Patents Examined by Robert J. Pascal
  • Patent number: 11296656
    Abstract: A power amplifier module includes a combining circuit including a combiner. The combining circuit further includes a first inductor connected in series between an output terminal of a first amplifier and the combiner, a second inductor connected in series between an output terminal of a second amplifier and the combiner, and a second capacitor having an end connected to the combiner and another end grounded. A phase of a third signal from the output terminal of the first amplifier to the second amplifier through the combiner is delayed by about 45 degrees in the first inductor and the second capacitor, and is delayed by about 45 degrees in the second inductor and the second capacitor. A phase of the third signal from the output terminal of the first amplifier to the second amplifier through the first capacitor is advanced by about 90 degrees.
    Type: Grant
    Filed: July 16, 2020
    Date of Patent: April 5, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Masatoshi Hase
  • Patent number: 11283409
    Abstract: In certain aspects, a receiver includes first amplifiers, wherein each one of the first amplifiers comprises an input and an output. The receiver also includes second amplifiers, wherein each one of the second amplifiers comprises an input and an output, and the outputs of the second amplifiers are coupled to a combining node. The receiver also includes transmission lines, wherein each one of the transmission lines is coupled between the output of a respective one of the first amplifiers and the input of a respective one of the second amplifiers. The receiver further includes a load coupled to the combining node, and receiver elements, wherein each one of the receiver elements comprises an input and an output, and the output of each one of the receiver elements is coupled to the input of a respective one of the first amplifiers.
    Type: Grant
    Filed: August 30, 2019
    Date of Patent: March 22, 2022
    Assignee: QUALCOMM Incorporated
    Inventors: Lai Kan Leung, Xinmin Yu, Chirag Dipak Patel, Rajagopalan Rangarajan
  • Patent number: 11276907
    Abstract: Apparatus comprising a first layer of electrically conductive material, a second layer of electrically conductive material, and at least one dielectric layer, which comprises a solid dielectric material, arranged between said first layer and said second layer, wherein at least one distributed resonator structure comprising a plurality of resonator posts is arranged in said at least one dielectric layer.
    Type: Grant
    Filed: March 19, 2020
    Date of Patent: March 15, 2022
    Assignee: NOKIA SOLUTIONS AND NETWORKS OY
    Inventors: Florian Pivit, Senad Bulja
  • Patent number: 11264685
    Abstract: The present disclosure relates to a linkage mechanism for a phase shifter assembly, comprising a rotation device having a rotation shaft fixed to a substrate of the phase shifter assembly and a rotation member configured to rotate about said rotation shaft; a first drive member which can be operatively engaged to the rotation member such that rotation of the rotation member can cause movement of the first drive member; a second drive member disposed on and moving together with the rotation member; and a translation device including a translation member which can be operatively engaged to the second drive member such that movement of the second drive member can cause movement of the translation member, wherein the rotation device and the translation device are configured to move in association with each other during operation of the phase shifter assembly. The present disclosure also relates to a phase shifter assembly including the above-mentioned linkage mechanism.
    Type: Grant
    Filed: May 9, 2019
    Date of Patent: March 1, 2022
    Assignee: CommScope Technologies LLC
    Inventor: Guomin Ding
  • Patent number: 11258422
    Abstract: A communication module includes an input/output switch, a duplexer, a transmit filter, and a receive filter. In the duplexer, a second side is disposed at a position farther from the input/output switch than a first side in a second direction orthogonal to a first direction. Any one of the transmit filter and the receive filter is disposed adjacent to the input/output switch in the first direction.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: February 22, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Jin Yokoyama
  • Patent number: 11258430
    Abstract: A switching circuit is provided. The switching circuit includes at least one Surface Acoustic Wave (SAW) filter, a Single-Pole n Throw (SPnT) switch connected to an input port of each of the at least one SAW filter, and a Dual-Pole n Throw (DPnT) switch connected to an output port of each of the at least one SAW filter.
    Type: Grant
    Filed: August 24, 2020
    Date of Patent: February 22, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Chang-Joon Park
  • Patent number: 11258156
    Abstract: Provided is an element that can reduce a parasitic oscillation.
    Type: Grant
    Filed: October 1, 2020
    Date of Patent: February 22, 2022
    Assignee: CANON KABUSHIKI KAISHA
    Inventor: Yasushi Koyama
  • Patent number: 11258423
    Abstract: A resonator system is provided in which a combined overtone resonator device is excited with a two-dimensional mode of mechanical vibration in a cross sectional plane of a piezoelectric plate in response to an alternating voltage applied through an interdigitated electrode. The cross sectional plane extends along the width direction and the thickness direction, and the two-dimensional mode of mechanical vibration is a two-dimensional combined overtone mode of second and third order asymmetrical Lamb-wave overtones.
