Patents Examined by Robert Rose
  • Patent number: 10661407
    Abstract: A hand-held machine tool (1) for sanding or polishing a workpiece features a housing (2); a motor (4) for rotating a tool shaft (5) of the machine tool about its axis of rotation (6); and a backing pad (3) for releasable attachment of a sanding or polishing element thereto and eccentrically attachable to the tool shaft by an eccentric element (11) to allow the backing pad to perform a working movement. The machine tool implements different working movements of the backing pad attached thereto. The housing includes first magnetic elements (16) facing the backing pad. The backing pad attached to the eccentric element includes second magnetic elements (17) facing the housing. The machine tool implements a first working movement if a magnetic force is active between some first and second magnetic elements and a second working movement if no magnetic force is active between the first and second magnetic elements.
    Type: Grant
    Filed: March 21, 2019
    Date of Patent: May 26, 2020
    Inventor: Guido Valentini
  • Patent number: 10654143
    Abstract: The machine for grinding sheet-like elements, particularly tiles and slabs made of ceramic material, natural stone, glass or the like, includes a base framework, means for advancing at least one sheet-like element on a movement plane (A) along an advancement direction (B), the sheet-like element being provided with a pair of opposite first sides to be ground and a front side transversal to the first sides and defining the advancement front of the sheet-like element, means for machining the first sides adapted to intercept the sheet-like element in the motion thereof along the advancement direction (B), means for square-positioning the sheet-like element on the movement plane (A) comprising at least one abutment element which defines at least two support points adapted to contact the front side for arranging it in a position orthogonal to the advancement direction (B).
    Type: Grant
    Filed: June 22, 2016
    Date of Patent: May 19, 2020
    Assignee: ANCORA S.P.A.
    Inventors: Mario Corradini, Antonio Stefani
  • Patent number: 10646976
    Abstract: There is furnished a working tool comprising a rotating shaft (6), a polishing plate (3) mounted on the shaft, an expandable elastomer sheet (4) attached to the polishing plate (3), an abrasive cloth (5) attached to the elastomer sheet (4), and means for pressing the elastomer sheet (4) at a plurality of positions under respective predetermined different pressures such that a lower surface of the abrasive cloth (5) is deformed to the desired inverted convex shape in accordance with differences of pressing force applied to the elastomer sheet (4) at the plurality of positions. A substrate is produced by bringing the inverted convexly deformed surface of the abrasive cloth (5) in contact with a substrate stock, and rotating and moving the working tool for polishing the substrate over a selected area.
    Type: Grant
    Filed: August 22, 2017
    Date of Patent: May 12, 2020
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yoko Ishitsuka, Atsushi Watabe, Masaki Takeuchi
  • Patent number: 10639763
    Abstract: A method of grinding a surface of a crankshaft is provided. The method includes grinding the surface of the crankshaft by a grinding wheel, and polishing the surface of the crankshaft ground by the grinding wheel by oscillating a polishing wheel in a transverse direction perpendicular to a longitudinal direction of the crankshaft.
    Type: Grant
    Filed: November 14, 2017
    Date of Patent: May 5, 2020
    Assignee: Ford Motor Company
    Inventor: Michael A. Kopmanis
  • Patent number: 10632552
    Abstract: A saw blade is provided having a noise and stress-reduction structure, the saw blade having a structure in which a plurality of diamond segments are mounted at a first unit and the first unit has a second unit, thereby reducing the noise generated during a cutting operation, while increasing heating performance with a relatively simple configuration, and simultaneously dispersing impact stress so as to prevent the occurrence of cracks.
    Type: Grant
    Filed: June 15, 2016
    Date of Patent: April 28, 2020
    Assignee: SHINHAN DIAMOND IND. CO., LTD.
    Inventor: Shin kyung Kim
  • Patent number: 10632590
    Abstract: The work processing apparatus of the present invention comprises: a processing section for processing or treating a work; and a liquid chemical supplying section for supplying a liquid chemical to the processing section. The liquid chemical supplying section includes: a plurality of liquid chemical bags for storing the liquid chemical; a bag holding part in which the liquid chemical bags are attached and held; and a liquid feeding part, to which the liquid chemical bags are detachably connected, for feeding the liquid chemical from the liquid chemical bags to the processing section. Each of the liquid chemical bags is produced by overlapping flexible resin sheets with each other and welding their edge parts to form into a bag. Each of the liquid chemical bags has a port part communicating with an outside. A joint with a valve is attached to each of the port parts.
