Abstract: The invention concerns a tool for machining of materials, specifically a grinding tool, which has a substantially rotationally symmetrical shape with respect to a rotation axis (R), the tool comprising an outer shell centered about the rotation axis and defining an internal space therein, wherein at least a part of a surface of the outer shell is provided with an abrasive coating or component, wherein the outer shell encases an internal skeleton structure in the internal space, the internal skeleton being integral with the outer shell and defining void volumes in the internal space thereby establishing material and void volumes of the internal space, and wherein the material to void ratio M/V is distributed substantially identically along each radius (r) centered around the rotation axis (R) and its corresponding symmetrical radius (r?). The invention also concerns a method for producing such tool.

Abstract: Disclosed herein are embodiments of a method of making a lubricant composition for lapping a ceramic material. The method includes mixing a base lubricant component and a powdered wax composition component to form the lubricant composition. The powdered wax composition component includes a powdered wax dispersion or a powdered wax emulsion. The amount of powdered wax composition component mixed with the base lubricant component is from 0.01 to 10 percent by weight of the lubricant composition. Also disclosed herein are embodiments of related lubricant compositions and/or methods of using the lubricant to lap a ceramic substrate (e.g., one or more bars of sliders).

Abstract: A polisher includes a wafer carrier, a polishing head, a movement mechanism, and a rotation mechanism. The wafer carrier has a supporting surface. The supporting surface is configured to carry a wafer thereon. The polishing head is present above the wafer carrier. The polishing head has a polishing surface. The polishing surface of the polishing head is smaller than the supporting surface of the wafer carrier. The movement mechanism is configured to move the polishing head relative to the wafer carrier. The rotation mechanism is configured to rotate the polishing head relative to the wafer carrier.

Abstract: Edge trim processes in 3D integrated circuits and resultant structures are provided. The method includes trimming an edge of a wafer at an angle to form a sloped sidewall. The method further includes attaching the wafer to a carrier wafer with a smaller diameter lower portion of the wafer bonded to the carrier wafer. The method further includes thinning the wafer while it is attached to the wafer.

Abstract: Disclosed is a chemical-mechanical wafer polishing device having an elastic membrane including a circular action plate portion, a membrane circumferential wall portion extending from a circumferential edge of the action plate portion along a direction perpendicular to a plate surface, and a chamber formed between the action plate portion and the membrane circumferential wall portion. The membrane includes a cooling channel portion having an action plate bottom surface section, and a supply penetration section penetrating the action plate portion such that one end is connected to the action plate bottom surface section and the other end is exposed to the upper side of the action plate portion. The chemical-mechanical wafer polishing device includes a cooling fluid supply portion having a cooling fluid supply tube connected to a free end of the supply penetration section, and providing a cooling fluid to the cooling channel portion.

Abstract: A buffing apparatus for buffing a substrate is provided. The apparatus includes: a buff table for holding the substrate, the buff table being rotatable; a buff head to which a buff pad for buffing the substrate is attachable, the buff head being rotatable and movable in a direction approaching the buff table and a direction away from the buff table, and an internal supply line for supplying process liquid for the buffing to the substrate being formed inside the buff head; and an external nozzle provided separately through the internal supply line in order to supply the process liquid to the substrate.

Abstract: A sanding machine for sanding panels, including a supporting structure, a sanding unit supported by the supporting structure, a surface for supporting and sliding of the panels located beneath the sanding unit and along which the panels are fed in a predetermined feed direction; the sanding unit including a trestle supporting a sanding belt, the trestle including a plurality of rollers having respective axes parallel to the supporting surface, the sanding belt being endless and looped around the rollers, one of the rollers being motorized to move the sanding belt during the sanding of the panels, the sanding unit further including at least one opposing member to force the belt against the panel to be sanded.

Abstract: A diamond cutting tool (200; 200?) for enabling a fast cutting start may include a rotatable main body (210) and a cutting portion (220). The rotatable main body may include a substantially circular periphery. The cutting portion may include an interlocking support assembly (280) and a plurality of notched cutters (270). The notched cutters may be disposed around the circular periphery extending outwardly from the main body. The notched cutters (270) may be formed of a first diamond-metal matrix. The interlocking support assembly (280) may be provided radially outwardly of the notched cutters and may include a softer diamond-metal matrix and/or a different diamond concentration therein than the first diamond-metal matrix. The interlocking support assembly may include a reinforcement portion (284) disposed between the notched cutters (270) and a top section (282) covering radially distal portions of the notched cutters.

Abstract: Apparatus for sharpening a cutting tool. In some embodiments, a powered sharpener has a main drive assembly with an electric motor, and a sharpening assembly with belt support surfaces to provide a routing path for the belt to define first and second belt segments. A first blade guide is configured to position a blade of the cutting tool at a first guide angle to sharpen a cutting edge of the blade against the first belt segment. A second blade guide is configured to position the blade at a second guide angle to sharpen the cutting edge of the blade against the second belt segment. The first and second belt segments may be parallel or non-parallel. As desired, anti-torsion members may be provided to contactingly engage a backing layer of the belt to resist torsional twisting of the belt during sharpening against the first and second belt segments.

