Abstract: A process/method for cleaning wafers that eliminates and/or reduces pitting caused by standard clean 1 by performing a pre-etch and then passivating the wafer surface prior to the application of the standard clean 1. The process/method may be especially useful for advanced front end of line post-CPM cleaning. In one embodiment, the invention is a method of processing a substrate comprising: a) providing at least one substrate; b) etching a surface of the substrate by applying an etching solution; c) passivating the etched surface of the substrate by applying ozone; and d) cleaning the passivated surface of the substrate by applying an aqueous solution comprising ammonium hydroxide and hydrogen peroxide.

Abstract: A cleaning apparatus for microsurgical instruments has a flush chamber closed off at one end by a first plug adapted to liquid-tightly grip one end of the instrument, allowing a portion of the instrument to extend past the first plug and out of the flush chamber. The other end of the flush chamber is closed off by a second plug having an inlet port. Liquid injected through the inlet port on the second plug passes through an internal passageway formed in the instrument and exits the instrument through the portion that extends past the first plug. In another embodiment the instrument has an internal passageway and an end cap through which flushing ports are formed which communicate with the passageway. A first plug having an inlet port is liquid-tightly attached to the end cap and liquid injected into the first plug passes through the plug, through the flushing ports and through the passageway to clean detritus from the instrument.

Abstract: A heat exchanger may be cleaned by introducing compressed nitrogen and a flushing composition through an injection device.

Abstract: An acoustic cleaning system includes an operating device having an interior portion. An acoustic cleaning device provides for the passage of a sound wave into the interior portion of the operating device. The acoustic cleaning device includes a horn section attached to an elongated section having a linear or non-linear shape. Sound waves are configured to pass from the elongated section to the horn section and into the interior portion of the operating device. The elongated section is removable from the horn section such that the elongated section is interchangeable with an elongated section having a different length, such that the sound waves are configured to have a frequency between 55 Hz to 75 Hz depending on a temperature of the operating device.

Abstract: Described herein are systems and methods for reducing cumulative deposition and unwanted secondary thermal reactions in pyrolysis and other thermal conversion processes. In an embodiment, a system comprises a device, referred to as a reamer, for removing product deposits between thermal conversion and condensation operations of a pyrolysis process. The reamer may comprise, but is not limited to, a mechanical reciprocating rod or ram, a mechanical auger, a drill bit, a high-temperature wiper, brush, or punch to remove deposits and prevent secondary reactions. Alternatively or in addition, the reamer may use a high-velocity curtain or jet (i.e., a hydraulic or pneumatic stream) of vapor, product gas, recycle gas, other gas jet or non-condensing liquid to remove deposits. Preferably, the reamer removes deposits during the pyrolysis process allowing for continuous operation of the pyrolysis process.

Abstract: Methods for processing substrates in twin chamber processing systems having first and second process chambers and shared processing resources are provided herein. In some embodiments, a method may include providing a substrate to the first process chamber of the twin chamber processing system, wherein the first process chamber has a first processing volume that is independent from a second processing volume of the second process chamber; providing one or more processing resources from the shared processing resources to only the first processing volume of the first process chamber; and performing a process on the substrate in the first process chamber.

Abstract: An auto-emulsifying cleaning composition capable of emulsifying upon contact with water, the composition in one typical embodiment comprising, based on the total weight of the composition, (a) from about 1% to about 99% by weight a blend of dibasic esters; (b) from about 1% to about 40% by weight of a blend of surfactants consisting of an organic anion neutralized with an organic cation, where either or both of the anion and the cation have surfactant properties, and the complex of which is soluble in the dibasic ester solvent blend. The blend of surfactants is typically a cationic surfactant and an anionic surfactant, which may or may not be used in conjunction with non-ionic surfactants. The dibasic esters are be derived from a blend of adipic, glutaric, and succinic diacids, and, in one particular embodiment, the blend comprises dialkyl adipate, dialkyl methylglutarate and dialkyl ethylsuccinate, wherein the alkyl groups individually comprise a C1-C12 hydrocarbon group.

Abstract: An endoscope cleaning/disinfecting apparatus for processing an endoscope in a cleaning tank using a diluted chemical obtained by diluting a chemical with hot water in a dilution tank of the present invention introduces the hot water into the cleaning tank immediately before processing, introduces the hot water into the dilution tank after the temperature of the hot water introduced into the cleaning tank falls within a specified temperature range, generates the diluted chemical, introduces the diluted chemical into the cleaning tank and processes the endoscope.

Abstract: A wafer cleaning device comprising a wafer stage for holding a wafer having a surface to be washed, a first nozzle positioned above the wafer, a second nozzle positioned above the wafer. A first height is between the first nozzle and the surface and a second height is between the second nozzle and the surface, wherein the first height is shorter than the second height.

