Patents Examined by Robert J. Pascal
  • Patent number: 11032054
    Abstract: A sequenced transmit muting wideband power amplifier is provided that includes at least one pre-driver stage having at least a first pre-driver and a second pre-driver. A mute switch selectively establishes a communication path between the first and second pre-drivers or couples the second pre-driver to a termination resistor. A pre-driver switch selectively activates/deactivates the first and second pre-drivers. A driver stage is in communication with the pre-driver stage and includes a first driver. A final amplifier stage is in communication with the driver stage and includes at least one second driver. At least one S-NBS switch is configured to selectively activate/deactivate the first driver and second driver. A controller is configured to activate the at least one pre-driver switch, the mute switch, the at least one S-NBS switch to selectively place the amplifier in one of a transmit mode and a mute mode.
    Type: Grant
    Filed: September 24, 2019
    Date of Patent: June 8, 2021
    Assignee: Andrew Wireless Systems GmbH
    Inventors: Johannes Steigert, Patrick Braun, Milian Reile
  • Patent number: 11024975
    Abstract: A multi-band orthomode transducer device comprises a three-dimensional housing. The three-dimensional housing encompasses at least two orthomode transducers, each orthomode transducer being assigned to three ports of which a first port relates to a first polarization, a second port relates to a second polarization and a third port relates to a combination of the first and second polarizations. Each of the orthomode transducers has a waveguide connected with the three ports. The waveguides of the orthomode transducers are located in the three-dimensional housing without intersecting each other.
    Type: Grant
    Filed: June 19, 2019
    Date of Patent: June 1, 2021
    Assignee: Rohde & Schwarz GmbH Co. KG
    Inventors: Corbett Rowell, Christian Riedel
  • Patent number: 11018648
    Abstract: A sonic logging broadband impedance matching transformer modular design method and a module are related to sonic logging. The method includes the steps: obtaining component values of a multimodal equivalent circuit of a piezoelectric transducer by fitting actual impedance data of the piezoelectric transducer through a nonlinear regression method; selecting a T-type network structure composed of a matching capacitor and a matching inductor as a piezoelectric transducer impedance matching network structure; and presetting a to-be-matched frequency band and a reflection coefficient, and taking the multimodal equivalent circuit of the transducer as an artificial circuit load to optimize parameters of the piezoelectric transducer impedance matching network structure and a boosting transformer together so as to obtain final optimized parameters of the piezoelectric transducer impedance matching network structure and the transformer.
    Type: Grant
    Filed: December 10, 2020
    Date of Patent: May 25, 2021
    Assignee: INSTITUUTE OF GEOLOGY AND GEOPHYSICS, CHINESE ACADEMY OF SCIENCES
    Inventors: Xin Fu, Yuntao Sun, Yang Gou, Wenxuan Chen, Fuqiang Wei
  • Patent number: 11018641
    Abstract: A power combiner circuit comprises a network topology for broadband RF and microwave systems that includes coupling elements, internodal matching sections, and an output matching section. The network topology serves as a combining mechanism for power from multiple power amplifiers. The network topology is designed so that characteristic impedances of transmissions lines serving as the coupling elements, internodal matching sections, and an output matching section produce a load impedance at an output port that is matched to the impedances seen by each power amplifier providing power to the power combiner circuit. Such a network topology is scalable to an unlimited number of power amplifiers, and enables a desired broadband frequency response for power amplification, while realizing a very low level of power output loss between input and output ports.
    Type: Grant
    Filed: August 3, 2019
    Date of Patent: May 25, 2021
    Assignee: OPHIR RF, INC.
    Inventors: Ramon A. Beltran, Feiyu Wang, Gregorio Villagrana
  • Patent number: 11018650
    Abstract: An acoustic wave device includes a piezoelectric substrate, an interdigital transducer electrode on the piezoelectric substrate, and two reflectors on both sides of the interdigital transducer electrode in an acoustic wave propagation direction. The reflectors include first and second busbars and first to third electrode fingers, respectively, and the first and second busbars are opposed to one another. The first busbars and the second busbars are connected by at least one third electrode finger. The reflectors each include a center area located centrally in a length direction and a first high-acoustic-velocity area that is located between the center area and the first busbars and has an acoustic velocity higher than the acoustic velocity of the center area, where the length direction is a direction in which the first to third electrode fingers extend.