Abstract: The invention relates to an abrasive support, to an abrasive article comprising such a support, to the method for producing the same, and to the use of the abrasive article. According to at least one embodiment, the abrasive support comprises an impregnated support material based on synthetic fibers. The impregnated support material has at least on one side having a surface roughness Rz of 100 ?m to 500 ?m, and having an Rmax of 250 ?m to 600 ?m. The support has an air permeability of at most 20 l/m2 s.

Abstract: A high-speed precision interrupted ultrasonic vibration cutting method includes steps of: (1) installing an ultrasonic vibration apparatus on a machine tool, and stimulating a cutting tool to generate a transverse vibration, so as to realize varieties of machining processes; (2) realizing an interrupted cutting process by setting cutting parameters and vibration parameters to satisfy an interrupted cutting conditions; and (3) turning on the ultrasonic vibration apparatus and the machine tool, and starting a high-speed precision interrupted ultrasonic vibration cutting process. High-speed precision interrupted ultrasonic vibration cutting is able to be realized through the above steps during machining of difficult-to-machine materials in aviation and aerospace fields.

Abstract: The present invention relates to the technical field for detecting a display substrate, and discloses a substrate detection apparatus and a protrusion height detection method. The substrate detection apparatus comprises a carrier configured to carry a substrate to be detected as well as a sensor bracket, a height measuring sensor is disposed at one end of the sensor bracket, the height measuring sensor is of a cone structure, and a diameter of an end face, which is configured to detect the substrate to be detected, of the height measuring sensor is smaller than that of the other end face. The substrate detection apparatus and the protrusion height detection method can solve problems such as inaccurate measurement and inaccurate calculation for a height of a protrusion defect on a color filter substrate.

Abstract: Disclosed herein is an SiC substrate separating method for separating an SiC substrate into at least two parts in a planar manner. The SiC substrate separating method includes an adhesive tape attaching step of attaching a transparent adhesive tape to a first surface of the SiC substrate, a support member attaching step of attaching a support member to a second, opposite surface of the SiC substrate, and a separation start point forming step of setting the focal point of a laser beam at a predetermined depth from the adhesive tape and next applying the laser beam to the adhesive tape while relatively moving the focal point and the SiC substrate to thereby form a modified layer parallel to the first surface of the SiC substrate and cracks propagating from the modified layer, thus forming a separation start point.

Abstract: According to an exemplary embodiment of the present invention, a trocar is provided. The trocar includes: a sharp end; at least three concave cutting edges extended from the sharp end; and at least three concave cutting surfaces forming the sharp end and the at least three cutting edges.

Abstract: A tool sharpener has a guide assembly to support a cutting tool adjacent an abrasive medium. A drive assembly advances the abrasive medium with respect to the guide assembly. A control mechanism provides a first control input value to move the medium and achieve a first material take off (MTO) rate during a coarse sharpening operation upon the tool. A second control input value from the control circuit moves the medium to achieve a lower, second MTO rate during a fine sharpening operation. The control mechanism transitions the medium from the first MTO rate to the second MTO rate responsive to a timer mechanism indicating a conclusion of a predetermined elapsed time interval.

Abstract: A floor polishing or grinding pad assembly is provided. In one aspects a polishing or grinding pad assembly employs a flexible pad, a reinforcement layer or ring, and multiple floor-contacting tools such as disks. In yet another aspect, at least one of the floor-contacting tools has a workpiece-contacting bottom plane having angle offset from that of a base surface of the tool, a flexible pad and/or a flexible reinforcement layer. A further aspect employs a smaller set of disks alternating between and/or offset from a larger set of the disks.

Abstract: A polishing apparatus which can allow easy replacement of a retainer ring and can allow the retainer ring to be secured to a drive ring without causing deformation of the retainer ring is disclosed. The polishing head includes a head body having a substrate contact surface, a drive ring coupled to the head body, and a retainer ring surrounding the substrate contact surface and coupled to the drive ring. A first screw thread is formed on the drive ring, a second screw thread, which engages with the first screw thread, is formed on the retainer ring. The second screw thread extends in a circumferential direction of the retainer ring.

Abstract: A wafer polishing system including a platen configured to rotate in a first direction, and a polishing head configured to hold a wafer, the polishing head configured to rotate in a second direction. The wafer polishing system further includes an optical sensing system configured to detect a thickness of the wafer at a first location on the platen and a second location on the platen. A first distance from a center of the platen to the first location is different than a second distance from the center of the platen to the second location.

Abstract: An abrasive article having a plurality of apertures arranged in a non-uniform distribution pattern, wherein the pattern is spiral or phyllotactic, and in particular those patterns described by the Vogel equation. Also, provided is a back-up pad having a spiral or phyllotactic patterns of air flow paths, such as in the form of open channels. The back-up pad can be specifically adapted to correspond with an abrasive article having a non-uniform distribution pattern. Alternatively, the back-up pad can be used in conjunction with conventional perforated coated abrasives. The abrasive articles having a non-uniform distribution pattern of apertures and the back-up pads can be used together as an abrasive system.

Abstract: The invention relates to obtaining an abrasive product comprising a surface with multiple abrasive zones supported by a backing layer. The abrasive zone are surrounded by interconnected channel portions comprising first channel portions with a first transverse dimension td1 and second channel portions with a second transverse dimension td2 larger than the first transverse dimension td1.