Abstract: Mesoscopically ordered, hydrothermally stable metal oxide-block copolymer composite or mesoporous materials are described herein that are formed by using amphiphilic block polymers which act as structure directing agents for the metal oxide in a self-assembling system.

Abstract: Provided is a room-temperature curable organopolysiloxane composition including (I) an organopolysiloxane, and (II) a silane compound containing silicon-bonded hydrolysable groups and/or a partial hydrolysis-condensation product thereof. The organopolysiloxane (I) is a condensation product of (A) an organosiloxane which includes R3SiO1/2 units wherein R represents an unsubstituted or substituted monovalent hydrocarbon group and SiO4/2 units, in which the molar ratio R3SiO1/2 to SiO4/2 is 0.6 to 1.2, and further includes less than 2.0% by weight of silicon-bonded hydroxyl groups, and (B) a diorganopolysiloxane with molecular chain terminals blocked with functional group-containing silyl groups. This composition generates a cured product or coating film with good transparency and good strength, which is useful as a coating material for electrical or electronic components or circuits, a sealant for liquid crystal display elements, and an antifouling paint for underwater structures.

Abstract: A fluorine containing thermoplastic vulcanizate composition includes a continuous phase of at least one melt formable thermoplastic resin and a discrete phase of a vulcanized perfluoroether elastomer. The perfluoroether elastomer comprises between 10 and 80 weight percent based on the total amount of the continuous phase and the disperse phase combined.

Abstract: An antireflection film having a hard coat layer prepared on one side of a transparent substrate directly or through other layers, and further an antireflection layer laminated on a surface of the hard coat layer, wherein the antireflection layer is formed by a dry cured film obtained from a solution comprising a siloxane oligomer (A) obtained by condensation polymerization after partial hydrolysis of a hydrolyzable alkoxy silane that contains a tetra alkoxy silane represented by a general formula (1): Si(OR)4 (where R represents methyl group or ethyl group) as a principal component and a compound (B) having a fluoro alkyl structure and a polysiloxane structure, is excellent scratch-proof property, stain resistance, and cured in a short period of time at comparatively low temperature.

Abstract: The present invention relates to {circle around (1)} a metal oxide or metallic Lewis acid composition comprising the metal oxide or the metallic Lewis acid carried on a cross-linked polymer compound, {circle around (2)} a metal compound composition comprising the metal compound carried on a cross-linked product of a polymer compound containing a cross-linkable condensing functional group and/or a polymer containing a polymerizable double bond formed by a condensation reaction, {circle around (3)} a method for producing a metal compound composition comprising the metal compound carried on a cross-linked polymer compound, which comprises mixing a non-cross-linked polymer compound containing a cross-linkable condensing functional group and/or a polymer compound containing a polymerizable double bond formed by a condensation reaction with a metal compound, and then cross-linking the polymer compound, {circle around (4)} a carrier for carrying a metal compound comprising a 1st polymer compound containing a cross-l

Abstract: The present invention relates to a method of making silicone release coating compositions comprising mixing a vinyl functional organopolysiloxane, an organohydrogensilicon compound, a platinum group metal-containing catalyst, and certain silylated acetylenic inhibitors.

Abstract: Anti-reflective compositions and methods of using those compositions with low dielectric constant materials are provided. In one embodiment, the compositions include polymers comprising recurring monomers having unreacted epoxide groups. In another embodiment, the polymers further comprise recurring monomers comprising epoxide rings reacted with a light attenuating compound so as to open the ring. The compositions can be applied to dielectric layers so as to minimize or prevent reflection during the dual damascene process while simultaneously blocking via or photoresist poisoning which commonly occurs when organic anti-reflective coatings are applied to low dielectric constant layers.

Abstract: Thermosetting resin compositions useful as underfill sealants for mounting a semiconductor devices onto a circuit board are provided, which include epoxy resins, an adhesion promoter having at least two secondary amine groups, and a curative based on the combination of nitrogen-containing compounds and transition metal complexes.

Abstract: An epoxy resin composition having a viscosity of from 50 to 400 P at 25° C. is disclosed. The composition provides by casting a resin plate, particularly a transparent resin plate for a liquid crystal display, which has satisfactory thickness precision.

Abstract: The present invention provides a novel oxazolidone ring-containing epoxy resin suitable for use as a resin for a coated film having a structure of the formula: wherein R3 represents a residue excluding epoxy groups of diepoxide, X represents a residue excluding isocyanate groups of polyurethane diisocyanate, and n represents an integer of 1 to 5; and wherein X has a structure of the formula: wherein R1 represents a residue excluding isocyanate groups of diisocyanate, R2 represents a residue excluding hydroxyl groups of diol, and m represents an integer of 2 to 10.

Abstract: Anti-reflective compositions and methods of using those compositions with low dielectric constant materials are provided. In one embodiment, the compositions include polymers comprising recurring monomers having unreacted epoxide groups. In another embodiment, the polymers further comprise recurring monomers comprising epoxide rings reacted with a light attenuating compound so as to open the ring. The compositions can be applied to dielectric layers so as to minimize or prevent reflection during the dual damascene process while simultaneously blocking via or photoresist poisoning which commonly occurs when organic anti-reflective coatings are applied to low dielectric constant layers.