    Type: Grant
    Filed: June 18, 2019
    Date of Patent: May 25, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Kazuhiro Takigawa
  • Patent number: 11011817
    Abstract: The present disclosure provides a waveguide-excited terahertz microstrip antenna. The antenna includes a dielectric substrate, a ground plate, a rectangular waveguide, a metal pin, and a radiation patch. The dielectric substrate has a first surface and a second surface opposite to the first surface. The ground plate is located on the first surface of the dielectric substrate and defines a coupling slit. The rectangular waveguide is located on a surface of the ground plate away from the dielectric substrate and extended substantially along a first direction parallel to the first surface. The metal pin is located inside the rectangular waveguide, and is in contact with the ground plate and substantially perpendicular to the ground plate. The radiation patch is located on the second surface of the dielectric substrate.
    Type: Grant
    Filed: December 5, 2019
    Date of Patent: May 18, 2021
    Assignee: TSINGHUA UNIVERSITY
    Inventors: Xiao-Ping Zheng, Xia-Hui Han, Sheng-Chuang Bai, Hua Geng, De-Jian Zhang, Jia-Ming Liu
  • Patent number: 11011818
    Abstract: First ends of a plurality of sub-networks of an exemplary transmission-line network are connected together electrically in series. First ends of a plurality of transmission lines of one subnetwork are connected together in parallel and second ends are connected together in series. The one sub-network has a first-end impedance value that is different than a second-end impedance value. The second-end impedance value of the one sub-network is different than a second-end impedance value of another sub-network. A respective transmission line connects each sub-network to a common circuit node and a respective resistor interconnects each adjacent pair of the second ends of the sub-networks.
    Type: Grant
    Filed: August 4, 2020
    Date of Patent: May 18, 2021
    Assignee: Werlatone, Inc.
    Inventors: Ky-Hien Do, Allen F. Podell, Mariama Dadhi Barrie
  • Patent number: 11005449
    Abstract: A notch filter includes an inductor coupled between an input node and an output node, and a dual-resonator structure coupled between the input node, the output node, and ground.
    Type: Grant
    Filed: December 5, 2018
    Date of Patent: May 11, 2021
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Ruediger Bauder, Andreas Bogner, Hans-Joerg Timme
  • Patent number: 11005436
    Abstract: A monolithic microwave integrate circuit (MMIC) presents as a power amplifier including a 9:1 overlay transformer and artificial low impedance transmission lines. The 9:1 overlay transformer effects the output impedance thereof. The artificial low impedance transmission lines behave as inductors without occupying an amount of space equivalent to that of an inductor having similar properties as the artificial low impedance transmission line.
    Type: Grant
    Filed: January 17, 2019
    Date of Patent: May 11, 2021
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: James J. Komiak, Cheryl V. Liss
  • Patent number: 11005437
    Abstract: Spatial power-combining devices and, more particularly, spatial power-combining devices with improved isolation are disclosed. Spatial power-combining devices are disclosed that include a thin film resistor that is configured to provide improved signal isolation. The thin film resistor may be arranged within one or more amplifier assemblies of the spatial power-combining device to reduce signal leakage between the amplifier assemblies. The thin film resistor may be formed on a carrier substrate or the thin film resistor may supported by a surface of an amplifier assembly without a carrier substrate. Spatial power-combining devices are disclosed that include a radial arrangement of amplifier assemblies, and each amplifier assembly includes an antenna structure and a thin film resistor.
    Type: Grant
    Filed: February 25, 2019
    Date of Patent: May 11, 2021
    Assignee: Qorvo US, Inc.
    Inventors: Soack Dae Yoon, Ankush Mohan, Dan Denninghoff
  • Patent number: 11005451
    Abstract: A bandpass filter includes a capacitor coupled between an input node and an output node, and a dual-resonator structure coupled between the input node, the output node, and ground.
