Abstract: This copper alloy for electronic or electric devices includes: Mg: 0.15 mass % or greater and less than 0.35 mass %; and P: 0.0005 mass % or greater and less than 0.01 mass %, with a remainder being Cu and unavoidable impurities, wherein an amount of Mg [Mg] and an amount of P [P] in terms of mass ratio satisfy [Mg]+20×[P]<0.5, and 0.20<(NFJ2/(1?NFJ3))0.5?0.45 is satisfied in a case where a proportion of J3, in which all three grain boundaries constituting a grain boundary triple junction are special grain boundaries, to total grain boundary triple junctions is represented by NFJ3, and a proportion of J2, in which two grain boundaries constituting a grain boundary triple junction are special grain boundaries and one grain boundary is a random grain boundary, to the total grain boundary triple junctions is represented by NFJ2.

Abstract: An exterior material of a home appliance having improved corrosion resistance and fingerprint resistance by changing a treatment method of a surface of the exterior material, and the home appliance including the same, and a manufacturing method therefor are provided. The method of manufacturing the exterior material of the home appliance, the method including applying a diamond like carbon (DLC) coating on the substrate to form a DLC coating layer; and conducting anti-fingerprint coating to form the anti-fingerprint coating on the DLC coating layer.

Abstract: A watch component includes an austenized ferritic stainless steel including a base including a ferrite phase, a surface layer formed on a surface of the base, the surface layer including an austenized phase, and a mixed layer formed between the base and the surface layer, the mixed layer being a layer in which the ferrite phase and the austenized phase are mixed. In a cross section taken along a depth direction from the surface, a thickness of the mixed layer is 45% or less of a thickness of the surface layer.

Abstract: A substrate is coated with a multi-layer coating, comprising in order: (i) a first functional layer comprising ta-C, (ii) a second functional layer comprising ta-C, (iii) (a) a third functional layer comprising ta-C and a first intermediate layer comprising a carbide of a first element, or (b) a first intermediate layer comprising a carbide of a first element, and a second intermediate layer comprising the first element, wherein the ta-C has a hydrogen content less than 10% and an sp2 content less than 30%; wherein (i) the Young's modulus or (ii) the hardness or (iii) both the Young's modulus and the hardness independently stay the same or increase from layer to layer in (iii) (a) from the first intermediate layer to the first functional layer, or in (iii) (b) from the second intermediate layer to the first functional layer.

Abstract: The disclosure provides for anti-scale deposition coatings for use on surface, such as on oilfield parts. The coating includes a first, sublayer of a metal, ceramic, or metal-ceramic composite, which is characterized in having a hardness in excess of 35 HRC. The coating includes a second, top layer over the first layer, that is a polymer. A surface of the first layer may be conditioned to have a roughened or patterned topology for receipt of and adherence with the at least one top layer. The first layer may provide the coating with hardness, and the at least one top layer may provide the coating with low-friction and anti-scale properties.

Abstract: A composite copper foil contains a carrier layer, a release layer and an ultra-thin copper layer in this order. In the composite copper foil, the release layer includes a binary alloy or a ternary alloy comprising nickel, and is formed into an amorphous layer, and the ultra-thin copper layer is peelable from the carrier layer. A method of fabricating the composite copper foil includes preparing a carrier layer, forming a release layer which is amorphous on the carrier layer by electroplating using an electrolyte that comprises nickel, and forming an ultra-thin copper layer on the release layer by electroplating.

Abstract: A tetrahedral amorphous hydrogenated carbon and amorphous siloxane hybrid diamond-like nanocomposite composition can include: tetrahedral amorphous hydrogenated carbon (ta-C:H); and amorphous siloxane (a-Si:O), wherein the ta-C:H and a-Si:O are in an interpenetrating network. A method of forming a tetrahedral amorphous hydrogenated carbon and amorphous siloxane hybrid diamond-like nanocomposite can include: providing a source of H, C, O, and Si as a liquid precursor; providing evaporated precursor into a vacuum chamber; forming a plasma with an RF plasma generator and/or a thermal plasma generator; and depositing, on a rotating biased substrate, a collimated layer of the tetrahedral amorphous hydrogenated carbon and amorphous siloxane hybrid diamond-like nanocomposite having tetrahedral amorphous hydrogenated carbon (ta-C:H) and amorphous siloxane (a-Si:O), wherein the ta-C:H and a-Si:O are in an interpenetrating network. A RF rotating electrode is also provided.

