Abstract: A power module having a packaging structure includes a substrate having a first conductive area, a second conductive area, a third conductive area, a first fixing area and a second fixing area. The first, the second and the third conductive areas are electrically connected to a first terminal, a second terminal and a third terminal, and the first and the second fixing areas are electrically connected to a first switch set and a second switch set, so that they are in a parallel arrangement. The first terminal is a current input end, the second terminal is an intermediate end, and the third terminal is a current output end. When a current flows from the current input end to the intermediate end, or from the intermediate end to the current output end, the current flows straightly in order to reduce a crossover area and lower the stray inductance.

Abstract: Provided is a display apparatus including: a case having an inlet; and an outlet; a display module disposed in the case and including a display panel configured to display an image; and a heat exchange device configured to receive heat from the display module and including: a first portion provided in a first cooling passage, air in the first passage moving over the display module; and a second portion provided in a second cooling passage, air in the second cooling passage moving over the heat exchange device, wherein heat generated from the display module is transferred to the first portion via the air in the first cooling passage, wherein the heat transferred to the first portion is transferred to the second portion, and wherein the air suctioned through the inlet is heat-exchanged in the second cooling passage with the second portion and discharged through the outlet.

Abstract: A handheld robot operation unit comprises a basic safety control device, a mobile terminal device, and a holder configured to mount the mobile terminal device on the basic safety control device. The holder comprises at least one adapter device configured to mechanically connect the mobile terminal device to the basic safety control device.

Abstract: A liquid handling (LH) block of an Information Handling System (IHS) having a first transfer conduit having node-receiving intake port/s sealably engaged for fluid transfer to node intake port/s of Liquid Cooled (LC) node/s and having supply connection/s. A second transfer conduit has node-receiving outlet port/s sealably engaged for fluid transfer to LC node output port/s of the LC node/s and having return connection/s. A radiator includes a portion of the second transfer conduit. A cooling liquid distribution subsystem has a user selectable first and second sets of liquid conduits connectable to the module in one of an open-loop configuration utilizing facility supplied cooling liquid and a closed-loop configuration to recirculate cooling liquid between the block radiator and the node-level system of conduits.

Abstract: The present technology provides a system for supplying fresh air to downstream components. The system comprises a housing with a first end and a second end, a first plurality of partitions disposed in the housing, and a second plurality of partitions disposed in the housing. The housing comprises a base portion and first and second opposing sidewalls extending from the first end to the second end. Each of the first plurality of partitions includes at least one first ventilation opening associated with each of the plurality of compartments. Each one of the second plurality of partitions comprises at least one partition duct extending through the plurality of partition rows and at least one second ventilation opening connecting the at least one partition duct to associated ones of the plurality of compartments.

Abstract: According to one embodiment, a display device includes a display, a circuit substrate, connector terminals, a first cover, a second cover, and a fastening member. The circuit substrate includes a first side and a second side adjacent to the first side, and overlaps a second face of the display. The connector terminals are disposed at a vicinity of each of the first side and the second side. The first cover includes a first opening exposing the connector terminals therethrough, and covers the second face. The second cover includes a linking portion and a noncircular through hole, and covers the first opening across the first side and the second side. The linking portion is positioned in between the first side and the second side. The fastening member is inserted through the through hole so as to fix the second cover, the circuit substrate, and the display.

Abstract: An engine control unit (ECU) includes a housing, a cover sealingly engaged with the housing, a circuit board disposed in the housing and support structure disposed in the housing and associated with an inner surface of the cover. At least one fastener couples both the support structure and the circuit board to the housing. An adhesive bonds at least portions of the support structure to portions of the inner surface of the cover. The support structure is constructed and arranged to limit deflection of the cover when internal pressure increase in the ECU.

Abstract: A server includes a casing, a fan module, at least two processor holders and an air baffle. The casing has an accommodating space. The fan module is located in the accommodating space. The processor holders are located in the accommodating space. The air baffle includes a base and an airflow guiding member. The airflow guiding member is pivoted on the base. The airflow guiding member is shiftable among a plurality of air guiding positions. A processor module is mounted on one of the processor holders, and the base is mounted on the other processor holder. The airflow guiding member is at one of the air guiding positions in order to guide airflow from an air outlet side of the fan module.

Abstract: An electrical device may include a housing, a printed circuit board arranged in the housing, an electrical component arranged in electrical contact with the printed circuit board, and a clamp. The clamp may be configured to bias the electrical component against a cooling structure disposed in the housing and hold the printed circuit board in the housing relative to the housing. The clamp may include a clamp snap-in structure forming at least part of a snap-in connection with the housing.

Abstract: At least one implementation provides a hold down for an electronic device. The electronic device includes a support frame, a circuit board coupled to the support frame and having at least one component, a thermal pad thermally coupled to the component, and a heat sink associated with the thermal pad. The hold down includes a generally planar portion adapted to be positioned over a surface of the heat sink. The hold down also includes a plurality of connecting structures extending angularly from the generally planar portion. The connecting structures and configured to engage the support frame to cause the hold down to apply the biasing force to retain the thermal pad against at least one of the heat sink or the component when the heat sink and the thermal pad are positioned between the hold down and the support frame. A method is also provided for attaching the hold down.