    Type: Grant
    Filed: December 5, 2018
    Date of Patent: May 11, 2021
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Ruediger Bauder, Andreas Bogner, Hans-Joerg Timme
  • Patent number: 10998606
    Abstract: In embodiments, a power splitter/combiner includes a first electrically conductive trace included in a first layer; second and third electrically conductive traces included in a second layer; a first via electrically coupled to the first and second electrically conductive traces; and a second via electrically coupled to the first and third electrically conductive traces. A first portion of the first electrically conductive trace comprises a first port of the power splitter/combiner. A second portion of the first electrically conductive trace, the first via, and the second electrically conductive trace comprises a second port of the power splitter/combiner. A third portion of the first electrically conductive trace, the second via, and the third electrically conductive trace comprises a third port of the power splitter/combiner.
    Type: Grant
    Filed: February 14, 2019
    Date of Patent: May 4, 2021
    Assignee: Space Exploration Technologies Corp.
    Inventors: Souren Shamsinejad, Javier Rodriguez De Luis, Nil Apaydin, Alireza Mahanfar
  • Patent number: 10996958
    Abstract: A test board is provided including a first branch line including a first portion which receives an input signal and a second portion opposite to the first portion. A plurality of second branch lines branch from the first branch line. Each of the second branch lines include a third portion connected to the second portion of the first branch line and a fourth portion connected to the third portion. A first characteristic impedance of the first portion of the first branch line is different from a second characteristic impedance of the second portion of the first branch line. A third characteristic impedance of the third portions of each of the second branch lines is different from a fourth characteristic impedance of the fourth portions of each of the second branch lines. The second characteristic impedance is equal to a combined characteristic impedance of the third portions of each of the second branch lines.
    Type: Grant
    Filed: September 17, 2019
    Date of Patent: May 4, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jong Jin An, Jae Hyun Kim
  • Patent number: 10998883
    Abstract: The present invention discloses a type of ultra-wide band SAW filter which comprises a first SAW resonator group and a second SAW resonator group that are connected to form a ladder structure. Each SAW resonator in the said first SAW resonator group has the same film thickness; each SAW resonator in the said second SAW resonator group has the same film thickness; the film thickness of each SAW resonator in the said first SAW resonator group is the same as or different from the film thickness of each SAW resonator in the said second SAW resonator group. The SAW filter according to the present invention can realize the pass-band non-parasitic mode response and is a high-performance ultra-wide band filter with a bandwidth of 6-20% of the center frequency and an insertion loss of less than 2 dB, and the present invention features small size, low cost and a broad application prospect in the field of military and civilian communications equipment.
    Type: Grant
    Filed: April 6, 2017
    Date of Patent: May 4, 2021
    Assignee: Shoulder Electronics Co., Ltd.
    Inventors: Weibiao Wang, Hongqing Mao, Peng Wei, Zengtian Lu, Zhuang Li, Zhaosu Sun
  • Patent number: 10998882
    Abstract: Acoustic resonator devices, filter devices, and methods of fabrication are disclosed. An acoustic resonator includes a substrate having a surface and a single-crystal piezoelectric plate having front and back surfaces. The back surface is attached to the surface of the substrate except for a portion of the piezoelectric plate forming a diaphragm that spans a cavity in the substrate, the diaphragm having an edge about a perimeter of the cavity. An interdigital transducer (IDT) is formed on the front surface of the single-crystal piezoelectric plate such that interleaved fingers of the IDT are disposed on the diaphragm. The IDT is configured to excite a primary acoustic mode in the diaphragm in response to a radio frequency signal applied to the IDT. At least a portion of the edge of the diaphragm is at an oblique angle to the fingers and to an X crystalline axis of the piezoelectric plate.
    Type: Grant
    Filed: April 2, 2020
    Date of Patent: May 4, 2021
    Assignee: Resonant Inc.
