Patents Examined by Sean Smith
  • Patent number: 6510606
    Abstract: Low temperature co-fired ceramic (LTCC) multichip modules are used to provide high density interconnects between electronic elements. A ceramic carrier includes a number of cavities which are sized to receive a variety of submodules. The submodules are constructed to hold a variety of circuit elements, such as circuit dice and provide the conduction paths for establishing interconnections between these chips. These circuit elements are attached on one side of the submodule and electrical contacts are provided on the opposite side. Upon installation into the cavity in the carrier module, the submodule is flipped such that the electrical connections are exposed. Once in the cavity, a layer of flex circuitry is applied over the submodule and the ceramic carrier in order to establish electrical connection between electrical elements in the submodules as well as components external to the ceramic carrier.
    Type: Grant
    Filed: June 15, 1998
    Date of Patent: January 28, 2003
    Assignee: Lockheed Martin Corporation
    Inventors: David M. Barnett, Don J. Thielman
  • Patent number: 6510605
    Abstract: A surface mount resistor is formed from an elongated resistive body having first and second terminal ends and a raised center portion formed therebetween. The raised center portion includes slots in its edges which form a serpentine current path through the raised center portion of the resistor. A dielectric surrounds and encapsulates the raised center portion and an electrically conductive material coats the first and second terminal ends. The method for manufacturing involves utilizing an elongated ribbon which is of unitary construction and which is formed to create a carrier strip and a raised center portion for the resistors ultimately to be formed.
    Type: Grant
    Filed: December 21, 1999
    Date of Patent: January 28, 2003
    Assignee: Vishay Dale Electronics, Inc.
    Inventors: Joel J. Smejkal, Steve E. Hendricks, Larry K. Sockrider
  • Patent number: 6484394
    Abstract: An encapsulation method for a ball grid array (BGA) semiconductor package, includes: adhering one sided adhesive tape to an upper portion of the semiconductor package after performing a wire bonding; carrying out a molding by using a mold having a groove of a certain size inside; and removing the one side adhesive tape after completing the molding, whereby a flash is prevented from occurring during the BGA encapsulation process.
    Type: Grant
    Filed: January 10, 2000
    Date of Patent: November 26, 2002
    Assignee: Hyundai Electronics Industries Co., Ltd.
    Inventors: Seong-Jae Heo, Chi-Jung Song
  • Patent number: 6482108
    Abstract: An ordinary golf ball is cleaned and then treated with an emulsion depositing in the dimples a hologram having the capacity to reflect a pre-selected wavelength of laser-beam. If a player temporarily looses such ball, a hand-held unit directs an infra-red laser beam of said pre-selected wavelength, desirably one not absorbed by atmospheric moisture, such as 1310 nm. Said hand-held unit contains an analyzer evaluating the light reflected back to such analyzer and attributable to such laser beam of said pre-selected wave-length. By evaluating the intensity of such reflected light, the golfer can target the location of the temporarily lost ball. Upon approaching the lost ball the angle at which the unit would be held would be modified for focusing on the lost ball. Earphones, meters, or other diagnostic equipment can monitor the intensity of the light reflected back from such laser beam.
    Type: Grant
    Filed: January 21, 1999
    Date of Patent: November 19, 2002
    Assignee: Lost Item Retrieval System Inc
    Inventor: William E. McLaughlin
  • Patent number: 6438821
    Abstract: The present invention aims to provide a PTC thermister which uses a conductive polymer having a positive temperature coefficient and has a high withstand voltage and high reliability and in which no failure in electrical connection occurs in side electrode even when a mechanical stress occurs due to the thermal shock by repeated thermal expansion of the conductive polymer sheet. It also aims to provide a method to manufacture the above PTC thermister. To achieve the above purpose, the PTC thermister of the present invention comprises (1)a laminated body made by alternately laminating conductive polymer sheets and inner electrodes, (2) outer electrodes disposed on tops and bottoms of said laminated body and (3) multi-layered side electrodes disposed at the center of both sides of said laminated body and is electrically coupled with said inner electrodes and said outer electrodes.