Abstract: A system and method for improving the cooling of the skin of an information handling system. More specifically, in certain embodiments, the information handling system comprises an air moving device positioned to generate boundary layer disruption on the external skin of the system. In certain embodiments the air moving device is located within the information handling system.

Abstract: The instant disclosure relates to a chassis structure for industrial uninterruptible power supply system including: a chassis having a frame and a front side panel, left side panel, right side panel, rear side panel and top panel installed on the frame; the chassis has a plurality of spacer on the bottom thereof for lifting the chassis from the ground for a distance to forming a gas-intake space; a plurality of protective plates disposed around the gas-intake space, each protective plate has a plurality of gas-intake hole; a bottom plate structure disposed between the bottom of the chassis and the gas-intake space and has at least a gas-intake gap; at least a venting hole disposed on the top panel of the chassis, each venting hole has at least an exhaust fan for outputting a gas from the chassis.

Abstract: The present disclosure provides techniques for creating a symmetrical ball grid array pattern for an integrated circuit package. The ball grid array includes a symmetrical pattern of circuit connection points, wherein the symmetrical pattern is derived from a base hexagonal pattern that is repeated in at least one or more sections of the ball grid array.

Abstract: A wiring protective cover structure for an electric drive vehicle is provided that can be used to cool a battery while effectively blocking noise that is generated from wiring for connecting an electric power converter and the battery disposed on a floor panel. A DC line cable 23 and a control line cable 25 that connect a battery 21 and an electric power converter 22 are disposed on a top surface of a center tunnel 37 of a vehicle 1, and a metallic wiring protective cover 35 has a cooling passage 30 disposed therein and is disposed on a floor panel 36 so as to cover the DC line cable 23 and the control line cable 25.

Abstract: A housing for a variable frequency drive and its transformer, which housing has two compartments, one each for a VFD and transformer. The housing is box shaped with enclosures attached to the rear wall of each compartment, which enclosures communicate through openings in the compartments to their interiors. The VFD compartment has an exterior side wall communicating enclosure. Cooling components are disposed in each enclosure. Each compartment has inner and outer doors. The inner door of the VFD compartment has a recessed cabinet with VFD controls therein and on its door. The inner door of the transformer compartment has a grill, while its outer door has both interior and exterior louvers. The transformer compartment also holds the main circuit breaker.

Abstract: An electronic device includes: a frame in which a unit is mounted on each of an upper row and a lower row of the frame; a rack configured to accommodate a plurality of frames; a back plate configured to close the rack on a rear side of the frame; and a duct configured to protrude from an insertion hole formed in the back plate, and form an opening with a hole edge of the insertion hole so as to discharge air passing through the unit on the lower row, the duct separating the unit on the upper row and the unit on the lower row from each other, wherein a cross-sectional area of the opening is adjusted by adjustment of a protrusion length from the insertion hole.

Abstract: A circuit module includes a wiring substrate having a mount surface, a conductor pattern, and an insulating protective layer, the mount surface having first and second areas, the conductor pattern being formed along a boundary between the first and second areas on the mount surface, the insulating protective layer being formed on the mount surface, the insulating protective layer covering the mount surface and the conductor pattern; a plurality of electronic components mounted on the first and second areas; an insulating sealing layer having a trench, the insulating sealing layer covering the plurality of electronic components, the trench having a depth such that the trench penetrates the protective layer to reach a surface of the conductive pattern; and a conductive shield having first and second shield portions, the first shield portion covering an outer surface of the sealing layer, the second shield portion being electrically connected to the conductor pattern.

Abstract: The present disclosure is related to electronic modules for electronic components and methods for manufacturing the same. In one embodiment, an electronic module is formed using a first substrate having a first component area and a second substrate having a second component area. One or more electronic components may be attached to both the first component area and the second component area. The second substrate is mounted over the first substrate such that the second component area faces the first component area. An overmold covers the first component area and the second component area so as to cover the electronic components on both the first component area and the second component area. In this manner, the number of electronic components within the electronic module that can be mounted on an area of a printed circuit board (PCB) is increased.

Abstract: In one example, a portion of a shell includes a shell wall portion that has an interior wall portion and an exterior wall portion located near the interior wall portion. In addition, fluid passageways are disposed between the interior wall portion and the exterior wall portion. One or more of the fluid passageways are defined in part by one or both of the interior wall portion and the exterior wall portion. The fluid passageways form part of heat exchanger that is integrated in the shell.

Abstract: A semiconductor device includes a base plate, a semiconductor chip, and a first to a fourth terminal plates. The first terminal plate includes a first main body unit. The second terminal plate includes a second main body unit. The second main body unit opposes the first main body unit. The third terminal plate includes a third main body unit. The third main body unit opposes the first main body unit and the second main body unit. The fourth terminal plate includes a fourth main body unit. The fourth main body unit opposes the third main body unit. A thickness of the third main body unit is thinner than a thickness of the first main body unit. A thickness of the fourth main body unit is thinner than a thickness of the second main body unit.