    Inventors: Ventsislav Yantchev, Patrick Turner, Viktor Plesski, Julius Koskela, Robert B. Hammond
  • Patent number: 10999924
    Abstract: An apparatus comprising includes a first pair of conductors to carry differential signals, at least one ground conductor neighboring the first pair of conductors, the ground conductor to be connected to a ground plane, and at least one particular conductor to carry sideband signals. The particular conductor is to be connected to a ground plane via a resonance mitigation circuit, and the resonance mitigation circuit comprises a resistor.
    Type: Grant
    Filed: December 20, 2019
    Date of Patent: May 4, 2021
    Assignee: Intel Corporation
    Inventors: Timothy D. Wig, Steven K. Krooswyk, Marc Wells
  • Patent number: 10992019
    Abstract: A small scale power divider which is less susceptible to large tolerances in the manufacture includes a substrate and a power dividing circuit thereon. The power dividing circuit includes an input port, a first output port, a second output port, an impedance converter, a first microstrip line, and a second microstrip line. An end of the first microstrip line is connected to the impedance converter, another end of the first microstrip line is connected to the first output port. An end of the second microstrip line is connected to the impedance converter, another end of the second microstrip line is connected the second output port.
    Type: Grant
    Filed: June 6, 2019
    Date of Patent: April 27, 2021
    Assignee: NANNING FUGUI PRECISION INDUSTRIAL CO., LTD.
    Inventor: Yu-Chih Chueh
  • Patent number: 10992282
    Abstract: There is disclosed acoustic resonators and filter devices. An acoustic resonator includes a substrate having a surface and a single-crystal piezoelectric plate having front and back surfaces, the back surface attached to the surface of the substrate except for a portion of the piezoelectric plate forming a diaphragm that spans a cavity in the substrate. An interdigital transducer (IDT) is formed on the front surface of the single-crystal piezoelectric plate such that interleaved fingers of the IDT are disposed on the diaphragm. The interleaved fingers include a first layer having a rectangular shape adjacent the diaphragm and a second layer over the first layer opposite the diaphragm, and wherein a width of the second layer varies along a length of each finger.
    Type: Grant
    Filed: November 10, 2020
    Date of Patent: April 27, 2021
    Assignee: Resonant Inc.
    Inventors: Viktor Plesski, Julius Koskela
  • Patent number: 10992016
    Abstract: Embodiments of the invention include a mm-wave waveguide connector and methods of forming such devices. In an embodiment the mm-wave waveguide connector may include a plurality of mm-wave launcher portions, and a plurality of ridge based mm-wave filter portions each communicatively coupled to one of the mm-wave launcher portions. In an embodiment, the ridge based mm-wave filter portions each include a plurality of protrusions that define one or more resonant cavities. Additional embodiments may include a multiplexer portion communicatively coupled to the plurality of ridge based mm-wave filter portions and communicative coupled to a mm-wave waveguide bundle. In an embodiment the plurality of protrusions define resonant cavities with openings between 0.5 mm and 2.0 mm, the plurality of protrusions are spaced apart from each other by a spacing between 0.5 mm and 2.0 mm, and wherein the plurality of protrusions have a thickness between 200 ?m and 1,000 ?m.
    Type: Grant
    Filed: January 5, 2017
    Date of Patent: April 27, 2021
    Assignee: Intel Corporation
    Inventors: Telesphor Kamgaing, Sasha Oster, Georgios Dogiamis, Johanna Swan
  • Patent number: 10992281
    Abstract: A bulk acoustic wave resonator includes a substrate; a lower electrode disposed on the substrate; a piezoelectric layer disposed to cover at least a portion of the lower electrode; an upper electrode disposed to cover at least a portion of the piezoelectric layer; and a passivation layer disposed to cover at least a portion of the upper electrode, wherein the passivation layer includes a non-trimming-processed portion disposed outside an active region of the bulk acoustic wave resonator in which portions of the lower electrode, the piezoelectric layer, and the upper electrode overlap, and having a thickness that is thicker than a thickness of a portion of the passivation layer disposed in the active region.
    Type: Grant
    Filed: May 1, 2019
    Date of Patent: April 27, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Yong Suk Kim, Moon Chul Lee, Sung Jun Lee, Chang Hyun Lim, Jae Hyoung Gil, Sang Hyun Yi