Abstract: A nickel-based alloy composition consisting, in weight percent, of: between 1.0 and 3.5% aluminium, 0.0 and 3.6% titanium, 0.0 and 6.0% niobium, 0.0 and 4.9% tantalum, 0.0 and 5.4% tungsten, 0.0 and 4.0% molybdenum, 8.9 and 30.0% cobalt, 10.8 and 20.6% chromium, 0.02 and 0.35% carbon, between 0.001 and 0.2% boron, between 0.001 and 0.5% zirconium, 0.0 and 5.0% rhenium, 0.0 and 8.5% ruthenium, 0.0 and 4.6 percent iridium, between 0.0 and 0.5% vanadium, between 0.0 and 1.0% palladium, between 0.0 and 1.0% platinum, between 0.0 and 0.5% silicon, between 0.0 and 0.1% yttrium, between 0.0 and 0.1% lanthanum, between 0.0 and 0.1% cerium, between 0.0 and 0.003% sulphur, between 0.0 and 0.25% manganese, between 0.0 and 6.0% iron, between 0.0 and 0.5% copper, between 0.0 and 0.

Abstract: A coated cutting tool having a substrate and a coating is provided. The coating includes an inner ?-Al2O3-multilayer and an outer ?-Al2O3-single-layer. The thickness of the inner ?-Al2O3-multilayer is less than or equal to 35% of the sum of the thickness of the inner ?-Al2O3-multilayer and the thickness of the outer ?-Al2O3-single-layer. The sum of the thickness of the inner ?-Al2O3-multilayer and the outer ?-Al2O3-single-layer is 2-15 ?m. The inner ?-Al2O3-multilayer consists of alternating sublayers of ?-Al2O3 and sublayers of TiCO, TiCNO, AlTiCO or AlTiCNO. The inner ?-Al2O3-multilayer can include at least 5 sublayers of ?-Al2O3.

Abstract: Disclosed is a clad steel plate with further improved low temperature toughness along with excellent HIC resistance while ensuring a tensile strength of 535 MPa or more. A clad steel plate includes: a base steel; and a clad metal made of a corrosion resistant alloy bonded to one surface of the base steel, in which the base steel has: a chemical composition with appropriately controlled values of ACR and PHIC; and a steel microstructure in which bainite is present in an area fraction of 94% or more at a ½ thickness position in a thickness direction of the base steel, and with an average crystal grain size of 25 ?m or less, and shear strength at a bonded interface between the base steel and the cladding metal is 300 MPa or more.

Abstract: Disclose is a copper alloy for a laser cladding valve seat. the copper alloy may include an amount of about 15.0 to 25.0 wt % of Ni, an amount of about 1.0 to 4.0 wt % of Si, an amount of about 0.5 to 1.0 wt % of B, an amount of about 1.0 to 2.0 wt % of Cr, an amount of about 5.0 to 15.0 wt % of Co, an amount of about 2.0 to 20.0 wt % of Mo, an amount of about 0.1 to 0.5 wt % of Ti and the balance Cu, all the wt % based on the total weight of the copper alloy. Particularly, the copper alloy may not include Fe, and may include Ti silicacide. Further disclosed is a laser cladding valve seat including the copper alloy, which does not generate cracks and is excellent in wear resistance.

Abstract: Provided are: a surface-treated copper foil including a surface-treated layer formed on at least one side of an untreated copper foil and an oxidation preventing layer formed on the surface-treated layer, wherein the surface-treated layer contains copper particles having an average particle diameter of about 10 nm to about 100 nm and has a 10-point average roughness, Rz, of about 0.2 ?m to about 0.5 ?m and a gloss (Gs 60°) of about 200 or more, and the oxidation preventing layer contains nickel (Ni) and phosphorus (P); a manufacturing method thereof; a copper foil laminate including the same; and a printed wiring board including the same.

Abstract: A cemented carbide may include a hard phase including W and C, and a binder phase including cubic Co. The binder phase may include Zr. The Co may include a lattice constant of more than 3.5575 ? and not more than 3.5600 ?. A coated tool may include a coating layer located on a surface of the cemented carbide. A cutting tool may include a holder that is extended from a first end toward a second end and may include a pocket on a side of the first end, and the coated tool located in the pocket.

