Abstract: The following steps are conducted: preparing a metal salt carried-substrate A by soaking a sintered nickel substrate in an acidic solution containing cobalt ions and at least one metal ions of magnesium ions, iron ions and manganese ions, and drying thus soaked substrate; preparing a hydroxide carried-substrate B by soaking the substrate A in an alkaline solution to deposit cobalt hydroxide and at least one metal hydroxide of magnesium hydroxide, iron hydroxide and manganese hydroxide in the pores and on the surface of the substrate A; obtaining an oxide carried-substrate C by oxidizing the cobalt hydroxide to produce cobalt oxide having a mean cobalt valence of over 2; and obtaining an active material carried-substrate D by soaking the substrate C in a solution containing nickel nitrate dissolved therein, drying thus soaked substrate C, and then soaking thus dried substrate C in an alkaline solution, to fill the active material in the substrate C.
Type:
Grant
Filed:
July 26, 2002
Date of Patent:
October 19, 2004
Assignee:
Matsushita Electric Industrial Co., Ltd.
Abstract: A relatively simple and inexpensive process for plating precious alloyed metals, such as AuSn, AuSnIn, AgSn, AuIn and AgIn. Anodes are formed from each of the metal components in the alloy and disposed in a conducting solution. The mass of each metal components is determined by Faraday's law. The target is also disposed in the conducting solution. Plating current is independently applied to each anode. The plating is conducted under an ultraviolet light sources to optimize the process. The plating alloys can be used for various purposes including attaching a semiconductor die to a substrate. Since the process does not involve exposure of the semiconductor die to a relatively high temperature for a relatively long time, the process does not pose a risk of contamination of the semiconductor by the adhesive or wax used to hold the die in place on the carrier during processing.
Type:
Grant
Filed:
September 24, 2002
Date of Patent:
October 19, 2004
Assignee:
Northrop Grumman Corporation
Inventors:
Dean Tran, Salim Akbany, Ronald A. DePace, William L. Jones, Roosevelt Johnson
Abstract: The use of an insulating shield for improving the current distribution in an electrochemical plating bath is disclosed. Numerical analysis is used to evaluate the influence of shield shape and position on plating uniformity. Simulation results are compared to experimental data for nickel deposition from a nickel—sulfamate bath. The shield is shown to improve the average current density at a plating surface.
Type:
Grant
Filed:
November 26, 2002
Date of Patent:
October 12, 2004
Assignee:
Sandia National Laboratories
Inventors:
John T. Hachman, Jr., James J. Kelly, Alan C. West
Abstract: A semi-hard magnetic alloy for activation strips in magnetic anti-theft security systems is disclosed that contains 8 to 25 weight % Ni, 1.0 to 4.5 weight % Al, 0.5 to 3 weight % Ti and the balance iron.
Abstract: A method for in-situ cleaning an electrodeposition surface following an electroplating process including providing a first electrode assembly and a second electrode assembly; applying a first current density across the first electrode assembly and the second electrode assembly for carrying out the electrodeposition process; carrying out the electrodeposition process to electrodeposit a metal onto an electrodeposition surface of the second electrode assembly; and, applying a second current density having a second polarity reversed with reference to the first polarity across the first electrode assembly and the second electrode assembly the second current density having a relatively lower current density compared to the first current density.
Abstract: A method for electrodepositing a uniformly thick coating on a metallic mesh is provided, the method comprises the steps of: (1) providing a metallic mesh having a plurality of apertures having at least one dimension greater than nanometer scale sizes; (2) subjecting the metal mesh to a relatively fast deposition of an electrodeposited material so as to substantially uniformly coat said mesh with electrodeposited material; and (3) subjecting the product of the relatively fast deposition step to a relatively slow deposition of an electrodeposited material so as to reduce at least one dimension greater than nanometer scale size to a size of nanometer scale. Also provided are metallic meshes so prepared and spectral filters.
