Abstract: In some embodiments, disclosed is a wordline boosting technique using a self-timed capacitive charge boosting approach.

Abstract: A semiconductor device may be provided. The semiconductor device may include an address input circuit and a target address generation circuit. The address input circuit may be configured to latch a bank address and an address to generate a bank active signal and a latch address based on the execution of an active operation. The target address generation circuit may be configured to generate the latch address as a target address.

Abstract: An output timing control circuit of a semiconductor apparatus may include a strobe signal generation path configured to control a latency and a delay time of an internal signal, and generate a strobe signal. The output timing control circuit may include a first detection block configured to detect a phase difference of the strobe signal and a clock signal, and control the delay time according to the detected phase difference. The output timing control circuit may include a second detection block configured to detect a latency difference of the strobe signal and the internal signal, and control the latency according to the detected latency difference. The internal signal may be generated according to a preset timing of a command received by the strobe signal generation path.

Abstract: Apparatuses and methods of for refresh control of a semiconductor device are described. An example apparatus includes a command control circuit that provides a plurality of pulses on a first control signal in series responsive to a plurality of refresh commands issued in series; a signal generation circuit that produces a plurality of pulses on a second control signal in sequence; and a refresh control circuit that receives two or more of the plurality of pulses on the first control signal during a period of time between one pulse and a succeeding pulse of the plurality of pulses on the second control signal, disables refresh operations responsive to at least one of the two or more of the plurality of first control signal and executes a refresh operation responsive to remaining one or more pulses of the two or more of the plurality of pulses on the first control signal.

Abstract: A semiconductor memory device includes a block of memory cells including first, second, and third memory cells, a first word line electrically connected to a gate of the first memory cell, a second word line electrically connected to a gate of the second memory cell, a third word line electrically connected to a gate of the third memory cell, and a control circuit configured to access the block in one of at least first and second modes to perform an operation thereon. When the control circuit accesses the block in the first mode, the same voltage is applied to the first and second word lines throughout the operation, and when the control circuit accesses the block in the second mode, the same voltage is applied to the second and third word lines throughout the operation.

Abstract: Systems, methods and/or devices that enhance the reliability with which data can be stored in and read from a memory utilize an error indicator, obtained from using one reading threshold voltage for decoding, to adaptively determine the reading threshold voltage(s) used for subsequent decoding attempts. For example, in some implementations, the method includes initiating performance of a first read operation, using a first reading threshold voltage, to obtain a first error indicator, and further includes initiating performance of a second set of additional read operations using two or more second reading threshold voltages, the second reading threshold voltages determined in accordance with the first error indicator, to obtain a second error indicator. In some embodiments, when the first error indicator is greater than a first threshold, a difference between two of the second reading threshold voltages is greater than when the first error indicator is less than a first threshold.

Abstract: An apparatus includes a detector circuit and a data buffer. The detector circuit may be configured to (i) identify a start of a command sequence associated with a directed access to a memory system and (ii) generate a control signal indicating a non-consecutive clock associated with the start of said command sequence. The data buffer circuit may be configured to initialize a condition of a receiver circuit in response to the control signal prior to reception of a first data bit associated with the command sequence.

Abstract: This technology provides an electronic device. An electronic device in accordance with an implementation of this document includes semiconductor memory, and the semiconductor memory includes a free layer having a variable magnetization direction; a pinned layer having a pinned magnetization direction; and a tunnel barrier layer interposed between the pinned layer and the free layer, wherein the free layer includes: a first ferromagnetic material; a second ferromagnetic material having a coercive force smaller than that of the first ferromagnetic material; and an amorphous spacer interposed between the first ferromagnetic material and the second ferromagnetic material.

Abstract: A memory device may include: at least one memory bank; and a control circuit suitable for: refreshing the at least one memory bank through a first refresh operation in response to a refresh command; and refreshing the at least one memory bank through a second refresh operation when an active operation is performed between a current refresh command and a previous refresh command.

Abstract: An integrated circuit for storing data comprises a memory cell array comprising a plurality of bit cells (BC1, . . . , BCn) comprising a first and a second one of the bit cells (BC1, BC2) having a static random access memory architecture. The first and the second bit cells (BC1, BC2) are coupled to a common wordline (WL_TOP) and are arranged in different columns (C1, C2) of the memory cell array (100). During a write access to the first bit cell (BC1), the first bit cell (BC1) undergoes a write operation, whereas the second bit cell (BC2) is a half-selected bit cell which undergoes a pseudo read operation. The integrated circuit uses a two-phase write scheme to improve the write-ability in low operating voltage environment.

