Abstract: The mode-whisperer waveguide device includes a main waveguide, a junction waveguide and a pair of recombination arm waveguides. The main waveguide features a spline taper extending along an axis of the main waveguide. The spline taper has been integrated with the normal linear aperture taper. The junction waveguide is attached to the main waveguide. The recombination arm waveguides are attached to the junction waveguide. A first port is coupled to the pair of recombination arm waveguides via a pair of recombination arm transformer steps. The main waveguide, the junction waveguide, the pair of recombination arm waveguides and the pair of recombination arm transformer steps are manufacturable as a monolithic waveguide device that is configured to achieve outstanding higher-order mode suppression due to the gradual dual spline taper which has been integrated with the normal linear taper to the aperture port.

Abstract: A phase shifter unit cell or a connected set of such cells that can be well isolated from external circuitry and which do not introduce insertion loss into an RF signal path, exhibit good return loss, and further provides additional advantages when combined with bracketing attenuator circuits. More particularly, embodiments integrate a high-isolation function within a phase shifter circuit by breaking the complimentary nature of the control signals to a phase shifter cell to provide greater control of switch states internal to the phase shifter cell and thus enable a distinct high-isolation state, and by including a switchable shunt termination resistor for use in the high-isolation state. Some embodiments are serially coupled to attenuator circuits to enable synergistic interaction that reduces overall die size and/or increases isolation. One such embodiment positions a high-isolation phase shifter cell in accordance with the present invention between bracketing programmable attenuators.

Abstract: An RF joint rotating about an axis of rotation (Z) includes a number N, greater than or equal to 1, of RF transmission channels, a first, internal surface of symmetry of revolution about the axis (Z) and of RF transmission having a first, internal radius r1, and a second, external surface of symmetry of revolution about the axis (Z) and of RF transmission having a second, external radius r2, strictly less than the first, internal radius r1.

Abstract: The present invention relates to a cable unit for connecting devices in a system, in particular in a patient monitoring system, to enable wireless exchange of data and/or power between them. The proposed cable unit comprises a cable (510) and a connector (520, 530) arranged at each end of said cable, said connector comprising a data transmission unit (522, 532) for transmitting data to and/or receiving data from a device having a counterpart connector and a magnetic coupling unit (521, 531) for transmitting power to and/or receiving power from another device of the system having a counterpart connector by use of inductive coupling.

Abstract: An acoustic wave filter includes a piezoelectric substrate, first and second input-output terminals, and a longitudinally coupled resonator unit in a path connecting the first and second input-output terminals to each other, and the resonator unit includes five or more interdigital transducer electrodes aligned in an acoustic wave propagation direction, the IDT electrodes include a center IDT electrode at the center in the propagation direction and first and second IDT electrodes at symmetric or substantially symmetric positions in the propagation direction with respect to the center IDT electrode, each of the first and second IDT electrodes includes a main pitch portion and a pair of narrow-pitch portions provided between the main pitch portion and both ends of the IDT electrode in the propagation direction, and the first and second IDT electrodes differ from each other in the number of electrode fingers of the main pitch portion.

Abstract: In a four-port transmission-line network, a first transmission line is connected to a first port, second and third transmission lines are connected to a first component port, fourth and fifth transmission lines are connected to a second component port, and a sixth transmission line is connected to a fourth port. The transmission lines are connected as baluns to the ports with the unbalanced signal on the port side and the balanced signals interconnecting with others of the transmission lines. In another example, two or more baluns are connected serially. Each balun includes two transmission lines having signal-return conductors connected together at the ends. One end of a signal conductor on the first balun forms a sum port. One end of the signal-return conductors of the second balun forms a difference port, and a capacitor connects the other end of the signal-return conductors to circuit ground.

Abstract: The present disclosure relates to a ladder-type surface acoustic wave (SAW) device, which includes a piezoelectric layer, two reflective structures, at least one series interdigital transducer (IDT) coupled between a first signal point and a second signal point, and at least one shunt IDT. The at least one shunt IDT is coupled at least between the first signal point and ground, or between the second signal point and ground. Herein, the two reflective structures, the at least one series IDT, and the at least one shunt IDT reside over the piezoelectric layer. The at least one series IDT and the at least one shunt IDT are arranged between the two reflective structures.

Abstract: A resonator assembly and method are disclosed.

Abstract: A surface acoustic wave device includes a piezoelectric substrate and functional elements on a first surface of the piezoelectric substrate. At least a portion of the functional elements includes an interdigital transducer (IDT) electrode, and a surface acoustic wave resonator is defined by the piezoelectric substrate and the IDT electrode. A portion of a wiring pattern connecting a first functional element and a second functional element is on a second surface different from the first surface of the piezoelectric substrate.

Abstract: Provided is a coil pattern formed on at least one surface of a substrate and including a first plating film formed on the substrate and a second plating film formed to cover the first plating film, a method of forming the coil pattern, and a chip device provided with the coil pattern.

Abstract: In a manufacturing method of a radio-frequency member in which an inner peripheral surface of a cavity in a die includes a functional-region section that provides the radio-frequency member, a gate opens in a first wall surface of the inner peripheral surface of the cavity, an overflow expands in a direction in which a second wall surface of the inner peripheral surface extends is opened in the second wall surface, the functional-region section is located in a main flow region, the functional-region section includes a plurality of rod forming holes, a distance between edges of openings of at least two rod forming holes is smaller than depths of both of the two rod forming holes, a metal material in a fluid state is injected into the cavity through the gate, and a portion of the metal material flows outside of the cavity from the overflow.

