Abstract: In order to regulate the metal ion concentration in an electrolyte fluid serving to electrolytically deposit metal and additionally containing substances of an electrochemically reversible redox system, it has been known in the art to conduct at least one portion of the electrolyte fluid through one auxiliary cell provided with one insoluble auxiliary anode and at least one auxiliary cathode, a current being conducted between them by applying a voltage. Accordingly, excess quantities of the oxidized substances of the redox system are reduced at the auxiliary cathode, the formation of ions of the metal to be deposited being reduced as a result thereof. Starting from this prior art, the present invention relates to using pieces of the metal to be deposited as an auxiliary cathode.

Abstract: Metal articles having a durable visible marking on a smooth Type III hard anodized surface particularly useful for shock absorber tubes are produced by applying an alkaline solution to the anodized surface for not less than about 15 seconds at temperature of 100°-140° F.; applying a pattern of lacquer based solvent ink to said surface; and sealing the applied pattern by applying a liquid selected from the group consisting of nickel acetate, cobalt acetate and boiling water to said pattern.

Abstract: A method of brazing an aluminum or aluminum alloy material, containing brazing an aluminum alloy brazing sheet that has an aluminum or aluminum alloy core material and, being clad on one or both surfaces, a filler alloy layer comprised of an Al—Si-based alloy and contains Mg incorporated at least in a constituent layer except the filler alloy layer, thereby to form a hollow structure whose one surface clad with the filler alloy is the inner surface, wherein the brazing is carried out in an inert gas atmosphere without applying any flux; and an aluminum alloy brazing sheet which satisfies the relationship: (X+Y)?a/60+0.5 and X>Y, wherein a (?m) represents the thickness of the filler alloy layer clad on the core material of the inner side of the hollow structure, and X and Y (mass %) represent the Mg contents of the core material and the brazing material, respectively.

Abstract: A process for the production of wear-resistant, coated surfaces includes the use of at least two electrodes connected to a voltages source which are mounted in, or border, a reaction space through which an electrolyte flows in which the surface to be coated is located. The process is distinguished by the fact that the direction of the flow of the electrolyte is selectively reversed at least once during the coating process to enable better control of the formation of the oxide layer.

Abstract: A round formwork module comprising a flexible skin having a front side which, when used, constitutes the forming surface for a concrete structure which is to be cast, and also provided with a rear side and a supporting structure which is arranged on the rear side of the skin and which can be displaced in order to enable the skin to be bent along a direction in which it extends. The invention is characterized in that the supporting structure has a base structure and two side elements which are arranged laterally, close to the base structure. The side elements are respectively secured to a lateral edge area of the skin and protrude therefrom close to the base structure. An adjustment device for adjusting the curvature is provided in between the base structure and the side elements.

Abstract: An electrodeposited copper foil to be laminated on an insulation substrate for a printed circuit board, comprising a barrier layer of ternary alloy of Zn—Co—As formed on the copper foil, is provided. Further, a surface treatment method of an electrodeposited copper foil for a printed circuit board, comprising electrolytically treating the copper foil in an electrolytic solution containing pyrophosphoric acid potassium of about 10 g/l to about 200 g/l, Zn of about 0.1 g/l to about 20 g/l, Co of about 0.1 g/l to about 20 g/l and As of about 0.05 g/l to about 5 g/l, is provided. Further, the electrolytic solution remains at the temperature of about 20° C. to about 50° C. and a pH of about 9 to about 13. The copper foil is electrolytically treated for about 2 seconds to about 20 seconds at a cathode current density of about 0.5 A/dm2 to about 20 A/dm2.

Abstract: A cleaning apparatus for an ECMD anode pad including a vacuum head which applies vacuum pressure to the surface of the anode pad between ECMD operations in order to remove particles precipitated onto the surface of the anode pad and prevent or minimize inadvertent scratching or peeling of a wafer supported by the pad during the process. The particles are dislodged from the anode pad and removed from the ECMD system by flow of electrolyte solution into the vacuum head. The electrolyte solution is typically filtered before returning to the electrolyte tank for ultimate redistribution to the ECMD system.

