Abstract: A powder coating composition that includes at least about 9% by weight, based on total vehicle weight, of a branched carboxylic acid-functional polyester having a number average molecular weight of from about 425 to about 1050 and at least one vehicle component reactive with carboxylic acid groups comprising an epoxy-functional material, produces a matte, textured coating.

Abstract: The present invention relates to membranes including a barrier layer which includes a blend of one or more aliphatic thermoplastic urethanes and one or more polar and partially crystalline materials. Under multi-layered embodiments, the barrier layer is laminated to at least one other layer formed from thermoplastic urethane, wherein the membranes are characterized in that hydrogen bonds are formed between the first layer of thermoplastic urethane and the second layer from the blend of aliphatic thermoplastic urethane and a copolymer of ethylene and vinyl alcohol.

Abstract: Process comprising treating a double metal cyanide complex catalyst with sound waves and/or electromagnetic radiation, process for polymerising alkylene oxide in which such catalyst is used, and double metal cyanide complex catalyst which catalyst has been treated with sound waves and/or electromagnetic radiation.

Abstract: An epoxy resin composition for semiconductor encapsulation comprising (A) an epoxy resin, (B) a phenolic resin, and (C) butadiene rubber particles having an average particle size of secondary particles of 100 &mgr;m or smaller and having such a size distribution that the proportion of secondary particles having a particle size of 250 &mgr;m or smaller is 97% by weight or more, and the proportion of secondary particles having a particle size of 150 &mgr;m or smaller is 80% by weight or more; and (D) a silicone oil having at least one amino group per molecule. Component (C) is uniformly dispersed in the composition without forming coarse agglomerates to secure low stress properties.

Abstract: The invention provides methods for the preparation of polyester block copolymers, by reacting crystalline aromatic polyesters with lactones and/or epoxides. By using a slight excess of lactone in the reaction, and a subsequent solid-phase polycondensation reaction, the method generates high-molecular weight block copolymers of low crystallinity. Methods are also provided for generating polyester block copolymers by melt-mixing or kneading polyester block copolymers with epoxides in the solid phase.

Abstract: A fiber-forming polyamide composition contains a fiber forming polyamide and a sulfonated polyester concentrate, the concentrate disabling and dye sites in the polyamide so that fibers formed from the composition will have enhanced stain and soil resistance. The sulfonated polyester concentrate contains a reagent, preferably an alkali metal salt of 5-sulfoisophthalic acid, and thermoplastic polyester, preferably one or more of PET, PTT, PBT, PETG and poly(ethylene terephthalate-co-isophthalate).

Abstract: A multilayer printed circuit board having resinous insulating layers and conductor layers alternately superposed on a circuit board with ample adhesive strength, a method for the production thereof, and a curable resin composition useful for the formation of resinous insulating layers are disclosed. The manufacture of the multilayer printed circuit board is accomplished by applying the curable resin composition to the surface of conductor layer of the circuit board, thermally curing the applied layer thereby forming resinous insulating layer, then boring a through-hole in the circuit board, treating the resinous insulating layer with a coarsening agent thereby imparting undulating coarsened surface thereto, subsequently coating the surface of resinous insulating layer and the inner surface of the through-hole with a conductor layer as by electroless plating, and thereafter forming a prescribed circuit pattern in the conductor layer.

Abstract: An article comprises a substrate wherein at least a portion of its surface is provided with a thermosettable adhesive composition prepared from a polyepoxide resin, a curing agent and a plurality of microspheres. The cured composition forms a semi-structural bond with said substrate which is inseparable at the use temperature and is cleanly removable from said substrate when heated to a temperature of greater than the use temperature.

Abstract: A composition exhibiting reverse thermal gellation properties comprises a block polymer having the structure: {[An(BCB)An]}m wherein A is a polyester unit, B is a poly(ethylene oxide) unit, C is a poly(propylene oxide unit, E is a chain extender or crosslinking agent unit, n ranges from 0 to 20, and m is greater than 2, said block polymer possessing an EO (ethylene xide):PO (propylene oxide) ratio ranging from about 0.2:1 to about 40:1, said composition having a final viscosity at a final temperature of more than twice the initial viscosity at an initial temperature, said final temperature being at least 10° C. higher than said initial temperature.

Abstract: A resin composition applicable to semiconductor or electric devices comprises (A) a polyarylenesulfide resin, (B) a bisphenol epoxy resin, (C) an oxazoline group-containing amorphous polymer, and (D) an impact resistance-improving resin which is either (d1) an acid or epoxy groups-containing vinyl polymer, or (d2) an acid or epoxy groups-containing gum polymer.

Abstract: Products of the reaction between I) the reaction product of reactants comprising A) a linking agent of formula I R4(Y)3  (I)  wherein each Y group is a halogen atom or one Y group is a halogen atom and two Y groups represent an oxygen atom, which is attached to two adjacent carbon atoms in the R4 group to form an epoxy group, and R4 is an alkanetriyl group containing from 3 to 10 carbon atoms; and B) a compound formula II R3(EO)n(PO)m(BO)pX  (II)  wherein R3 is a substituted or unsubstituted, saturated or unsaturated, aliphatic or araliphatic oxy or thio group having from 1 to 36 carbon atoms or a secondary amino group having from 2 to 36 carbon atoms; n is a number of from 0 to 50; m is a number of from 0 to 50; p is a number of from 0 to 50; and X is hydrogen, or X can be a mercapto group or an amino group in place of a terminal —OH group, provided that when X is mercapto or amino; the sum of n, m, and p must be at least 1; and the mole ratio of A:B is from about 0

Abstract: Powder coating compositions comprising at least one thermosetting resin and at least one poly(phenylene ether) are disclosed.