    Type: Grant
    Filed: December 6, 2016
    Date of Patent: April 28, 2020
    Assignees: FUJIKOSHI MACHINERY CORP., NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Masayuki Tsukada, Kazutaka Shibuya, Takayuki Fuse, Yoshio Nakamura, Shiro Hara
  • Patent number: 10632587
    Abstract: To provide a polishing apparatus capable of polishing bevel portions of varying shape by selecting a suitable polishing recipe, based on a state before polishing. The polishing apparatus 100 comprises: a holding/polishing unit 102 for holding and polishing a workpiece W1; and an identifying unit 104 for identifying data 104a associated with a state of the peripheral portion of the substrate W1 before polishing. The holding/polishing unit 102 comprises: a holder 106 for holding and rotating the substrate W1; and a polisher 108 for polishing the peripheral portion of the substrate W1 by pressing a polishing member against the peripheral portion. A polishing-condition determiner 110 determines a polishing condition, based on data 104a indicating to which type, of a plurality of shape-related types, the shape of a given peripheral portion belongs.
    Type: Grant
    Filed: January 6, 2017
    Date of Patent: April 28, 2020
    Assignee: EBARA CORPORATION
    Inventors: Masayuki Nakanishi, Toshifumi Watanabe, Kenji Kodera
  • Patent number: 10625397
    Abstract: The present invention relates to a grind machining apparatus, which comprises a grinding wheel and an electrochemical processing module. The grinding wheel has a grinding surface on the surface. The electrochemical processing modules is disposed at the grinding wheel. The processing surface of the electrochemical processing module faces the direction away from an axle of the grinding wheel and is located lower than the grinding surface. By using the above grind machining apparatus, alternate compound machining including electrochemical oxidation processing and mechanical grind machining can be performed.
    Type: Grant
    Filed: December 13, 2017
    Date of Patent: April 21, 2020
    Assignee: Metal Industries Research & Development Centre
    Inventors: Zhi-Wen Fan, Jia-Jin Li, Da-Yu Lin
  • Patent number: 10625390
    Abstract: A polishing apparatus of the present disclosure polishes a polishing target by pressing the polishing target against a polishing pad. An eddy current sensor measures an impedance that is changeable according to a change of a film thickness of the polishing target, at a plurality of positions of the polishing target, and outputs measurement signals. A difference calculator generates data corresponding to a film thickness based on a measurement signal. The difference calculator calculates a difference between data at different times based on measurement signals output by the eddy current sensor at different times at a center of the polishing target. An end point detector detects a polishing end point indicating the end of polishing based on the difference calculated by the difference calculator.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: April 21, 2020
    Assignee: EBARA CORPORATION
    Inventors: Taro Takahashi, Akihiko Ogawa
  • Patent number: 10625392
    Abstract: The present invention is a polishing pad formed by foamed polyurethane, with a content of S phase in the foamed polyurethane, as determined by pulsed NMR measurement at 25° C., exceeding 70%.
    Type: Grant
    Filed: March 14, 2016
    Date of Patent: April 21, 2020
    Assignee: NITTA HAAS INCORPORATED
    Inventors: Yohei Murakami, Nobuyuki Oshima, Hiroyuki Nakano
  • Patent number: 10625393
    Abstract: The present invention provides a chemical mechanical (CMP) polishing pad for planarizing at least one of semiconductor, optical and magnetic substrates comprising a polishing layer that has a geometric center, and in the polishing layer a plurality of offset circumferential grooves, such as circular or polygonal grooves, which have a plurality of geometric centers and not a common geometric center. In the polishing layer of the present invention, each circumferential groove is set apart a pitch distance from its nearest or adjacent circumferential groove or grooves; for example, the pitch increases on the half or hemisphere of the polishing layer that is farthest from the geometric center of its innermost circumferential groove and decreases on the half of the polishing layer nearest that geometric center. Preferably, the polishing layer contains an outermost circumferential groove that is complete and continuous.