Abstract: A process for forming oxide based dense ceramic composite coatings on reactive metal and allow bodies involves suspension of at least two reactive metal or alloy bodies in a non-metallic, non-conducting, non-reactive chamber in such a way that it causes either partial or full immersion of the bodies in a continuously circulating electrolyte. Thyristor controlled, modified shaped wave multiphase alternating current power supply is applied across the bodies where in each body is connected to an electrode. Electric current supplied to the bodies is slowly increased to a particular value till the required current density is achieved and the maintained at the same level throughout the process. Visible arcing at the surface of the immersed regions of the bodies is identified when the applied electric potential crosses 60V. Electric potential is further increased gradually to compensate the increasing resistance of the coating.

Abstract: This invention relates to a stainless steel gasket having markedly improved strength and fatigue properties due to precipitation strengthening. Its composition comprises C: at most 0.03%, Si: at most 1.0%, Mn: at most 2%, Cr: 16.0%-18.0%, Ni: 6.0%-8.0%, N: at most 0.25%, if necessary Nb: at most 0.30%, and a remainder of Fe and unavoidable impurities. After cold rolling, final annealing is carried out, and after a structure is formed of recrystallized grains with an average grain diameter of at most 5 ?m having an area ratio of 50-100% and an unrecrystallized portion having an area ratio of 0-50%, a metal gasket is formed by steps including temper rolling with a reduction of at least 30% to make the area ratio of a strain induced martensite phase at least 40%, and forming and heat treatment at 200-350° C.

Abstract: Martensitic stainless steel whose steel composition is restricted within a specific range for each element is provided. The scale layer formed on the surface of the base material consists of an inner layer scale mainly including FeCr2O4 and an outer layer scale having a thickness of not more than 20 ?m, which outer layer is deposited on the inner layer scale at a surface coverage of not less than 1% and not more than 15%. The application of rust preventive oil onto the surface of the steel ensures an excellent weather resistance during a long term, and therefore a martensitic stainless steel forming no rust either in the outdoor depository or in the indoor depository can be provided. The steel can be used to manufacture, not only steel pipes, but also steel plates, steel rods and others in a wide application field.

Abstract: The present invention relates to a method for the manufacture of galvannealed metal sheet, wherein a hot strip is produced from an IF steel containing 0.01 to 0.1 wt. % silicon, wherein the hot strip is coiled at a coiler temperature no lower than 700° C. and no higher than 750° C., wherein a cold strip is rolled from the coiled hot strip, wherein the cold strip is recrystallization-annealed in an annealing furnace in an annealing gas atmosphere, wherein the cold strip thus annealed is provided with a zinc coating in a zinc bath, and wherein the coated cold strip is post-annealed at a galvannealing temperature no lower than 500° C. and no higher than 540° C. The invention also relates to a galvannealed metal sheet which possesses improved adhesion of the coating layer to the base material and proposes a method which is suited for the manufacture of metal sheet having such properties.

Abstract: The invention relates to a process which is suitable for applying a permanently adhering, stable, dirt and water repellent coating to metallic surfaces, specifically chromium surfaces, specifically sanitary and kitchen fixtures, and also to the components coated in this manner. The process is based on first chemically activating the surface and then coating it by means of a sol.

Abstract: The invention relates to the analysis of the performance and properties of electrochemical processes, and specifically, to electrolytic solutions and electrode processes. The invention discloses a device and a method for obtaining qualitative and quantitative information for the kinetics of the electrode reactions, the transport processes, the thermodynamic properties of the electrochemical processes taking place in the cell. When a deposition reaction takes place, the device provides also valuable information about the relationship between the current density and deposit properties including but not limited to the deposit color, luster, and other aspects of its appearance. The device disclosed herein typically is comprised of a multiplicity of cathodic or anodic regions where one or more electrochemical reactions take place simultaneously, but at a different rate.