Abstract: A microwave resonator comprising a hollow tube comprising a plurality of electrically conductive wall faces which together define a tube wall defining a tube bore, the tube extending along a length axis from a first end to a second end; the tube wall having an N fold rotational symmetry about the length axis where 2<N<10; a first electrically conductive covering plate covering the first end of the tube; a second electrically conductive covering plate covering the second end of the tube; a dielectric puck comprising first and second end faces and a side wall extending therebetween, the puck being dimensioned such that when in the tube bore its dominant resonant mode is a doubly degenerate mode; the puck being arranged in the tube bore spaced apart from the covering plates with its end faces normal to the length axis and centered on the length axis; the puck being spaced apart from the tube wall by a plurality N of electrically conductive spacer blocks, the spacer blocks being spaced equally around the le

Abstract: Acoustic wave filter devices are disclosed. A device includes a layer providing or on a topmost layer of an acoustic reflector. The intermediary layer has a first region and a second region. The first region has a first layer thickness and the second region has a second layer thickness different from the first layer thickness. The device includes a first multilayer stack on the first region and a second multilayer stack on the second region of the intermediary layer. Each of the first and the second stacks includes a piezoelectric layer on a counter electrode that is located on the respective region, an input and an output electrode. Application of a radio frequency voltage between the input electrode and the counter electrode layer of the first stack creates acoustic resonance modes in the piezoelectric layer between the input and output electrodes of the first and the second stack.

Abstract: Examples provide a wideband filter structure and apparatus, a radio transceiver, a mobile terminal, and a method for filtering a radio signal. The wideband filter structure (10) for a radio signal comprises a combination of at least one acoustic resonator (12) and at least one analog resonator (14). The acoustic resonator (12) is coupled to the analog resonator (14). The wideband filter structure (10) comprises a further component (16), which is coupled to the combination of the acoustic resonator (12) and the analog resonator (14).

Abstract: A bulk-acoustic wave resonator includes: a first substrate formed of a first material; an insulating layer or a piezoelectric layer disposed on a first side of the first substrate; and a second substrate formed of a second material and disposed on a second side of the first substrate, wherein the second material has thermal conductivity that is higher than a thermal conductivity of the first material.

Abstract: A surface acoustic wave device includes a piezoelectric substrate, functional elements on the piezoelectric substrate, a cover portion that opposes the piezoelectric substrate with a support layer interposed therebetween, and an input/output terminal on the cover portion. At least a portion of the functional elements includes an interdigital transducer electrode, and a surface acoustic wave resonator is defined by the piezoelectric substrate and the IDT electrode. The functional elements include a filter that passes a signal in a predetermined frequency band, and a cancel circuit which is connected in parallel to the filter and attenuates a signal outside the predetermined frequency band in signals output from the output terminal. A portion of a wiring pattern connecting a first functional element and a second functional element included in the plurality of functional elements is provided on the cover portion.

Abstract: A power divider/combiner includes a main conductor defining an axis and having an outer surface; an input connector, at a front end, having a center conductor, electrically coupled to the main conductor and having an axis aligned with the main conductor axis; a first hollow cylindrical conductor having an open end facing rearwardly, having an inner cylindrical surface, the main conductor being received in and spaced apart from the inner cylindrical surface, the first hollow cylindrical conductor being electrically coupled to the second conductor of the input connector; a second hollow cylindrical conductor having an open end facing forwardly, the first cylindrical conductor being received in and spaced apart from the inner cylindrical surface of the second cylindrical conductor; a third hollow cylindrical conductor having an open back end facing rearwardly, the second cylindrical conductor being received in and spaced apart from the inner cylindrical surface of the third cylindrical conductor; and a plurality

Abstract: A power combiner/divider circuit can be structured having a base structure with the addition of an odd-mode capacitor and a low pass network at an end of the base structure or structured having a base structure with the addition of an inductor and a high pass network at an end of the base structure. The power combiner/divider circuit can be implemented as a port coupled to multiple ports with low pass networks or high pass networks arranged at the ends of paths to the multiple ports. In embodiments using low pass base structures or low pass networks coupled to the base structures, inductors in such low pass sections can be positively coupled on a pair-wise basis.

Abstract: The present invention is directed to a splitter or hub that provides plural ports for communicating MoCA signals between devices. More particularly, the present invention relates to a passive splitter to communicate MoCA signals between a gateway/amplifier port and customer devices, or a passive hub to communicate MoCA signals between customer devices. The splitter or hub includes a resistive splitter network and may include a MoCA passing filter and a test port.

Abstract: A matching module includes an input terminal connected to an input node, a variable load capacitor, and a plurality of RF signal delivery branches. The input terminal is connected to receive RF signals from one or more RF generators. The load capacitor is connected between the input node and a reference ground potential. Each of the plurality of RF signal delivery branches has a respective ingress terminal connected to the input node and a respective egress terminal connected to a respective one of a plurality of output terminals. Each of the plurality of output terminals of the matching module is connected to deliver RF signals to a different one of a plurality of plasma processing stations/chambers. Each of the plurality of RF signal delivery branches includes a corresponding inductor and a corresponding variable tuning capacitor electrically connected in a serial manner between its ingress terminal and its egress terminal.