Abstract: A non-volatile storage system includes a three dimensional structure comprising vertical columns of memory cells and a managing circuit in communication with the vertical columns. The managing circuit applies one or more patterns of stress voltages to the vertical columns, with different voltages applied to each vertical column of pairs of adjacent vertical columns being tested for shorts. The managing circuit tests for a short in the pairs of adjacent vertical columns after applying the one or more patterns of stress voltages. In one embodiment, the test may comprise programming a memory cell in each vertical column with data that matches the pattern of stress voltages, reading from the memory cells and determining whether data read matches data programmed. The applying of the stress voltages and the testing can be performed as part of a test during manufacturing or in the field during user operation.

Abstract: The invention relates to an integrated circuit (1), comprising: a field-effect transistor (2), comprising: first and second conduction electrodes (201, 202); a channel zone (203) arranged between the first and second conduction electrodes; a gate stack (220) arranged vertically in line with the channel zone, and comprising a gate electrode (222); an RRAM-type memory point (31) formed under the channel zone, or formed in the gate stack under the gate electrode.

Abstract: A method of operating a non-volatile memory device includes receiving program data and a program address. Memory cells that correspond to the program address are selected from among memory cells in an erased state. The selected memory cells are programmed based on the program data such that each of the selected memory cells is programmed to one of a plurality of programmed states, where threshold voltage distributions of the programmed states are different from each other and are higher than a threshold voltage distribution associated with the erased state. By programming all or a portion of the memory cells corresponding to the erased state to have positive threshold voltages, degradation of the data retention capability of the memory cells may be reduced.

Abstract: A method is provided that includes providing a memory device including a first word line, a vertical bit line, a non-volatile memory material disposed between the first word line and the vertical bit line, and a memory cell disposed between the first word line and the vertical bit line. The first word line has a first height. The method further includes forming one or more conductive filaments in the memory cell. The one or more conductive filaments are substantially confined to a filament region having a second height less than the first height and disposed substantially about a vertical center of the memory cell.

Abstract: A non-volatile semiconductor memory device includes a first memory cell above a substrate and electrically connected to a first word line, a second memory cell above the first memory cell and electrically connected to a second word line, and a controller. The controller is configured to execute a write operation that includes a first step in which a first voltage is applied to a selected word line and to a non-selected word line, a second step after the first step in which a program voltage is applied to the selected word line, and a third step after the second step in which a second voltage higher than the first voltage is applied to the non-selected word line. A time period between a start of the second step and a start of the third step is different depending on whether the first or second memory cell is being written.

Abstract: An improved method and apparatus for programming advanced nanometer flash memory cells is disclosed.

Abstract: A semiconductor memory device includes a memory circuit including a plurality of memory cells and a refresh control circuit. The refresh control circuit is configured to determine a number of times to perform a target row refresh (TRR) in response to a mode register set (MRS) code signal, wherein the MRS code signal is generated in response to a temperature change, and the refresh control circuit is configured to maintain a refresh cycle of at least two of the memory cells for a period of time when the refresh cycle is changed due to the temperature change.

Abstract: Methods of operating a memory device having embedded leak checks may mitigate data loss events due to access line defects, and may facilitate improved power consumption characteristics. Such methods might include applying a program pulse to a selected access line coupled to a memory cell selected for programming, verifying whether the selected memory cell has reached a desired data state, bringing the selected access line to a first voltage, applying a second voltage to an unselected access line, applying a reference current to the selected access line, and determining if a current flow between the selected access line and the unselected access line is greater than the reference current.

Abstract: Technology for verifying cell programming for a phase change memory array is disclosed. In an example, a method may include sending a reset pulse to a phase change memory cell. The method may further include sensing a threshold voltage of the phase change memory cell in response to applying first and second verify voltages across the phase change memory cell, where the second verify voltage is lower than the first verify voltage. The method may also include determining whether the threshold voltage of the phase change memory cell was below the first or second verify voltages.

Abstract: A memory module includes a command/address (CA) register, memory devices, and a module resistor unit mounted on a circuit board. The centrally disposed CA register drive the memory devices one or more internal CA signal(s) to arrangements of memory devices using multiple CA transmission lines, wherein the multiple internal CA transmission lines are commonly terminated in the module resistor unit.