Abstract: Disclosed is a reaction vessel used for oxidizing and decomposing equipment suitable for processing with supercritical water, and methods of manufacturing the reaction vessel. The reaction vessel comprises an oxide film containing a platinum group metal oxide for example having a fine crystalline structure, and a high corrosion resistance in both oxidizing and reducing atmosphere. The film is formed on a surface of the vessel by performing a pyrolysis reaction in an atmosphere containing water vapor. The oxide film is comprised of at least one platinum group metal oxide selected from Ir, Ru or Rh oxide, and at least one oxide of a metal selected from Ti and Ta.

Abstract: Aqueous electroplating solutions and methods are provided for the codeposition of zinc and chromium. The solutions include effective amounts of zinc, chromium, and hydroxyl ions. The solutions further include an effective amount of one or more ions of alkali metals, alkaline earth metals, or a combination thereof other than sodium and potassium, to in major part balance the hydroxyl ions. A preferred alkali metal is rubidium.

Abstract: An alloyed hot-dip galvanized steel sheet is obtained by forming a hot-dip galvanized layer on the surface of the steel sheet and then alloying the steel sheet. The steel sheet exhibits a potential of −850 mV or less when it is immersed in a zinc sulfate-sodium chloride electrolyte. Alternatively, when it is electrolyzed according to constant potential electrolysis process in a zinc sulfate-sodium chloride electrolyte at a potential in a range from −940 mV to −920 mV, the quantity of electricity consumed is less than or equal to 0.5 C/cm2. The steel sheet exhibits excellent processability and particularly excellent sliding property.

Abstract: Excellent adhesion to subsequently applied paint or elastomer is obtained by coating a metal substrate with a phosphate conversion coating by contact with a liquid phosphating solution that contains zinc cations, phosphate anions, and at least one adhesion promoter selected from (i) film-forming organic substances, (ii) polymers of vinyl phenols modified by substitution of substituted aminomethyl moieties on their aromatic rings, (iii) inorganic oxides of one of the elements silicon, aluminum, titanium, and zirconium. Preferably, the phosphating solution also contains manganese and nickel cations and either iron cations or hydroxylamine. If adhesion to paint is desired, the adhesion promoter preferably is an acrylic film-forming substance, while if adhesion to elastomers is desired, the adhesion promoter preferably is a polymer of vinyl phenol and the phosphating solution preferably also contains calcium cations.

Abstract: A conductive and weldable anti-corrosion composition for coating metal surfaces which contains: (a) 5 to 40 wt. % of an organic binder containing: (aa) at least one epoxide resin (ab) at least one hardener selected from cyanoguanidine, benzoguanamine and plasticised urea resin (ac) at least one amine adduct selected from polyoxyalkylenetriamine and epoxide resin/amine adducts (b) 0 to 15 wt. % of an anti-corrosion pigment (c) 40 to 70 wt. % of a conductive pigment selected from powdered zinc, aluminum, graphite, molybdenum sulfide, carbon black and iron phosphide (d) 0 to 45 wt. % of a solvent; and a lacquered metal structural part which has a conductive organic layer.

Abstract: A higher applied potential may be provided to a consumable anode to reduce sludge formation during electroplating. For example, a higher applied potential may be provided to a consumable anode by decreasing the exposed surface area of the anode to the electrolyte solution in the electroplating cell. The consumable anode may comprise a single anode or an array of anodes coupled to the positive pole of the power source in which the exposed surface area of the anode is less than an exposed surface area of the cathode to the electrolyte solution. In another example, a higher applied potential may be provided to a consumable anode by increasing the potential of the electroplating cell.

Abstract: A method for electroplated metal annealing process. First, a semiconductor structure is provided, wherein the semiconductor structure has a plurality of semiconductor components, such as a gate electrode, a source region and a drain region, and a field oxide region. Second, a dielectric layer is formed over the semiconductor structure, and a via which exposes a part of the semiconductor structure is formed in the dielectric layer by the use of conventional lithographic and etching processes and an electroplated metal layer is formed over the dielectric layer; meanwhile, the via is filled with the electroplated metal layer. The electroplated metal layer is then annealed by a NH3 plasma process performed by plasma enhanced chemical vapor deposition (PECVD).