    Type: Grant
    Filed: January 11, 2000
    Date of Patent: August 27, 2002
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Junji Kojima, Kohichi Morimoto, Takashi Ikeda, Naohiro Mikamoto
  • Patent number: 6434816
    Abstract: A plug cap and a method for attaching the plug cap which prevents the occurrence of depressions on a spark plug screw thread and in a cylindrical section of the plug cap. The plug cap includes a spring pin having a straight section which engages a groove in the conductive cylindrical section of the plug cap. The plug cap also has an identifying part on its exterior which indicates the direction in which the straight section is oriented. The plug cap is installed on the spark plug in a way which orients the straight section of the spring pin in a direction parallel to the principle vibration axis of the engine. The base of the plug cap groove may also be cut to a width which dampens the effect of vibrations causing translation of the straight section within the groove. The groove sidewalls may be angled to aid in removal of the plug cap.
    Type: Grant
    Filed: January 31, 2000
    Date of Patent: August 20, 2002
    Assignee: Honda Giken Kogyo Kabushiki Kaisha
    Inventors: Takao Yamamoto, Masanori Shimazoe, Akihiko Kajihara
  • Patent number: 6434815
    Abstract: A first rotor and a second rotor are prepared. The first rotor has a resistor and inner-peripheral and outer-peripheral electrodes respectively connected to end portions of this resistor. The second rotor has a resistor and inner-peripheral and outer-peripheral electrodes symmetrical with those of the first rotor, provided at a position corresponding to that obtained by rotating the first rotor about the axis of the first rotor by an angle of 180° with respect to the first rotor. A variable resistor selectively uses either one of the first rotor and second rotor. This makes it possible to provide a variable resistor which requires few parts. Also, this makes it possible to reduce the kinds of bending operations that must be performed on the terminals.
    Type: Grant
    Filed: September 20, 1999
    Date of Patent: August 20, 2002
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Katsuhiro Onishi, Kiminori Yamauchi, Hideaki Tsukada, Yukinori Ueda, Fumitoshi Masuda
  • Patent number: 6427323
    Abstract: A method is provided for connecting two conductive layers in an electronic circuit package comprising the steps of forming dendrites on selected regions of a first conductive layer, forming dendrites on selected regions of a second conductive layer, applying an epoxy adhesive material over the first conductive layer, and compressively attaching the second conductive layer to the first conductive layer such that the dendrites on the first conductive layer contact the dendrites on the second conductive layer. Also claimed is an electronic circuit package incorporating the dendrites used for electrical interconnection manufactured in accordance with the present invention. An alternative embodiment of the invention utilizes an intermediate surface metal with dendrites in place of a “through via.
    Type: Grant
    Filed: May 17, 2001
    Date of Patent: August 6, 2002
    Assignee: International Business Machines Corporation
    Inventors: Bernd K. Appelt, Saswati Datta, Michael A. Gaynes, John M. Lauffer, James R. Wilcox
  • Patent number: 6427320
    Abstract: A pallet-storing block of an electronic component-mounting apparatus stores a plurality of pallets each carrying thereon a tray containing a large number of electronic components. A desired pallet selected from the pallets is moved along a transfer path, in a manner such that the desired pallet is advanced to be introduced into a pickup area which extends to cover almost all of the transfer path or withdrawn from the pickup area into the pallet-storing block. Desired electronic components are sequentially picked up from the desired pallet introduced into the pickup area and mounted on a circuit board. The desired pallet is moved to a desired position within the pickup area.
    Type: Grant
    Filed: September 29, 2000
    Date of Patent: August 6, 2002
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Katsuyuki Seto, Kazuyoshi Oyama, Yoshiharu Fukushima
  • Patent number: 6425179
    Abstract: According to the present invention, a method for creating a package for a semiconductor die, the package comprising a flexible tape, comprises the following steps. A support with an opening has a plurality of arms extending through at a portion of the opening. For example, for a square opening, there may be eight arms, two extending from each side of the opening. The arms preferably form a “z” shape or some other shape with a transverse component. The flexible tape is then attached to the ends of the arms within the opening such that the flexible tape is supported by the arms. A die is attached to the flexible tape, the die is preferably covered with a molding compound, and the die/flexible tape assembly is scribed from the support, thereby creating an individual package.