Abstract: The invention deals with the technical problem to devise a process for the extended use of electrolytes which economically ensures a high electrolyte quality without having to accept production interruptions for regeneration. Especially, it is envisaged to conduct the process for the precipitation of non-glaring metal coatings in such a manner that work can proceed in three shifts for five days per week, without encountering production interruptions due to coagulation of the fine dispersal phase, respectively, and without the additional operating cost of a heating/cooling circuit. The invention solves the problem in that during the extended use of an electrolyte a partial flow is split off which is filtered and, if applicable, regenerated by the addition of active substances and reintegrated in the operating cycle.
Type:
Grant
Filed:
October 3, 2002
Date of Patent:
September 28, 2004
Assignee:
Enthone Inc.
Inventors:
Ralf Wilhelm Ludwig, Gerd Schöngen, Elmar Tolls
Abstract: Using aqueous electrolytes containing complex fluorides or oxyfluorides such as fluorozirconates, fluorotitanates, and fluorosilicates, articles containing light metals such as magnesium and aluminum may be rapidly anodized to form protective surface coatings. White coatings may be formed on aluminum articles using pulsed direct current or alternating current. When the article to be anodized is comprised of magnesium, pulsed direct current having a relatively low average voltage is preferably used.
Abstract: A novel method of electrochemical treatment such as electroplating, etc. and an electrochemical reaction apparatus thereof which is high in reactability and able to be electrochemically reacted efficiently, which is small or zero in amount of generation of liquid waste such as electrolytic solution and cleaning liquid and therefore, amicable to the environment, and in which it is no more required to clean the electrode, etc. with cleaning liquid after reaction. Electrochemical reaction is executed in a reaction vessel (6) containing matter (5) which is in a supercritical or subcritical state and an electrolytic solution (1), and after reaction, the supercritical or subcritical matter (5) is shifted into a state of the matter (5) before being shifted into a critical state.
Abstract: A method for alternately electrodepositing and electro-mechanically polishing to selectively fill a semiconductor feature with metal including a) providing an anode assembly and a semiconductor wafer disposed in spaced apart relation including an electrolyte there between the semiconductor wafer including a process surface including anisotropically etched features arranged for an electrodeposition process; b) applying an electric potential across the anode assembly and the semiconductor wafer to induce an electrolyte flow at a first current density to electrodeposit a metal filling portion onto the process surface; c) reversing the electric potential to reverse the electrolyte flow at a second current density to electropolish the process surface in an electropolishing process; and, d) sequentially repeating the steps b and c to electrodeposit at least a second metal filling portion to substantially fill the anisotropically etched features.
Abstract: A copper damascene process for a mechanically weak low k dielectric layer is described. Electropolishing is used to etch back the copper. A sacrificial conductive layer beneath the barrier layer assures complete planarization of the copper.
Abstract: This invention relates to a structure on a bi-color rust-proof barrier layer of a tool head, mainly used to form a surrounding recessed section marked with indication of a size, a model, a trademark and the like on a surface of a tool head (a metallic object) so that the structure on the rust-proof barrier layer painted with the different two colors is provided between the recessed section and the peripheral surface, thereby highlighting the indication marked at the recessed section so as to increase the distinctions of said object from other object.
Abstract: The present invention is directed to a metal block suitable for machining, the metal block comprising at least two superimposed metal plates, each having a thickness of at least 12.5 mm, wherein the yield strength of the block is at least 75% of the yield strength of the initial metal plate(s). The present invention is further directed to methods for manufacturing such blocks from two or more thick metal plates by explosive welding and other methods. Blocks according to the present invention are useful, for example, for manufacturing aircraft structural components or injection molds for plastics or rubber.
Abstract: The present invention provides inter alia electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention are characterized in significant part by a grain refiner/stabilizer additive comprising one or more non-aromatic compounds having &pgr; electrons that can be delocalized, e.g., an &agr;,&bgr; unsaturated system or other conjugated system that contains a proximate electron-withdrawing group. Compositions of the invention provide enhanced grain refinement and increased stability in metal plating solutions, particularly in tin and tin alloy plating formulations.
