Abstract: A power amplifier module includes a combining circuit including a combiner. The combining circuit further includes a first inductor connected in series between an output terminal of a first amplifier and the combiner, a second inductor connected in series between an output terminal of a second amplifier and the combiner, and a second capacitor having an end connected to the combiner and another end grounded. A phase of a third signal from the output terminal of the first amplifier to the second amplifier through the combiner is delayed by about 45 degrees in the first inductor and the second capacitor, and is delayed by about 45 degrees in the second inductor and the second capacitor. A phase of the third signal from the output terminal of the first amplifier to the second amplifier through the first capacitor is advanced by about 90 degrees.

Abstract: In certain aspects, a receiver includes first amplifiers, wherein each one of the first amplifiers comprises an input and an output. The receiver also includes second amplifiers, wherein each one of the second amplifiers comprises an input and an output, and the outputs of the second amplifiers are coupled to a combining node. The receiver also includes transmission lines, wherein each one of the transmission lines is coupled between the output of a respective one of the first amplifiers and the input of a respective one of the second amplifiers. The receiver further includes a load coupled to the combining node, and receiver elements, wherein each one of the receiver elements comprises an input and an output, and the output of each one of the receiver elements is coupled to the input of a respective one of the first amplifiers.

Abstract: Apparatus comprising a first layer of electrically conductive material, a second layer of electrically conductive material, and at least one dielectric layer, which comprises a solid dielectric material, arranged between said first layer and said second layer, wherein at least one distributed resonator structure comprising a plurality of resonator posts is arranged in said at least one dielectric layer.

Abstract: The present disclosure relates to a linkage mechanism for a phase shifter assembly, comprising a rotation device having a rotation shaft fixed to a substrate of the phase shifter assembly and a rotation member configured to rotate about said rotation shaft; a first drive member which can be operatively engaged to the rotation member such that rotation of the rotation member can cause movement of the first drive member; a second drive member disposed on and moving together with the rotation member; and a translation device including a translation member which can be operatively engaged to the second drive member such that movement of the second drive member can cause movement of the translation member, wherein the rotation device and the translation device are configured to move in association with each other during operation of the phase shifter assembly. The present disclosure also relates to a phase shifter assembly including the above-mentioned linkage mechanism.

Abstract: A resonator system is provided in which a combined overtone resonator device is excited with a two-dimensional mode of mechanical vibration in a cross sectional plane of a piezoelectric plate in response to an alternating voltage applied through an interdigitated electrode. The cross sectional plane extends along the width direction and the thickness direction, and the two-dimensional mode of mechanical vibration is a two-dimensional combined overtone mode of second and third order asymmetrical Lamb-wave overtones.

Abstract: A switching circuit is provided. The switching circuit includes at least one Surface Acoustic Wave (SAW) filter, a Single-Pole n Throw (SPnT) switch connected to an input port of each of the at least one SAW filter, and a Dual-Pole n Throw (DPnT) switch connected to an output port of each of the at least one SAW filter.

Abstract: Provided is an element that can reduce a parasitic oscillation.

Abstract: A communication module includes an input/output switch, a duplexer, a transmit filter, and a receive filter. In the duplexer, a second side is disposed at a position farther from the input/output switch than a first side in a second direction orthogonal to a first direction. Any one of the transmit filter and the receive filter is disposed adjacent to the input/output switch in the first direction.

Abstract: Heat exchanger assemblies for electronic devices are disclosed. A heat exchanger assembly may include a heat transfer body that has a face that forms open passageways. A cover structure may be attached to the heat transfer body in a manner to enclose the open passageways, thereby forming a heat exchanger assembly that includes enclosed fluid conduits. In this regard, the enclosed fluid conduits may form complex and intricate patterns within the heat exchanger assembly that are tailored to the heat requirements of a particular application. Heat exchanger assemblies as described herein may be thermally coupled to a center waveguide section of a spatial power-combining device. The enclosed fluid conduits may be tailored based on locations of amplifiers within the center waveguide section to provide improved thermal operation of the spatial power-combining device.

Abstract: A grounding structure of the high-frequency circuit board includes a dielectric substrate, a back surface ground electrode, an upper ground electrode, and a microstripline upper electrode. The dielectric substrate has a first surface and a second surface, and is provided with a first through-hole. A first opening of the first through-hole at the first surface is smaller than a second opening of the first through-hole at the second surface. A first grounding conductor layer is provided in the first through-hole. The back surface ground electrode is provided at the second surface and is connected with the first grounding conductor layer. The upper ground electrode is provided at the first surface and is connected with the first ground conductor layer. The microstripline upper electrode is provided at the first surface.

Abstract: An acoustic wave filter device includes a piezoelectric layer, a high-acoustic-velocity member, a low-acoustic-velocity film between the high-acoustic-velocity member and the piezoelectric layer, and first and second IDT electrodes on the piezoelectric layer to define acoustic wave resonators. An acoustic wave resonator of a series-arm resonator portion closest to an antenna end and/or an acoustic wave resonator of a parallel-arm resonator portion closest to the antenna end includes the first IDT electrode including first and second electrode fingers, and the remaining acoustic wave resonators include the second IDT electrode including third and fourth electrode fingers. In the first IDT electrode, a central area, first and second low-acoustic-velocity areas, and first and second high-acoustic-velocity areas extend along a direction perpendicular or substantially perpendicular to an acoustic wave propagating direction.