    Type: Grant
    Filed: June 8, 2017
    Date of Patent: April 21, 2020
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Bainian Qian, Teresa Brugarolas Brufau, Julia Kozhukh
  • Patent number: 10618124
    Abstract: A reciprocating saw blade includes an axially elongated blade body having a first end portion, a second end portion, a cutting edge extending from the first end portion to the second end portion, and an opposite back edge extending from the first end portion to the second end portion. An exposed first tang is coupled to the first end portion and is configured to removably mount the blade body in a blade holder of a powered reciprocating saw. An unexposed second tang is defined by a first score in the blade body between the first end portion and the second end portion. The first score is configured so that the second tang can be exposed by breaking off a first removable portion of the blade body at the first score. The second tang is configured to removably mount the blade body in a blade holder of a powered reciprocating saw when the second tang is exposed.
    Type: Grant
    Filed: July 13, 2017
    Date of Patent: April 14, 2020
    Assignee: BLACK & DECKER INC.
    Inventors: Charles Kalomeris, Matthew Savarino
  • Patent number: 10603729
    Abstract: A staggered-teeth diamond saw blade includes a circular steel base and a side wall provided at an outer edge of the steel base. Multiple first diamond cutter heads and multiple second diamond cutter heads are alternately arranged at the side wall through laser brazing; multiple diamond teeth protection cutter heads are uniformly distributed on an external surface of the steel base through high frequency induction brazing; a pre-plating layer is preformed at a welding surface where the side wall is welded with the first diamond cutter heads and the second diamond cutter heads; a pre-plating layer is preformed at a welding surface where the external surface of the steel base is welded with the diamond teeth protection cutter heads. The diamond cutter heads of the present invention are staggered to thicken the thickness thereof while cutting concrete pavement and other materials at high speed.
    Type: Grant
    Filed: December 13, 2017
    Date of Patent: March 31, 2020
    Assignee: Jiangsu Fengtai Tools Co. Ltd.
    Inventor: Yuming Qiu
  • Patent number: 10603759
    Abstract: A rotary bit for use with a rotary tool to improve grinding, sanding, buffing, polishing and like operations on a work object. The rotary bit is structured and arranged to flex when it comes into contact with round, curved and other shaped surfaces of the work object to prevent damage to those surfaces and the areas adjacent thereto. The rotary bit comprises a flexible member that fixedly or detachably mounts to one end of an elongated shaft of a mandrel that fits into and is rotated by the rotary tool. The flexible member has a compressible body with a cap member at the proximal end to provide stiffness and grit paper attached, either fixedly or removably, at the distal end to accomplish the desired work operations. The rotary bit can use different materials for the compressible body and different abrasive materials to accomplish the work operations.
    Type: Grant
    Filed: January 30, 2014
    Date of Patent: March 31, 2020
    Inventor: Csaba Imre
  • Patent number: 10596725
    Abstract: An apparatus for containing and collecting debris, dust, and/or fluid generated by a table saw is disclosed. The apparatus may include a pan and a frame for supporting the table saw during use. A plurality of trays may be attached to the pan. The trays may be extended from the pan to provide additional surface area for collecting debris, dust, and/or fluid generated by the saw. A hood apparatus may be coupled to the frame. The hood apparatus may include a fixed shield and an extendable shield for covering above the saw and containing debris, dust, and/or fluid from escaping the apparatus above the saw. A plurality of hanging curtains may be coupled to the fixed and extendable shields to prevent debris, dust, and/or fluid from escaping behind or to the side of the saw. Gravity drainage in the trays and pan may remove debris and dust from the fluid.
    Type: Grant
    Filed: April 2, 2019
    Date of Patent: March 24, 2020
    Inventor: Tommy Jay Kasper
  • Patent number: 10593574
    Abstract: Chemical mechanical polishing (CMP) apparatus and methods for manufacturing CMP apparatus are provided herein. CMP apparatus may include polishing pads, polishing head retaining rings, and polishing head membranes, among others, and the CMP apparatus may be manufactured via additive manufacturing processes, such as three dimensional (3D) printing processes. The CMP apparatus may include wireless communication apparatus components integrated therein. Methods of manufacturing CMP apparatus include 3D printing wireless communication apparatus into a polishing pad and printing a polishing pad with a recess configured to receive a preformed wireless communication apparatus.