Abstract: A modified phenolic hydroxyl-containing resin having a low free difunctional phenol content and represented by general formula (1); a solid epoxy resin having an epoxy equivalent of 450 to 2,500 g/eq and prepared by epoxidizing the above resin; and another solid epoxy resin having an epoxy equivalent of 1,500 to 60,000 g/eq and a number-average molecular weight of 3,000 to 15,000 and prepared by reacting the above epoxy resin with a difunctional phenol compound. Resin compositions containing these resins have many applications as powder coatings and can paints. In formula (1), X represents a residue of a difunctional phenol compounds; X's may be the same or different; and n is the number of repeating units and is an integer of 0 or above.

Abstract: A composition comprises (A) an exopy resin and (B) a vinyl polymer having a reactive functional group selected from the group consisting of an alcoholic hydroxyl, phenolic hydroxyl, amino, amido and carboxyl group prepared by living radical polymerization, particularly the atom transfer radical polymerization of a vinyl polymer having a halogen atom and conversion of the halogen atom to a reactive functional group.

Abstract: The present invention provides a resin composition for semiconductor encapsulation excellent in reliability in humidity resistance and storage stability as well as in dischargeability and coatability, a semiconductor device encapsulated with the resin composition for semiconductor encapsulation and a process for the production of the semiconductor device. The resin composition for semiconductor encapsulation comprises the following components (A) to (D) and has a viscosity of 700 Pa•s or higher at 25° C. and 500 Pa•s or lower at 80° C.: (A) an epoxy resin; (B) an acid anhydride-based curing agent; (C) a latent curing accelerator; and (D) an inorganic filler.

Abstract: Modified epoxy functional polyesters are provided by reacting epihalohydrin in the presence of a base with carboxyl functional polyester resins (II) obtainable by reacting: (a) at least one aromatic or cycloaliphatic dicarboxylic acid compound A comprising two aromatic- or secondary aliphatic carboxyl groups or the anhydride thereof; (b) at least one diol compound B comprising two aliphatic hydroxyl groups, which may independently be a primary or a secondary hydroxyl group; and optionally (c) compound C1 comprising one monofunctional primary- or secondary hydroxyl group and/or at least one compound C2 comprising one primary- or secondary hydroxyl group and one tertiary aliphatic carboxyl group; and optionally (d) a dihydroxymonocarboxylic acid compound D comprising a tertiary aliphatic carboxyl group and two aliphatic hydroxyl groups, which may each independently be primary or secondary hydroxyl; and optionally (e) a trihydroxyalkane (E1) or tetrahydroxyalkane (E2), the molar ratio of compounds A:B:C1:C

Abstract: A polymer composition comprises at least one thermoplastic polymer selected from the group formed by polyetherimides and polysulphones, at least one epoxy resin modified by at least one aromatic polyamine, and at least one other thermoplastic selected from the group consisting of a polyphenylene ether, a polyphenylene sulfide and an aromatic polyether. The epoxy resin is formed from at least one polyepoxide containing at least 2 epoxy groups in its molecule and the aromatic polyamine contains at least two primary amine groups in its molecule and preferably at least one alkyl substituent containing 1 to 12 carbon atoms located alpha to one of the amino groups. The molar ratio of the polyamine to the epoxy is such that, each amino group corresponds to 1.6 to 2.6 epoxy groups.

Abstract: A 2-cyanoacrylate composition useful as an adhesive contains a Lewis acid metal salt which comprises a specific metal such as aluminum, gallium, indium or thallium, and the conjugate base of an acid having oxygen such as a monohalo-, dihalo or trihaloacetate, wherein the metal is bonded to the conjugate base through an oxygen atom, and a compound having clathrating ability such as a crown ether.

Abstract: The combination of powder coatings usable in a coating method comprising mixing two or more powder coatings of which each color is different, wherein each of the powder coatings fuses with each other and is heat-cured, to thereby give a coating film having a homogenous hue. A powder coating composition comprising two or more powder coatings of which each color is different, wherein each of the powder coatings fuses with each other and is heat-cured, to thereby give a coating film having a homogenous hue. A coating method comprising the steps of (a) applying to a substrate two or more powder coatings, of which each color is different; (b) heating to fuse with each other each of the two or more powder coatings applied in step (a); and (c) curing the resulting fused product in step (b), to give a coating film having a homogeneous hue.

Abstract: An acid dye stain-resistant fiber-forming polyamide composition comprising a fiber-forming polyamide and a reagent, at least a portion of which associates with free acid dye sites in the polyamide, thereby disabling the acid dye sites in fibers formed from the composition from taking up acid dye stains; a masterbatch concentrate for addition to a fiber-forming polyamide to form an acid dye stain-resistant fiber-forming polyamide composition comprising a carrier compatible with the fiber-forming polyamide combined with an amount of the above reagent in excess of that desired in the acid dye stain-resistant fiber-forming polyamide; as well as fibers and articles of manufacture prepared therefrom.