Abstract: Methods for removing and preventing the buildup of unwanted deposits and varnishes on combustion chamber surfaces, particularly injector-igniter components that are exposed to combustion events. A method of removing deposits from an injector-igniter comprises monitoring the current across a pair of electrodes in the injector-igniter, comparing the current with a predetermined threshold level, and performing a cleaning cycle if the current exceeds the threshold level. The cleaning cycle may comprise injecting oxidant through the injector-igniter and into the combustion chamber. The cleaning cycle may further comprise ionizing the oxidant with an electrical discharge having a first polarity and ionizing the oxidant a second time with an electrical discharge having a second polarity. In other cases the cleaning cycle comprises injecting hydrogen through the injector-igniter and into the combustion chamber. In still other cases the cleaning cycle may comprise injecting coolant onto the electrodes.

Abstract: A showerhead cleaning rack is disclosed. The showerhead cleaning rack includes a frame and a support body, wherein the support body is located and connected with the frame. The support body has a plurality of positioning parts. The positioning parts are used for holding the showerhead. The showerhead cleaning rack is used in an ultrasonic cleaning trough. By utilizing the oscillation of the ultrasonic wave generated in the ultrasonic cleaning trough, the pollutants on the showerhead is cleaned. An ultrasonic cleaning method with the showerhead cleaning rack is also provided.

Abstract: A device for combining multiple components into a foam mixture and dispensing the foam mixture into a pipe is described. The multiple components are combined immediately prior to dispensing, which maximizes activity for labile, biologically active components whose degradation accelerates upon combining components. Embodiments of the device are relatively light weight and adapted to removably couple to sewer cleaning vehicles.

Abstract: The present invention provides methods of removing liquid from a barrier structure in the context of treating microelectronic workpieces with one or more treatment materials, including liquids, gases, fluidized solids, dispersions, combinations of these, and the like.

Abstract: This invention concerns dosage elements for a ware washing machine and a method of manufacturing such dosage elements. In embodiments of the invention a dosage element comprises first (10) and second (20) joined parts, wherein the first part (10) is a part which, prior to joining with the second part (20), comprised an open receptacle and wherein the second part (20) comprises a substrate carrying a plurality of mutually separated substances A, B, C arranged in side by side relation. The second part (20) is joined to said first part (10) so as to close said receptacle and enclose said substances within it. Dosage elements produced in the inventive method are pleasant to handle, while being surprisingly resistant to damage in handling or transit.

Abstract: Mixtures containing concentrated sulfuric acid used for stripping photoresist from semiconductor wafer, such as SOM and SPM mixtures, are more quickly removed from a wafer surface using another liquid also containing high concentration of sulfuric acid, with the second liquid furthermore containing controlled small amounts of fluoride ion. The second liquid renders the wafer surface hydrophobic, which permits easy removal of the sulfuric acid therefrom by spinning and/or rinsing.

Abstract: A dishwasher, in particular a domestic dishwasher, having a dishwashing compartment and apparatuses for washing tableware using washing liquor, wherein it is possible to set the pressure in the apparatuses for washing tableware. A feed apparatus for an additive is provided, and the pressure in the apparatuses for washing tableware can be set as a function of the metering of the additive in the feed apparatus.

Abstract: A warewasher for washing wares includes a housing defining an internal space with at least one spray zone for washing wares. A liquid delivery system provides a spray of liquid within the spray zone. A tank includes an inlet that is connected to a hot water source for filling the tank with hot water. The liquid delivery system receives water from the tank. An exhaust vents heated air from the housing. A final rinse system is connected to a cold water source. A heat recovery system is located between the final rinse system and the cold water source. The heat recovery system transfers heat from the exhaust air to the cold water provided from the cold water source. A valve associated with the hot water source selectively supplements the water exiting the heat recovery system with hot water from the hot water source.

Abstract: An improved method for cleaning heat exchange tube bundles, fin-fans, and other elongated components, using a portable cleaning system comprising a cleaning unit having a cleaning enclosure that receives and cleans the component and a control unit that controls the operation of the system. The cleaning unit has a cleaning enclosure defining a chamber sized and configured to receive the component through a sealable lid. A roller assembly rotates the component while a spray assembly sprays cleaning fluid over and into the rotating component. The cleaning fluid is heated in the chamber using surface heating elements attached to heat transfer plates along sections of the chamber walls. A vapor recovery system captures and treats toxic vapors. In use, the cleaning system is transported to a facility to clean the components on-site using cleaning fluid supplied by the facility and discharging waste to the facility.

Abstract: Devices for removing thatch buildup from the underside of a mower deck, and methods therefore. The device includes a head having a straight edge and at least one curved edge, a neck, and a conical handle.

Abstract: Improved resistance to temperature-related degradation or deformation in a wafer-supporting chuck is provided by at least one shielding member that physically and/or thermally shields chuck components from effects of elevated temperature processing fluids.