Abstract: A power combiner for combining a plurality of radio frequency signals into a combined output signal includes: a circular waveguide having a cross-section and three or more waveguides, each waveguide morphing to align with a common axis at a cross-section of the circular waveguide wherein each one of the three or more rectangular input waveguides gradually transitions from a rectangular cross-section to a cross-section resembling a pie slice of a composite circular cross section.

Abstract: Described are circuits and techniques to increase the efficiency of radio-frequency (rf) amplifiers including rf power amplifiers (PAs) through “supply modulation” (also referred to as “drain modulation” or “collector modulation”), in which supply voltages provided to rf amplifiers is adjusted dynamically (“modulated”) overtime depending upon the rf signal being synthesized. For the largest efficiency improvements, a supply voltage can be adjusted among discrete voltage levels or continuously on a short time scale. The supply voltages (or voltage levels) provided to an rf amplifier may also be adapted to accommodate longer-term changes in desired rf envelope such as associated with adapting transmitter output strength to minimize errors in data transfer, for rf “traffic” variations.

Abstract: A first phase shift circuit (2) converts impedance to achieve impedance matching between a third terminal (1c) of a 90-degree hybrid circuit (1) and a first terminal (4a) of a first nonlinear element (4), and shifts a phase of a radio wave by 180 degrees, and a second phase shift circuit (3) converts impedance to achieve impedance matching between a fourth terminal (1d) of the 90-degree hybrid circuit (1) and a first terminal (5a) of a second nonlinear element (5), and shifts a phase of a radio wave by 90 degrees. As a result of this configuration, a conversion loss of radio waves can be reduced.

Abstract: In accordance with an embodiment, an RF system includes a transmit path having a first tunable transmit band stop filter, and a power amplifier coupled to an output of the first tunable transmit band stop filter, where the first tunable transmit band stop filter is configured reject a receive frequency and pass a transmit frequency; a receive path comprising an LNA; and a duplex filter having a transmit path port coupled to an output of the power amplifier, a receive path port coupled to an input of the LNA, and an antenna port, where the duplex filter is configured to pass the transmit frequency and reject the receive frequency between the antenna port and the transmit path port, pass the receive frequency and reject the transmit frequency between the antenna port and the receive path port.

Abstract: A surface acoustic wave resonator comprises at least one set of interdigital transducer (IDT) electrodes disposed on an upper surface of a piezoelectric substrate between first and second reflector gratings, a layer of silicon nitride disposed over the at least one set of IDT electrodes and the first and second reflector gratings, and a continuous trench formed in the layer of silicon nitride over portions of bus bar electrodes and tips of electrode fingers of the at least one set of IDT electrodes and over portions of bus bar electrodes and electrode fingers of the first and second reflector gratings to reduce acoustic leakage at electrode fingers of the first and second reflector gratings proximate the at least one set of IDT electrodes.

Abstract: A filter device includes series and parallel arm resonators provided at a filter chip and inductors electrically connected in series with respective ones of the parallel arm resonators. A first inductor having the highest inductance of the inductors is electrically connected in series with a first parallel arm resonator having the highest anti-resonant frequency of the parallel arm resonators. One end of the first parallel arm resonator and one end of a second parallel arm resonator in other ones of the parallel arm resonators are electrically connected to a same wiring line in wiring lines separated by the series arm resonators on a line electrically connecting an input terminal and an output terminal of the filter chip. The other ends of the first and second parallel arm resonators are respectively electrically connected to first and second ground terminals of the filter chip.

Abstract: A microwave resonator comprising a hollow tube comprising fan electrically conductive tube wall which defines a tube bore, the tube extending along a length axis from a first end to a second end; a first electrically conductive closing plate closing the first end of the tube; a second electrically conductive closing plate closing the second end of the tube; a plurality of dielectric resonant pucks, each puck comprising first and second end faces and a side wall extending therebetween, each puck being dimensioned such that its dominant mode is a doubly degenerate mode; the pucks being arranged within the tube bore spaced apart from each other and the closing plates, each puck being arranged with its end faces normal to the length axis and centered on the length axis and its side wall abutting the tube wall such that there is no air gap between the puck and tube wall which extends from one end face to the other of the puck, the puck adjacent to the first closing plate being termed the input puck; each puck bein

Abstract: A duo-quad wideband wave guide combiner includes a circular waveguide having a center axis with a cross section with four quadrants; and two waveguides, each waveguide being bifurcated at an input to the wave guide combiner by a thin septum to split each of the two waveguide into two bifurcated waveguides, each of the bifurcated waveguides rotating to a respective one of the four quadrants about the center axis of the circular waveguide with converging walls terminating when a composite cross section becomes circular.

Abstract: A waveguide filter includes a fundamental waveguide unit. The fundamental waveguide unit may have an irregular hexagonal metal structure. One wall of the irregular hexagonal metal structure may form a connection to one or more walls of another fundamental waveguide unit having an irregular hexagonal metal structure. A fundamental waveguide unit may include a hollow irregular hexagonal metal structure which includes a resonant cavity that receives an electromagnetic signal and propagates the signal through the resonant cavity.