    Type: Grant
    Filed: October 12, 1999
    Date of Patent: July 30, 2002
    Assignee: LSI Logic Corporation
    Inventors: Qwai H. Low, Chok J. Chia, Ramaswamy Ranganathan
  • Patent number: 6421909
    Abstract: A surge arrester includes an electrically insulating arrester housing and a surge arresting block housed within the electrically insulating arrester housing. The surge arresting block is arranged to provide support for the surge arrester without the use of a support member. The surge arresting block may be a single surge arresting block having a voltage rating of at least 9 KV. The surge arresting block may have threads formed integrally therewith.
    Type: Grant
    Filed: May 5, 1999
    Date of Patent: July 23, 2002
    Assignee: Joslyn Manufacturing Co.
    Inventor: Larry E. Rook
  • Patent number: 6419554
    Abstract: Planarizing solutions, and their methods of use, for removing titanium nitride from the surface of a substrate using a fixed-abrasive planarizing pad. The planarizing solutions take the form of an etchant solution or an oxidizing solution. The etchant solutions are aqueous solutions containing an etchant and a buffer. The etchant contains one or more etching agents selective to titanium nitride. The oxidizing solutions are aqueous solutions containing an oxidizer and a buffer. The oxidizer contains one or more oxidizing agents selective to titanium nitride. In either solution, i.e., etchant or oxidizing solution, the buffer contains one or more buffering agents. Titanium nitride layers planarized in accordance with the invention may be utilized in the production of integrated circuits, and various apparatus utilizing such integrated circuits.
    Type: Grant
    Filed: June 24, 1999
    Date of Patent: July 16, 2002
    Assignee: Micron Technology, Inc.
    Inventors: Dinesh Chopra, Gundu Sabde
  • Patent number: 6415501
    Abstract: Heating elements, electrical devices and processes for manufacturing these components are provided. The heating elements and electrical components employ a resistance heating material, such as Ni-Cr wire, sewn with a thread to a supporting substrate, such as a non-woven glass mat. The sewn thread supports the relatively thin cross-section of the resistance material when a fusible layer is applied, such as by molding a polymer under pressure.
    Type: Grant
    Filed: October 13, 1999
    Date of Patent: July 9, 2002
    Inventors: John W. Schlesselman, Ronald E. Papenfuss, Theodore Von Arx
  • Patent number: 6412166
    Abstract: An apparatus is provided with a component feeding member for feeding electronic components having lead wires in a tape-bonded state, an insertion head for separating the electronic components fed from the feeding member from the tapes and inserting to holes of a board, and a fixing head facing the insertion head via the board for cutting and folding the lead wires of the inserted electronic component in the board thereby fixing the electronic component to the board. AC servo motors operating independently of each other are individually set in the insertion head and the fixing head, which are controlled by a device so as to be synchronous with each other.
    Type: Grant
    Filed: May 23, 2000
    Date of Patent: July 2, 2002
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yuzuru Inaba, Kiyoshi Imai, Hideaki Watanabe, Hiromi Kinoshita
  • Patent number: 6408503
    Abstract: A method of making a heater element has the steps of inserting into a smooth tubular casing a heating wire, filling a space between the wire and the casing with a compressible insulating mass, and closing ends of the space to confine the mass in the casing. Then the casing is radially inwardly compressed to form therein a successive of radially outwardly open annular grooves extending circumferentially fully around the casing and thereby radially compressing the insulating mass. The casing is formed with a succession of such grooves, which can be of V-shape and which are each endless so that the casing is corrugated. Alternately the grooves are interconnected helically. Either way in accordance with the invention the grooves form axially relatively long and radially relatively thick outer rings and axially relatively short and radially relatively thin inner rings.