Abstract: A method and apparatus for treating an aqueous electroplating bath solution. The method comprises continuously agitating the solution; adjusting the pH of the solution, adjusting the temperature of the solution while adding an amount of hydrogen peroxide sufficient to promote dissolution of the hydrogen peroxide and generation of hydroxyl radicals; and adding an amount of an iron-containing compound so as to increase the rate of dissolution of the hydrogen peroxide to hydroxyl radicals so as to oxidize the organic compounds; whereby the total amount of organic carbon compounds in the solution is reduced. The apparatus comprises a treatment vessel, a pump for transferring a portion of the solution from the vessel to a mixing tank and for transferring a second portion of the solution to a heat exchanger for heating or cooling the second portion of the solution and a pump for transferring hydrogen peroxide to the vessel.

Abstract: An external terminal of an electronic component is provided with a lead base material and a metal thin film coating a surface of the lead base material, and an average value of a crystal size index is not less than 7, which is defined based on dimensions of a crystal particle in a direction perpendicular to the lead base material surface and in a direction parallel thereto, taken on a cut surface of the metal thin film defined by a given plane cutting the metal thin film in a direction perpendicular to the lead base material surface. Such constitution provides an electronic component having an external terminal coated with a metal thin film of a simple structure constituted of Sn or a Sn-based and substantially Pb-free alloy, formed by plating on a surface of a lead base material.

Abstract: The present invention provides methods of polishing and/or cleaning copper interconnects using bis(perfluoroalkanesulfonyl) imide acids or copper tris(perfluoroalkanesulfonyl) methide acids compositions.

Abstract: A negative bias is applied to an integrated circuit wafer immersed in an electrolytic plating solution to generate a DC current. After about ten percent to sixty percent of the final layer thickness has formed in a first plating time, biasing is interrupted during short pauses during a second plating time to generate substantially zero DC current. The pauses are from about 2 milliseconds to 5 seconds long, and typically about 10 milliseconds to 500 milliseconds. Generally, about 2 pauses to 100 pauses are used, and typically about 3 pauses to 15 pauses. Generally, the DC current density during the second plating time is greater than the DC current density during the initial plating time. Typically, the integrated circuit wafer is rotated during electroplating. Preferably, the wafer is rotated at a slower rotation rate during the second plating time than during the first plating time.

Abstract: A surface processing method and power transmission component includes refining a surface region of a metal from a first roughness to a second roughness less than the first roughness. A solid lubricous coating or a hard coating is then deposited on the surface region. The metal has a surface hardness above 50 Rc to reduce the risk that the metal will deform under the coating and leave the coating unsupported. The surface region of the metal may be transformed into a nitrogen-containing compound or solid solution surface region before the surface refining step and deposition of the coating.

Abstract: A chain including chain pins 15, which connect an inner link plate and an outer link plate, are made of carburized or refined steel, and have the entire surface on which a large number of dimples 17 are provided which are formed through a primary shot peening performed at an arc height value of 0.35 to 0.8 mmA. Furthermore, dimples 21 with a size smaller than that of the dimples 17 are formed by applying a secondary shot peening performed at an arc height value smaller than that of a primary shot peening to the dimples 17 which have been subjected to the primary shot peening.

Abstract: A method, a composition and a method for making the composition for anodizing metal surfaces, especially magnesium surfaces is disclosed. The composition is a basic aqueous solution including hydroxylamine, phosphate anions and nonionic surfactants. A complementary method, composition and method for making the composition for rendering an anodized metal surface, especially a magnesium surface, conductive is disclosed. The composition is a basic aqueous solution including bivalent nickel, pyrophosphate anions, sodium hypophosphite and either ammonium thiocyanate or lead nitrate.