    Type: Grant
    Filed: November 6, 2015
    Date of Patent: March 17, 2020
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Jason G. Fung, Rajeev Bajaj, Daniel Redfield, Aniruddh Khanna, Mario Cornejo, Gregory E. Menk, John Watkins
  • Patent number: 10593537
    Abstract: The present subject matter discloses a method of lateral slicing of cylindrical silicon ingot to maximize resulting chips yield as compared to the conventional transverse slicing of ingot. The resulting rectangular wafers made from lateral slicing of ingot maximizes yield as by the lateral slicing of ingot, overall chips per wafer ratio gets increased as compared to transversal cutting while the said method decreases waste due to conflict between chip and wafer geometry. The novel apparatus or system of present method includes JIG having plurality of parallel bars. The JIG is provided to covers and holds the ingot during slicing while the parallel bars of JIG between which diamond dust embedded wires gets located and which behaves as a guide for diamond embedded wires during the slicing of ingot. Also, this JIG mechanism protects and holds the wires from sliding down and miss the designated location of slicing during the process as the slicing of cylindrical ingot is being done longitudinally.
    Type: Grant
    Filed: March 21, 2019
    Date of Patent: March 17, 2020
    Inventor: Samuel Messinger
  • Patent number: 10589329
    Abstract: Provided are a method and a device for descaling that make it possible to effectively remove oxide scale from the surface of a metal wire. The descaling includes spraying the surface of a metal wire (W) with a mixture (9) of water and hard particles from a plurality of nozzles (8). The plurality of nozzles (8) include a plurality of self-cleaning nozzles that spray at a spray angle (?) of 90° or smaller with respect to the metal wire (W). The spray angle (?) is the angle formed by the central axis (X) of the spraying and a vector (Vt) indicating a conveyance direction that originates at the intersection (P) of the central axis (X) and the metal wire surface.
    Type: Grant
    Filed: March 25, 2015
    Date of Patent: March 17, 2020
    Assignee: Kobe Steel, Ltd.
    Inventors: Satoshi Nakano, Shigehiro Yamane
  • Patent number: 10586708
    Abstract: The invention provides a method for polishing or planarizing a wafer of at least one of semiconductor, optical and magnetic substrates. The method includes rotating a polishing pad having radial feeder grooves in a polishing layer separating the polishing layer into polishing regions. The radial feeder grooves extend at least from a location adjacent the center to a location adjacent the outer edge. Each polishing region includes a series of biased grooves connecting a pair of adjacent radial feeder grooves. The series of biased grooves separate a land area and have inner walls closer to the center and outer walls closer to the outer edge. Pressing and rotating the wafer against the rotating polishing pad for multiple rotations polishes or planarizes the wafer with land areas wet by the overflowing polishing fluid.
    Type: Grant
    Filed: October 5, 2017
    Date of Patent: March 10, 2020
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: John Vu Nguyen, Tony Quan Tran, Jeffrey James Hendron, Jeffrey Robert Stack
  • Patent number: 10576609
    Abstract: A manufacturing method of the honeycomb structure uses a grinding wheel having a coarse abrasive grain layer and a pair of fine abrasive grain layers sintered and secured to be formed on both sides of the coarse abrasive grain layer, and has a grinding wheel rotating step of rotating the pair of grinding wheels disposed via a predetermined space in a state where fine abrasive grain layers of the grinding wheels face each other; a conveying step of conveying a honeycomb formed body formed by extrusion and the like; an end face grinding step of grinding end faces of the conveyed honeycomb formed body with the rotating grinding wheels; and a firing step of firing the honeycomb formed body.
    Type: Grant
    Filed: February 19, 2016
    Date of Patent: March 3, 2020
    Assignee: NGK Insulators, Ltd.
    Inventors: Nobuyuki Umetsu, Toshihiro Fukui, Nobuchika Noguchi