Abstract: This invention relates to curable epoxy-based compositions for use in the field of microelectronics, such as those having an epoxy compound which has two or more epoxy groups per molecule, a polythiol compound which has two or more thiol groups per molecule, a latent hardener, and at least one solid organic acid which is substantially insoluble in a mixture of the foregoing components at room temperature. The solid organic acid may be selected from the group consisting of: aliphatic, cycloaliphatic and aromatic carboxylic acids and derivatives thereof, aliphatic, cycloaliphatic, and aromatic quinones and derivatives thereof, phenols and derivatives thereof and enolisable aliphatic, cycloaliphatic and aromatic compounds and derivatives thereof. The solid organic acid should have a pKa of less than or equal to about 12.0, desirably less than or equal to about 10, and often less than or equal to 9.0, such as less than or equal to about 7.5.

Abstract: A curing agent for epoxy resins comprises: a) a reaction product of at least one polyalkylene polyether monoamine and/or polyamine with a polyepoxide and optionally, a monoepoxide to obtain an epoxide group-containing precursor, the precursor further reacted with a primary monoamine and/or a primary or secondary polyamine in at least a 10% molar excess relative to the epoxide groups of the precursor, the reaction product being substantially free of non-reacted amines; b) an amine-terminated adduct of an epoxy resin and a primary monoamine and/or a primary or secondary polyamine being substantially free of non-reacted amines; and c) an amine-terminated adduct of an epoxide group-containing reactive thinning agent and a primary monoamine and/or a primary or secondary polyamine being substantially free of non-reacted amines, wherein the epoxy resin of component b) and epoxide group-containing reactive thinning agent of c) are added to the epoxide group-containing precursor of component a) before the reaction

Abstract: The present invention provides a method for forming a topcoat according to a 2-coat 1-bake system comprising the steps of applying to a substrate a thermosetting aqueous colored base coating composition, applying to the uncured surface of the base coat a clear coating composition, and curing the two coats by heating, wherein the clear coating composition is a thermosetting powder coating composition comprising: (A) an epoxy-containing resin; and (B) a curing agent containing acid anhydride (a) represented by formula X—COO—[CO—(CH2)m—COO]n—CO—X  (1) and at least one species selected from the group consisting of acid anhydride (b) represented by the formula HO—[CO—(CH2)p—COO]q—H  (2) and dibasic acid (c).

Abstract: A process for manufacturing an &agr;-dihydroxy derivative from an aryl allyl ether wherein such &agr;-dihydroxy derivative can be used to prepare an &agr;-halohydrin intermediate and an epoxy resin prepared therefrom including epoxidizing an &agr;-halohydrin intermediate produced from a halide substitution of an &agr;-dihydroxy derivative which has been obtained by a dihydroxylation reaction of an aryl allyl ether in the presence of an oxidant or in the presence of an oxidant and a catalyst.

Abstract: A curing agent for epoxy resins comprises: a) a reaction product of at least one polyalkylene polyether monoamine and/or polyamine with a polyepoxide and optionally, a monoepoxide to obtain an epoxide group-containing precursor, the precursor further reacted with a primary monoamine and/or a primary or secondary polyamine in at least a 10% molar excess relative to the epoxide groups of the precursor, the reaction product being substantially free of non-reacted amines; b) an amine-terminated adduct of an epoxy resin and a primary monoamine and/or a primary or secondary polyamine being substantially free of non-reacted amines; and c) an amine-terminated adduct of an epoxide group-containing reactive thinning agent and a primary monoamine and/or a primary or secondary polyamine being substantially free of non-reacted amines, and up to 50 mol % relative to the amino groups of a reactive thinning agent containing one or more epoxide groups per molecule.

Abstract: A method for imparting flame retardance to an epoxy resin comprises reacting an epoxy resin with a phosphorus-containing dihydric phenol or naphthol derived from the reaction of 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (i.e., DOPO) with a benzoquinone or naphthoquinone.

Abstract: A method of coating a game ball with a rapidly curing polyurethane coating system is described herein. The coating system comprises a mixture of a polyol, an isocyanate, a solvent and a high level of catalyst which accelerates the curing process. The coating is a two-part polyurethane system which is preferably applied by spraying. The coating is particularly well-suited for use on golf balls, and also can be applied to other game balls such as softballs, baseballs, cricket balls.

Abstract: Thermosetting powder compositions comprising as binder a mixture of polyesters containing carboxyl groups and of a crosslinking agent having functional groups capable of reacting with the carboxyl groups.

Abstract: An encapsulating epoxy resin composition comprising an epoxy resin which is liquid at normal temperature, a curing agent containing an aromatic amine which is liquid at normal temperature, an inorganic filler, and rubber particles; an encapsulant comprising this composition; and an electronic device having an encapsulating member comprising a cured product of this encapsulant.