    Type: Grant
    Filed: October 13, 2020
    Date of Patent: February 22, 2022
    Assignee: Northeastern University
    Inventors: Matteo Rinaldi, Guofeng Chen
  • Patent number: 11255608
    Abstract: Heat exchanger assemblies for electronic devices are disclosed. A heat exchanger assembly may include a heat transfer body that has a face that forms open passageways. A cover structure may be attached to the heat transfer body in a manner to enclose the open passageways, thereby forming a heat exchanger assembly that includes enclosed fluid conduits. In this regard, the enclosed fluid conduits may form complex and intricate patterns within the heat exchanger assembly that are tailored to the heat requirements of a particular application. Heat exchanger assemblies as described herein may be thermally coupled to a center waveguide section of a spatial power-combining device. The enclosed fluid conduits may be tailored based on locations of amplifiers within the center waveguide section to provide improved thermal operation of the spatial power-combining device.
    Type: Grant
    Filed: February 28, 2019
    Date of Patent: February 22, 2022
    Assignee: Qorvo US, Inc.
    Inventors: Gregory Valenti, Dylan Murdock, Eric Jackson
  • Patent number: 11251777
    Abstract: An acoustic wave filter device includes a piezoelectric layer, a high-acoustic-velocity member, a low-acoustic-velocity film between the high-acoustic-velocity member and the piezoelectric layer, and first and second IDT electrodes on the piezoelectric layer to define acoustic wave resonators. An acoustic wave resonator of a series-arm resonator portion closest to an antenna end and/or an acoustic wave resonator of a parallel-arm resonator portion closest to the antenna end includes the first IDT electrode including first and second electrode fingers, and the remaining acoustic wave resonators include the second IDT electrode including third and fourth electrode fingers. In the first IDT electrode, a central area, first and second low-acoustic-velocity areas, and first and second high-acoustic-velocity areas extend along a direction perpendicular or substantially perpendicular to an acoustic wave propagating direction.
    Type: Grant
    Filed: March 10, 2020
    Date of Patent: February 15, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Katsuya Daimon
  • Patent number: 11252814
    Abstract: A grounding structure of the high-frequency circuit board includes a dielectric substrate, a back surface ground electrode, an upper ground electrode, and a microstripline upper electrode. The dielectric substrate has a first surface and a second surface, and is provided with a first through-hole. A first opening of the first through-hole at the first surface is smaller than a second opening of the first through-hole at the second surface. A first grounding conductor layer is provided in the first through-hole. The back surface ground electrode is provided at the second surface and is connected with the first grounding conductor layer. The upper ground electrode is provided at the first surface and is connected with the first ground conductor layer. The microstripline upper electrode is provided at the first surface.
    Type: Grant
    Filed: May 27, 2019
    Date of Patent: February 15, 2022
    Assignees: KABUSHIKI KAISHA TOSHIBA, TOSHIBA INFRASTRUCTURE SYSTEMS & SOLUTIONS CORPORATION
    Inventors: Yasuaki Asahi, Haruo Kojima
  • Patent number: 11245381
    Abstract: In accordance with an embodiment, an RF system includes a transmit path having a first tunable transmit band stop filter, and a power amplifier coupled to an output of the first tunable transmit band stop filter, where the first tunable transmit band stop filter is configured reject a receive frequency and pass a transmit frequency; a receive path comprising an LNA; and a duplex filter having a transmit path port coupled to an output of the power amplifier, a receive path port coupled to an input of the LNA, and an antenna port, where the duplex filter is configured to pass the transmit frequency and reject the receive frequency between the antenna port and the transmit path port, pass the receive frequency and reject the transmit frequency between the antenna port and the receive path port.
    Type: Grant
    Filed: December 5, 2018
    Date of Patent: February 8, 2022
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Stefan Helmut Schmalzl, Peter Pfann, Ruediger Bauder, Hans-Joerg Timme
  • Patent number: 11245172
    Abstract: A power combiner for combining a plurality of radio frequency signals into a combined output signal includes: a circular waveguide having a cross-section and three or more waveguides, each waveguide morphing to align with a common axis at a cross-section of the circular waveguide wherein each one of the three or more rectangular input waveguides gradually transitions from a rectangular cross-section to a cross-section resembling a pie slice of a composite circular cross section.
    Type: Grant
    Filed: April 9, 2020
    Date of Patent: February 8, 2022
    Assignee: RAYTHEON COMPANY
    Inventor: Earl M. Dressel
  • Patent number: 11245367
    Abstract: Described are circuits and techniques to increase the efficiency of radio-frequency (rf) amplifiers including rf power amplifiers (PAs) through “supply modulation” (also referred to as “drain modulation” or “collector modulation”), in which supply voltages provided to rf amplifiers is adjusted dynamically (“modulated”) overtime depending upon the rf signal being synthesized. For the largest efficiency improvements, a supply voltage can be adjusted among discrete voltage levels or continuously on a short time scale. The supply voltages (or voltage levels) provided to an rf amplifier may also be adapted to accommodate longer-term changes in desired rf envelope such as associated with adapting transmitter output strength to minimize errors in data transfer, for rf “traffic” variations.