Abstract: A clad material (30) includes a first layer (31) made of stainless steel, a second layer (32) made of Cu or a Cu alloy and roll-bonded to the first layer, and a third layer (33) made of stainless steel and roll-bonded to a side of the second layer opposite to the first layer. The clad material has an overall thickness of 1 mm or less, and in a cross-sectional view along a stacking direction, a minimum thickness of the first layer in the stacking direction and a minimum thickness of the third layer in the stacking direction are 70% or more and less than 100% of an average thickness of the first layer in the stacking direction and an average thickness of the third layer in the stacking direction, respectively.

Abstract: An Al—Mg-based or Al—Mg—Si-based or Al—Zn-based or Al—Si-based starting material in the form of a powder or wire for an additive manufacturing process, the use thereof, and an additive manufacturing process using this starting material are disclosed.

Abstract: The present invention relates to an electrolytic copper foil having excellent handling characteristics in the manufacture of copper foil and in post-processing for manufacturing a secondary battery. The present invention provides an electrolytic copper foil having a first surface and a second surface, wherein the texture coefficient of the (220) plane of the electrolytic copper foil is 0.4-1.32, the difference (|?(Rz/Ra)|) between Rz/Ra on the first surface and Rz/Ra on the second surface, of the electrolytic copper foil, is less than 2.42, and the difference (|?PD|) in peak density (PD) between the first surface and the second surface, of the electrolytic copper foil, is 96 ea or less.

Abstract: There is provided a group III nitride laminate, including: a substrate comprised of silicon carbide; a first layer comprised of aluminum nitride and formed on the substrate; a second layer comprised of gallium nitride and formed on the first layer; and a third layer formed on the second layer and comprised of group III nitride having an electron affinity lower than that of the gallium nitride which is comprised in the second layer, the second layer having a thickness of less than 500 nm, the second layer containing iron at a concentration of less than 1×1017/cm3, and the second layer containing carbon at a concentration of less than 1×1017/cm3.

Abstract: The present invention relates to an article comprising a ceramic substrate (310) comprising a source of zirconium oxide; a metallic substrate (320); and a braze joint disposed between the ceramic substrate and the metallic substrate. The braze joint comprises (i) a gold rich phase (330) interfacing against a surface of the ceramic substrate. The gold rich phase comprises a refractory metal selected from the group consisting of molybdenum, tungsten, niobium, tantalum and combinations thereof; and (ii) a second metallic phase (340) comprising a metal selected form the group consisting of nickel, iron, vanadium, cobalt, chromium, osmium, tantalum or combinations thereof.

Abstract: A flat product of steel with yield strength Rp 0.2 of 660 to 820 MPa, BH2 value greater than 30 MPa, a hole expansion ratio greater than 30%, and a microstructure having a first main component at a proportion of at least 50%, including one or more individual components of ferrite, tempered bainite, and tempered martensite, each with less than 5% carbides, and a second main component at a proportion of 5% to 50%, including one or more individual components of martensite, residual austenite, bainite or perlite, with the steel having a following chemical composition (in weight %): C: 0.04 to 0.12; Si: 0.03 to 0.8; Mn: 1 to 2.5: P: max. 0.08; S: max. 0.01; N: max. 0.01; Al: up to 0.1; Ni+Mo; up to 0.5; Nb: up to 0.08; Ti: up to 0.2; Nb+Ti: min, 0.03; Cr: up to 0.6; the remainder being iron including unavoidable steel-associated elements.

Abstract: A composite metal foil and a preparation method thereof are provided. The composite metal foil includes a carrier layer, a barrier layer, a striping layer, and a metal foil layer. The carrier layer, the barrier layer, the striping layer, and the metal foil layer are sequentially stacked, the barrier layer includes a metal bonding layer and a high-temperature resistant layer stacked, and the metal bonding layer is disposed between the carrier layer and the high-temperature resistant layer. The striping layer is disposed between the carrier layer and the metal foil layer so as to facilitate peeling of the carrier layer, and the barrier layer is disposed between the carrier layer and the metal foil layer so as to prevent the carrier layer and the metal foil layer from diffusing mutually to cause bonding at a high temperature, so that the carrier layer and the metal foil layer are easy to peel off.