Type:
Grant
Filed:
July 16, 2003
Date of Patent:
August 10, 2004
Assignee:
Shipley Company, L.L.C.
Inventors:
Andre Egli, Anja Vinckier, Jochen Heber, Wan Zhang
Abstract: The present invention pertains to methods and apparatus for electroplating a substantially uniform layer of a metal onto a work piece having a seed layer thereon. The total current of a plating cell is distributed among a plurality of anodes in the plating cell in order to tailor the current distribution in the plating electrolyte to compensate for resistance and voltage variation across a work piece due to the seed layer. Focusing elements are used to create “virtual anodes” in proximity to the plating surface of the work piece to further control the current distribution in the electrolyte during plating.
Type:
Grant
Filed:
May 22, 2002
Date of Patent:
August 10, 2004
Assignee:
Novellus Systems, Inc.
Inventors:
Steven T. Mayer, Evan E. Patton, Brian Paul Blackman, Jonathan D. Reid, Thomas Anand Ponnuswamy, Harold D. Perry
Abstract: The invention relates to a novel apatite-coated metallic material having improved surface quality and biocompatibility, a process for its preparation, and the use of the material for bone implants, in particular dental implants, artificial joints and fixative material for accident surgery (osteosynthesis material). The coating in this case consists of a thick covering of hydroxyapatite crystals and/or amorphous calcium phosphate spheres having a specific surface area of less than 15 m2/g.
Type:
Grant
Filed:
June 6, 2002
Date of Patent:
July 20, 2004
Assignee:
Biomet Merck GmbH
Inventors:
Bernd Kotte, Jürgen Hofinger, Tanja Hebold
Abstract: The present invention relates to PCGA analytical procedure, in which each PCGA plating/measuring cycle is performed with the stripping and cleaning of test electrode immediately conducted before the equilibrium step, so as to use the metal plate layer formed during a previous plating/measuring cycle as a protective layer for the test electrode. The present invention also relates to PCGA calibration measurement protocol, in which both the calibration measurements and the sample measurement are conducted after a background measurement step.
Abstract: The present invention provides an aluminum alloy brazing sheet material, particularly suitable for charge air cooler applications, comprising a core alloy and a clad brazing alloy, as well as to methods for their manufacture and use. The present invention also provides a method for increasing the yield strength of brazing sheet materials.
Type:
Grant
Filed:
March 1, 2002
Date of Patent:
June 29, 2004
Assignee:
Pechiney Rolled Products LLC
Inventors:
Scott L. Palmer, Zayna M. Connor, H. Scott Goodrich
Abstract: The aim of the present invention is to provide a phosphate treated zinc coated steel sheet with excellent workability. A steel sheet coated with a zinc based alloy has a phosphate treated coating on the surface thereof. The phosphate treated coating comprises mainly granulated crystals, specifically, crystals in which the average ratio of the major axis to the minor axis is not less than 1.00 and not more than 2.90. Moreover, the method for producing the phosphate treated coating uses a phosphate treatment solution in which the amount of Mg ions is ≧6 g/l and the amount of Zn ions is ≧0.5 g/l, or a phosphate treatment solution in which the amount of Mg ions is ≧10 g/l, the amount of Zn ions is 0≦ and <0.5 g/l, and the amount of nitric acid ions is ≧40 g/l.
Abstract: A coated article having a high resistance to wear damage has a substrate, and a layered coating overlying the substrate. The layered coating includes a ductile metallic layer overlying and in facing contact with the substrate, and a protective layer overlying and in facing contact with the ductile metallic layer and including a mixture of a quasicrystalline metallic phase and a non-quasicrystalline ductile phase. The coated article is preferably used in applications where it is subjected to wear conditions.
Type:
Grant
Filed:
March 14, 2003
Date of Patent:
June 15, 2004
Assignee:
General Electric Company
Inventors:
Ramgopal Darolia, Robert Edward Schafrik