    Type: Grant
    Filed: July 8, 2020
    Date of Patent: February 8, 2022
    Assignee: ETA WIRELESS, INC.
    Inventors: James Garrett, Sri Harsh Pakala, Brendan Metzner, Ivan Duzevik, David J. Perreault, John R. Hoversten, Yevgeniy A. Tkachenko
  • Patent number: 11245166
    Abstract: A first phase shift circuit (2) converts impedance to achieve impedance matching between a third terminal (1c) of a 90-degree hybrid circuit (1) and a first terminal (4a) of a first nonlinear element (4), and shifts a phase of a radio wave by 180 degrees, and a second phase shift circuit (3) converts impedance to achieve impedance matching between a fourth terminal (1d) of the 90-degree hybrid circuit (1) and a first terminal (5a) of a second nonlinear element (5), and shifts a phase of a radio wave by 90 degrees. As a result of this configuration, a conversion loss of radio waves can be reduced.
    Type: Grant
    Filed: May 29, 2017
    Date of Patent: February 8, 2022
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventor: Masaomi Tsuru
  • Patent number: 11239826
    Abstract: A filter device includes series and parallel arm resonators provided at a filter chip and inductors electrically connected in series with respective ones of the parallel arm resonators. A first inductor having the highest inductance of the inductors is electrically connected in series with a first parallel arm resonator having the highest anti-resonant frequency of the parallel arm resonators. One end of the first parallel arm resonator and one end of a second parallel arm resonator in other ones of the parallel arm resonators are electrically connected to a same wiring line in wiring lines separated by the series arm resonators on a line electrically connecting an input terminal and an output terminal of the filter chip. The other ends of the first and second parallel arm resonators are respectively electrically connected to first and second ground terminals of the filter chip.
    Type: Grant
    Filed: September 9, 2020
    Date of Patent: February 1, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Seima Kondo
  • Patent number: 11239817
    Abstract: A surface acoustic wave resonator comprises at least one set of interdigital transducer (IDT) electrodes disposed on an upper surface of a piezoelectric substrate between first and second reflector gratings, a layer of silicon nitride disposed over the at least one set of IDT electrodes and the first and second reflector gratings, and a continuous trench formed in the layer of silicon nitride over portions of bus bar electrodes and tips of electrode fingers of the at least one set of IDT electrodes and over portions of bus bar electrodes and electrode fingers of the first and second reflector gratings to reduce acoustic leakage at electrode fingers of the first and second reflector gratings proximate the at least one set of IDT electrodes.
    Type: Grant
    Filed: July 1, 2020
    Date of Patent: February 1, 2022
    Assignee: SKYWORKS SOLUTIONS, INC.
    Inventor: Koichi Hatano
  • Patent number: 11239537
    Abstract: A microwave resonator comprising a hollow tube comprising fan electrically conductive tube wall which defines a tube bore, the tube extending along a length axis from a first end to a second end; a first electrically conductive closing plate closing the first end of the tube; a second electrically conductive closing plate closing the second end of the tube; a plurality of dielectric resonant pucks, each puck comprising first and second end faces and a side wall extending therebetween, each puck being dimensioned such that its dominant mode is a doubly degenerate mode; the pucks being arranged within the tube bore spaced apart from each other and the closing plates, each puck being arranged with its end faces normal to the length axis and centered on the length axis and its side wall abutting the tube wall such that there is no air gap between the puck and tube wall which extends from one end face to the other of the puck, the puck adjacent to the first closing plate being termed the input puck; each puck bein
    Type: Grant
    Filed: February 13, 2018
    Date of Patent: February 1, 2022
    Assignee: ISOTEK MICROWAVE LIMITED
    Inventors: John David Rhodes, David Ibbetson, Vanessa Walker, Christopher Ian Mobbs
  • Patent number: 11233493
    Abstract: Methods for manufacturing resonator structures and corresponding resonator structures are described. A first wafer including a first piezoelectric material is singulated and bonded to a second wafer.
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: January 25, 2022
    Assignee: Infineon Technologies AG
    Inventors: Hans-Joerg Timme, Carsten Ahrens, Ruediger Bauder
  • Patent number: 11233302
    Abstract: Provided is a noise filter device that is capable of suppressing electrical interference between an input-side conductive line and an output-side conductive line. A noise filter device (10) includes: a noise filter (50) connected to a distal end of an input-side conductive line (41) and a distal end of an output-side conductive line (42); and a holding member (60) that holds the input-side conductive line (41) and the output-side conductive line (42). The holding member (60) includes: a body (61) attached to a wire harness (WH) so as to surround an outer circumference thereof; and a pair of hooks (62) that are respectively formed at two ends of the body (61) in a circumferential direction thereof, and are hooked on the input-side conductive line (41) and the output-side conductive line (42) to restrict the input-side conductive line (41) and the output-side conductive line (42) from approaching each other.
    Type: Grant
    Filed: April 25, 2019
    Date of Patent: January 25, 2022
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Takeshi Aizawa, Asato Hibino