Abstract: The present invention relates to a method and apparatus for manufacturing a surface mount power supply device having effective thermal management. The surface mount power supply device comprises a printed circuit board mounted to a thermal plastic lead frame attach by means of vertically-extending aluminum pins embedded in the lead frame attach. A cylindrical member is centered within the lead frame attach by means of inwardly protruding arms transversely connected to the lead frame attach to allow for a pick-and-place operation.

Abstract: Equipment for cutting sheet material includes a plurality of pairs of blade units and counter-blade units slidable and fixable on respective support members, elongate in a direction perpendicular to that of the flow of the material being cut. The support members are common to a plurality of blade units or counter-blade units. The equipment further includes a unit for selectively engaging the blade and counterblade units with respective first and second carriages. The selective engagement units include a support structure on which is mounted a respective actuator including a piston, the distal end of which is shaped so as, in its extended position, to be able to engage a pin which projects from each blade unit and counter-blade unit respectively.

Abstract: A method of installing a wire-harness which interconnects electric circuits provided at the inside and outside of a compartment of a motor vehicle. When a wind shield is bonded and fixed to a window frame of a vehicle body, a flat cable is disposed and embedded simultaneously at a portion of bonding wind shield at where the inside and outside of the compartment is partitioned. The circuit provided at the outside of the compartment is thus connected to the circuit provided at the inside of the compartment through the embedded flat cable at the portion of bonding wind shield.

Abstract: A sensor, such as a proximity sensor, having its components sealed within a case, has its sensitivity adjusted with a remotely settable digital potentiometer after assembly of the sensor. The adjustment connection is then destroyed.

Abstract: In order to present a temperature sensor which works stable also in a high temperature condition showing only a small deviation in the resistance value of thermistor, the invented temperature sensor comprises a heat resisting cap (5) made of a metal, a thermistor (1) housed inside the heat resisting cap (5) and at least more than one lead wire (4) which is electrically connected with the thermistor (1) and is pulled out of said heat resisting cap (5), said heat resisting cap (5) being formed with an alloy containing Ni—Cr as the main ingredient.

Abstract: A permanent magnet micro-rotor comprises a cylinder of magnetic material having a plurality of spaced-apart slots disposed around the periphery of the magnetic material. The magnetic material is magnetized by placing conductors in the spaced apart slots and energizing the conductors so that magnetic poles are formed between the spaced-apart slots.

Abstract: A method for forming a thin-film resistor includes forming two insulators on the thin-film resistor, forming contact holes by performing wet etching processes, and forming interconnect and contact plugs at the same time. The invention also provides another method for forming a thin-film resistor that forms a thin-film resistor over the passivation layer instead. That is, forming a thin-film resistor on the top of the device, so that the resistance can be re-modified according to the actual needs.

Abstract: A method for producing an electric resistor, in particular a resistance strain gauge, in which an insulating layer and a resistive layer are sequentially applied to a carrier element. The insulating layer or the resistive layer is applied to a backing sheet, the side of the backing sheet carrying the insulating or resistive layer being covered with a flexible film layer whose adhesion to the insulating layer or resistive layer is stronger than the adhesion of the backing sheet to the insulating layer or resistive layer. The film layer with the insulating or resistive layer is peeled off of the adhesive backing sheet and applied to a carrier element, which is heated to burn off the film layer and sinter on the insulating or resistive layer.

Abstract: A scissors-like handle tool manipulates a ZIF socket having a cover slidably engaged with a bottom, between a loosened status and a tightened status. The handle tool comprises a first lever arm pivotably connected to a second lever arm. The handle tool is operated by encountering two lower ends of the first and second lever arms with two movable sides of the socket via a pivot operation of the handle tool thereby moving the cover of the ZIF socket along the bottom.

Abstract: The invention relates to electronic technique, particularly to technology of fabricating and checking semiconductor integrated circuits and semiconductor structures. The method of manufacturing and checking electronic components consists in that a plurality of dice are disposed in a press-form, orienting to the dice bonding pads and base elements of the press-form, all non-protected surfaces of the dice except the bonding pads are insulated. Specificity of the method consists in that disposing in the press-form dice are fixed one to another forming a group carrier, providing a disposal of the dice facial (main) surfaces on common plane with one of the group carrier's surfaces, at that all the conductors, necessary for burn-in and checking, and also external connector are deposited on this plane simultaneously. Variants of the method consist in that a group metal frame is disposed simultaneously with the dice.

Abstract: A method for manufacturing varistor by which a varistor having a high plating resistance and a high moisture resistance is manufactured by selectively forming a compact high-resistance layer having a uniform thickness on the surface of a varistor element. In the method, the varistor element (1) is first formed by alternately laminating ceramic sheets (1a) mainly of a zinc oxide and internal electrodes (2) upon one another, and then, Ag electrode paste which becomes external electrodes (3) is applied to both end faces of the element (1). Then, after the element (1) is sintered through heat treatment, the element (1) is buried in SiO2 or a mixture (5) containing SiO2 and the element (1) is heat-treated for 5-10 minutes at 600-950° C. in the air or in an oxygen atmosphere.