    Type: Grant
    Filed: October 21, 1999
    Date of Patent: June 25, 2002
    Assignee: Hotset Heizpatronen U. Zubehor GmbH
    Inventor: Eugen Schwarzkopf
  • Patent number: 6405432
    Abstract: A mounting clip for a rotary potentiometer. In a preferred embodiment, the mounting clip comprises front and back generally vertical opposing side segments elastically deformable relative to each other between a naturally biased position and an outward flexed position. The back side segment defines a pair of legs sized to accommodate a shaft of the potentiometer. The mounting clip is useful for mounting the rotary potentiometer relative to a support wall of a joystick assembly in a position wherein a body portion of the potentiometer is adjacent to the support wall and the shaft of the potentiometer projects through an opening in the support wall. When the potentiometer is so positioned, the mounting clip may be slid downward over the potentiometer and support wall such that the front side segment overlies an outer flat surface of the potentiometer and the legs straddle the shaft of the potentiometer on the other side of the support wall.
    Type: Grant
    Filed: November 15, 1999
    Date of Patent: June 18, 2002
    Assignee: Midway Games Inc.
    Inventors: Thomas M. Sedor, Theodore Valavanis
  • Patent number: 6401329
    Abstract: A surface mount resistor includes an elongated piece of resistive material having strips of conductive material attached to its opposite ends. The strips of conductive material are separated to create an exposed central portion of the resistive material therebetween. According to the method the resistive strip is attached to a single co extensive strip of conductive material and a central portion of the conductive material is removed to create the exposed central portion of the resistive strip.
    Type: Grant
    Filed: December 21, 1999
    Date of Patent: June 11, 2002
    Assignee: Vishay Dale Electronics, Inc.
    Inventors: Joel J. Smejkal, Steve E. Hendricks
  • Patent number: 6393696
    Abstract: A method for manufacturing a printed circuit board is disclosed. When a metal is plated on an upper board to form a circuit, bonding fingers for being bonded with a semiconductor chip are prevented from being electroplated with a metal. That is, a slot with an ink layer formed therein is formed in each of a plurality of boards. Then window regions of different sizes are defined, and a working is carried out on the portion where the slots are not formed. That is, the copper clad laminates are subjected to a working to form slots, and an ink layer is formed within each of the slots. In this manner, during the plating of the upper face of the printed circuit board, the metal is prevented from intruding into the window region, thereby preventing the formation of a short circuit.
    Type: Grant
    Filed: December 21, 1999
    Date of Patent: May 28, 2002
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Kyung-Ro Yoon, Keon-Yang Park, Byung-Kook Sun
  • Patent number: 6393698
    Abstract: A coaxial connector ensures positive, stable contact and permits sufficiently reduced size and thickness. The coaxial receptacle (1) is equipped with: a synthetic resin insulating case (2) which has a hexahedron shape; an internal terminal (30) composed of a metallic fixed terminal (4) and a movable terminal (5) made of a flexible metal material, which are provided in a cavity or internal space (3) of the insulating case (2); a rubber elastic member (51) disposed under the movable terminal (5) in the cavity (3) of the insulating case (2); and an external terminal or outer conductor (40) provided to cover an essential section of the insulating case (2). The cavity (3) of the insulating case (2) is a vertical columnar space; and the upper side thereof has an annular opening to form an inlet (7) through which the central contact of a mating coaxial connector is introduced downward.
    Type: Grant
    Filed: April 6, 2000
    Date of Patent: May 28, 2002
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Toshitaka Kuriyama, Takekazu Okada
  • Patent number: 6389680
    Abstract: A method of manufacturing an electronic component secures sufficient area such that an element of the electronic component can be formed on the surface of a mother substrate while preventing debris from an insulating film from remaining on the element. According the method, individual elements are cut out from the mother substrate by cutting the mother substrate along cut lines A and B by using a dicing process wherein a protecting film is not located only at portions of the surface of the mother substrate where cut lines A and B intersect with each other and the surface of the mother substrate is exposed only at the intersection portions.
    Type: Grant
    Filed: March 5, 1998
    Date of Patent: May 21, 2002
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Katsuji Matsuta, Masahiko Kawaguchi