enclosure for information handling system components is disclosed. The telescoping information handling system component comprises a first enclosure and a second enclosure slidably coupled to the first enclosure. A service loop is configured to electrically couple a first sub-component located in the first enclosure to a second sub-component located in the second enclosure.

Abstract: This disclosure pertains to wireless power transfer systems, and in particular (but not exclusively), to techniques to improve the coupling efficiency between a power transmitting unit and a power receiving unit within a computing device. The present disclosure includes a system which comprises a computing unit which includes a power receiving unit and a conductive surface. The conductive surface has an opening that is adjacent to the power receiving unit and a slot extending from the opening towards the perimeter of the conductive surface. The computing unit further includes a system base coupled to the power receiving unit wherein the power receiving unit is to provide power to the system base. The system also includes a power transmitting unit adjacent to the computing unit.