Abstract: Both ends of a plurality of parallel electrical wires are respectively connected to the connectors with pressure by a pressure-connecting and wiring machine into which the plurality of electrical wires are introduced, and the thus introduced electrical wires are sent to the electrical wire pressure-connecting section via the electrical wire cutting section. At this time, the connectors are successively fed to the electrical wire pressure-connecting section of the pressure-connecting and wiring machine in the direction parallel with the arrangement of the pressure terminals. After the electrical wires have been connected to the connector with pressure, the pressure-connected electrical wires of a predetermined length are drawn out from the pressure-connecting and wiring machine. Then the pressure-connecting and wiring machine is turned round the vertical axis by an angle of 180°, and the electrical wires, which have been drawn out before, are connected to the other connector with pressure and cut.

Abstract: An apparatus for holding a workpiece in a predetermined position in a machine tool. The apparatus has an axis of rotation and comprises an outer body having an outer surface, an inner bore, a first end and a second end with the second end being insertable into a tapered opening of a spindle of the machine tool. The outer body includes means projecting radially from the outer surface for abutment against a face of the spindle for stopping inward movement of the apparatus upon achieving a predetermined final position in the spindle. A portion of the outer surface adjacent the stop means and extending toward the second end is inwardly tapered by an amount whereby the taper of the outer surface is generally equal to the taper of the spindle opening. The workholding apparatus includes a connector attached to the second end of the outer body, the connector having a first end insertable into the second end of the outer body and a second end comprising a plurality of spaced-apart lugs extending radially outward.

Abstract: A method is provided for connecting two conductive layers in an electronic circuit package comprising the steps of forming dendrites on selected regions of a first conductive layer, forming dendrites on selected regions of a second conductive layer, applying an epoxy adhesive material over the first conductive layer, and compressively attaching the second conductive layer to the first conductive layer such that the dendrites on the first conductive layer contact the dendrites on the second conductive layer. Also claimed is an electronic circuit package incorporating the dendrites used for electrical interconnection manufactured in accordance with the present invention. An alternative embodiment of the invention utilizes an intermediate surface metal with dendrites in place of a “through via.

Abstract: The present invention concerns a method and apparatus of automatically mounting electronic components at predetermined positions of an electronic circuit board, which comprise a mounting process of taking out an electronic component 10 from an electronic components holding unit 6 and mounting onto an electronic circuit board 5 and a processing process to trim the electronic component 10 during the mounting process to a preferable characteristic value thereby allowing to reduce the number of types of electronic components 10 to be stored in the electronic components holding unit 6 and reduce the equipment cost and the management cost of the electronic components 10.

Abstract: A method for forming a gap of a planar thin film magnetic head and a planar thin film magnetic head formed thereby, includes a photoresist having a stepped surface is formed at one side from the center of a gap spacer pedestal. Also, a gap spacer of a diamond-like carbon material for forming the gap is formed at a side well of the photoresist, and one side of an upper pole piece is formed with a magnetic material over the other side from the center of the gap spacer pedestal. Further, the photoresist is etched and the other side of the upper pole piece is formed with a magnetic material over the exposed gap spacer pedestal.

Abstract: A fault current fusing resistor, comprising a substrate on which there is a line of resistive film formed of metal and glass in a conductive film, which line is closely confined by containing and sealing substances to prevent venting of vapor from the line during the fusing caused by an electrical fault condition.

Abstract: A system (10) for coupling conductive pellets (40) to a component (12) of an integrated circuit has a substantially planar ribbon (14) that includes a conductive material. A punching apparatus (16) and (38) penetrates the ribbon (14) to form the conductive pellets (40). The punching apparatus (16) and (38) also moves relative to the component (12) to the conductive pellets (40) to the component (12).

Abstract: The present invention relates to a method for manufacturing a printed circuit board The method for manufacturing a printed circuit board of the present invention comprises opening resin holes in a copper plate, filling second resins such as epoxy resins in the resin holes, attaching first metal foils such as copper foils through first resins such as polyimide resins dissolved in solvents on the copper plate, selectively etching the first metal foils, attaching second metal foils through the first resins dissolved in a solvent on both the faces, selectively wet-etching the second metal foils, irradiating laser beam over the resulting thereby exposed first resins to open a connection holes in the second metal foils and resin layers consisting of the first resin, electroless copper plating and subsequent electrolytic copper plating to form copper-plated layers on both the faces, and thereafter selectively etching the second metal foils and the copper-plated layers.

Abstract: An interposer for interconnection between microelectronic circuit panels has contacts at its surfaces. Each contact extends from a central conductor, and has a peripheral portion adapted to contract radially inwardly toward the central conductor response to a force applied by a contact pad defining a central hole on the engaged circuit panel. Thus, when the circuit panels are compressed with the interposers, the contacts contract radially inwardly and wipe across the pads. The wiping action facilitates bonding of the contacts to the pads, as by friction welding, or by a conductive bonding material carried on the contacts themselves.