Abstract: The invention provides a hydrogen permeable structure, which can effectively prevent peeling-off of a hydrogen permeable film and hence has higher durability, and a method of manufacturing the structure. The hydrogen permeable structure has a hydrogen permeable film formed on the surface of or inside a porous support, having a thickness of not more than 2 &mgr;m, and containing palladium (Pd). The hydrogen permeable film is formed on the surface of or inside the porous support by supplying a Pd-containing solution and a reducing feed material from opposite sides of the porous support.

Abstract: Disclosed is a method of electroplating a Ni—Fe—P alloy using a sulfamate solution and, in particular, a method of electroplating a Ni—Fe—P alloy using a plating solution containing nickel sulfamate, iron sulfamate, phosphorous acid, and a buffer agent. The method is advantageous in that a residual stress of a deposited layer is very low and has stable mechanical properties, and excellent thermal and corrosion resistance because the deposited layer is obtained by electroplating the Ni—Fe—P alloy using the sulfamate solution useful in a high rate plating process. Furthermore, the method can be applied to various parent metals such as stainless steel, Inconel and iron alloys, and to various fields because the chemical compositions of the deposited layer are readily controlled by varying the concentration of the plating solution.

Abstract: An apparatus and a method of depositing a catalytic layer comprising at least one metal selected from the group consisting of noble metals, semi-noble metals, alloys thereof, and combinations thereof in sub-micron features formed on a substrate. Examples of noble metals include palladium and platinum. Examples of semi-noble metals include cobalt, nickel, and tungsten. The catalytic layer may be deposited by electroless deposition, electroplating, or chemical vapor deposition. In one embodiment, the catalytic layer may be deposited in the feature to act as a barrier layer to a subsequently deposited conductive material. In another embodiment, the catalytic layer may be deposited over a barrier layer. In yet another embodiment, the catalytic layer may be deposited over a seed layer deposited over the barrier layer to act as a “patch” of any discontinuities in the seed layer. Once the catalytic layer has been deposited, a conductive material, such as copper, may be deposited over the catalytic layer.

Abstract: Method for cleaning and disinfecting treatment of water, during which the water is exposed to at least one electric field, whereby the electric field is a low-current field with pulsating direct voltage. Device for realization of the method which includes a source of pulsating direct voltage; two conducting elements, which are connected in a conducting manner to the source of pulsating direct voltage and which are arranged to achieve a low-current field with pulsating direct voltage between them; together with a device for changing in a time-dependent manner the direction of direct voltage. Device for realization of the method which includes a source of a rectified pulsating magnetic field and a conducting element, which is arranged in the pulsating magnetic field such that, during operation of the device, an electric field is produced around the conducting element by electromagnetic induction.

Abstract: A method and apparatus for anodizing a component. The component is placed in a container having first and second seal members that seal an annular surface of the component to be anodized. The first and second seal members, the annular surface of the component, and an inner surface of the container form a reaction chamber that holds a reaction medium therein. The reaction medium is supplied to the reaction chamber through a supply passage formed in the container. The reaction medium is drained from the reaction chamber through a drain passage formed in the container.

Abstract: In at least one aspect, the invention relates to an entirely or substantially chromium-free conversion coating composition and process for conversion coating metal surfaces that provides corrosion resistance. In at least another aspect, the present invention relates to an article having a metal surface that is at least partially coated with an entirely or substantially chromium-free conversion coating that provides corrosion resistance. In certain embodiments, the conversion coating composition comprises water and (A) dissolved fluorometallate anions selected from the group consisting of TiF6−2, ZrF6−2, HfF6−2, SiF6−2, AlF6−3, GeF6−2, SnF6−2, BF4−, and mixtures thereof and (B) a water-soluble polymer which is a Mannich adduct of poly(4-vinyl phenol) and N-methyl ethanolamine. In other embodiments, the composition also comprises (C) a water-soluble polymer which is a Mannich adduct of poly(4-vinyl phenol) and N-methyl glucamine.

Abstract: The present invention applies an electrochemical etching solution to a material layer, preferably a metal layer, disposed on a workpiece, in the presence of a current. This electrochemical etching solution supplies to the material on the substrate surface the species to form an intermediate compound on the surface that can be more easily mechanically removed as intermediate compound fragments than the material. By removing the intermediate compound fragments, the process allows more efficient use of the supplied current to form another layer of intermediate compound that can also be mechanically removed, rather than using the current to result in another compound on the surface of the material that eventually dissolves into the solution. In another aspect of the invention, such intermediate compound particulates are externally generated and used to mechanically remove the surface layer of the material.

Abstract: An aluminum-coated structural member includes an Al—Si—Fe alloy layer formed on a steel substrate layer. The alloy layer includes a softer region having a hardness smaller than or equal to a hardness of the steel substrate layer, extends from the surface of the steel substrate layer toward a surface of the alloy layer, over a depth range greater than or equal to 50% of a thickness of the alloy layer. The Al—Si—Fe alloy layer has an oxide weight smaller than or equal to 500 mg/dm2.

Abstract: A method of pretreating a copper surface for protecting the surface from oxidation, by immersing the surface in a solution containing organic solderabilty preservatives, such as BenzoTriAzole, with the addition of a zinc salt. The method is particularly useful in the manufacturing of electronic Printed Circuit Boards for protecting the copper surfaces during the solder processes when the PCB undergoes high temperature. The addition of the zinc salts also gives the additional advantage of increasing the solderabilty properties of the copper surface (i.e. wettability and adhesion).

Abstract: A method of fabricating a semiconductor device, having a reduced-oxygen Cu—Zn alloy thin film (30) electroplated on a Cu surface (20) by electroplating, using an electroplating apparatus, the Cu surface (20) in a unique chemical solution containing salts of zinc (Zn) and copper (Cu), their complexing agents, a pH adjuster, and surfactants; and annealing the electroplated Cu—Zn alloy thin film (30); and a semiconductor device thereby formed. The method controls the parameters of pH, temperature, and time in order to form a uniform reduced-oxygen Cu—Zn alloy thin film (30), having a controlled Zn content, for reducing electromigration on the Cu—Zn/Cu structure by decreasing the drift velocity therein which decreases the Cu migration rate in addition to decreasing the void formation rate, for improving device reliability, and for increasing corrosion resistance.

Abstract: A method for forming a plating film, comprising the steps of: applying a plating film onto an object to be plated at a first current density for a predetermined period in a plating bath having a cathode capable of varying current and an anode and; and maintaining the object to be plated at a second current density lower than the first current density. According to the present invention, it is possible to improve solderability of a plating film for conventional lead-free solder by a simple method, which allows the productivity to further enhanced, resulting in a plating film with reduced production costs.

Abstract: A method and apparatus for electrochemically depositing a metal into a high aspect ratio structure on a substrate are provided. In one aspect, a method is provided for processing a substrate including positioning a substrate having a first conductive material disposed thereon in a processing chamber containing an electrochemical bath, depositing a second conductive material on the first conductive material as the conductive material is contacted with the electrochemical bath by applying a plating bias to the substrate while immersing the substrate into the electrochemical bath, and depositing a third conductive material in situ on the second conductive material by an electrochemical deposition technique to fill the feature. The bias may include a charge density between about 20 mA*sec/cm2 and about 160 mA*sec/cm2. The electrochemical deposition technique may include a pulse modulation technique.

Abstract: Embodiments of the invention provide an electro-analytical method for determining the concentration of an organic additive in an acidic or basic metal plating bath using an organic chemical analyzer. The method includes preparing a supporting-electrolyte solution, preparing a testing solution including the supporting-electrolyte solution and a standard solution, measuring an electrochemical response of the supporting-electrolyte solution using the organic chemical analyzer, and implementing an electro-analytical technique to determine the concentration of the organic additive in the plating bath from the electrochemical response measurements. The method is performed for independently analyzing one organic additive component in a plating bath containing multi-component organic additives, regardless of knowledge of the concentration of other organic additives and with minimal interference among organic additives.