Patents Examined by Seth Dumbris
  • Patent number: 11326236
    Abstract: Provided is a black stainless steel sheet that has excellent weldability, that can ensure good toughness and corrosion resistance, and that can maintain the blackness of the surface thereof, even after being welded. This black ferrite-based stainless steel sheet having excellent weldability includes, as a base, a stainless steel containing, in mass %, 0.020% or less of C, 1.0% or less of Si, 0.35% or less of Mn, 0.04% or less of P, 0.005% or less of S, 11-25% of Cr, 1.0% or less of Mo, 0.020% or less of N, 0.4% or less of Al, 10(C+N) to 0.3% of Ti, 0.05% or less of Nb, and 0.01% or less of O, and has a surface in which an oxide coating is formed on the base, wherein the surface has a lightness index (L*) satisfying L*?45, chromaticity indices (a*, b*) satisfying ?5?a*?5 and ?5?b*?5, and a blackness (E) satisfying E=(L*2+a*2+b*2)1/2?45.
    Type: Grant
    Filed: January 26, 2018
    Date of Patent: May 10, 2022
    Assignee: NIPPON STEEL STAINLESS STEEL CORPORATION
    Inventors: Yoshikazu Tai, Tomoaki Saida, Kazunari Imakawa, Satoshi Suzuki
  • Patent number: 11326235
    Abstract: A hot rolled steel sheet according to an aspect of the present invention has a predetermined chemical composition, and a metallographic structure in which martensite is the major structure, wherein an average length of grains in an L direction parallel to a rolling direction is 0.2 ?m or more and 5.0 ?m or less, an average length of grains in a C direction parallel to a transverse direction is 0.1 ?m or more and 5.0 ?m or less, the ratio of the average length in the C direction to the average length in the L direction is 0.2 or more and 5.0 or less, and the tensile strength is 1180 MPa or more.
    Type: Grant
    Filed: August 9, 2018
    Date of Patent: May 10, 2022
    Assignee: NIPPON STEEL CORPORATION
    Inventors: Tetsuya Hirashima, Takeshi Toyoda
  • Patent number: 11318562
    Abstract: A grain-oriented electrical steel sheet includes a groove formed on a surface and a solidified alloy layer formed under the groove, wherein the solidified alloy layer includes particles of a certain average diameter.
    Type: Grant
    Filed: December 20, 2017
    Date of Patent: May 3, 2022
    Assignee: POSCO
    Inventors: Oh-Yeoul Kwon, Se-Min Park, Jong-Tae Park, Won-Gul Lee
  • Patent number: 11318706
    Abstract: A wear-resistant coating film is disclosed that can maintain high wear resistance for a long period of time even when it is subjected to repetitive wear, and a method for producing the film, as well as a wear-resistant component. The wear-resistant coating film 10 includes a plated layer 11, lump parts 2, and a coat layer 13. The plated layer and the coat layer are laminated, and each of the lump parts is formed of a single particle 12 and/or an assembly of particles 12. The lump parts 2 are held by the plated layer 11 and are disposed to protrude from the plated layer 11. The coat layer 13 is formed to coat the surface of the plated layer 11, the lump parts 2 have flat portions 18, and the flat portions 18 are placed on the same plane as the surface of the coat layer 13.
    Type: Grant
    Filed: May 21, 2019
    Date of Patent: May 3, 2022
    Assignee: TEIKOKU ION CO., LTD
    Inventors: Masafumi Hojo, Takashi Nakamura, Takuya Kawawaki, Ryosuke Nakamura, Mitsuhiko Terashita
  • Patent number: 11322424
    Abstract: An insulated circuit board which is obtained by bonding a circuit layer onto one side of a ceramic substrate, and bonding a metal layer made of copper or copper alloy onto the other side of the ceramic substrate; and a heat sink which is bonded to the metal layer are included; the heat sink has a first metal layer made of aluminum or aluminum alloy joined to the metal layer, a ceramic board material joined to the first metal layer at an opposite side to the metal layer, and a second metal layer made of aluminum or aluminum alloy joined to the ceramic board material at an opposite side to the first metal layer; a thickness T1 of the first metal layer and a thickness T2 of the second metal layer are 0.8 mm to 3.0 mm inclusive; and a thickness ratio T1/T2 is 1.0 or more.
    Type: Grant
    Filed: March 27, 2019
    Date of Patent: May 3, 2022
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Ryohei Yumoto, Tomoya Oohiraki, Takeshi Kitahara, Yoshiyuki Nagatomo
  • Patent number: 11313032
    Abstract: A layer system includes at least one bonding layer and a plurality of functional layers arranged on the at least one bonding layer. Each functional layer has a first nanolayer of a first metal nitride with a first metal constituent, and a metallic second nanolayer. Each functional layer has a layer thickness d in a range of 1 to 100 nm.
    Type: Grant
    Filed: December 4, 2017
    Date of Patent: April 26, 2022
    Assignee: Schaeffler Technologies AG & Co. KG
    Inventors: Edgar Schulz, Ladislaus Dobrenizki, Ricardo Henrique Brugnara, Oliver Witter
  • Patent number: 11313009
    Abstract: A hot-rolled steel sheet according to an aspect of the present invention has a predetermined chemical composition, in which, in a location at a depth of ¼ of a sheet thickness from a surface, an area ratio of ferrite is 10% to 55%, a total area ratio of bainite and martensite is 45% to 90%, a total area ratio of the ferrite, the bainite, and the martensite is 90% or more, an average crystal grain size is 12.0 ?m or less, in a texture measured in a sheet thickness central portion, a maximum pole density of orientation groups of {100} <011>, {211} <011>, {311} <011>, {110} <011>, and {332} <113> is 8.0 or less, a total of pole densities of {211} <011> and {332} <113> is 10.0 or less, and a tensile strength is 950 MPa or more.
    Type: Grant
    Filed: July 6, 2018
    Date of Patent: April 26, 2022
    Assignee: NIPPON STEEL CORPORATION
    Inventors: Mitsuru Yoshida, Nobusato Kojima, Yuuki Kanzawa, Kohhei Kamiya
  • Patent number: 11306372
    Abstract: A Co based alloy powder includes between 0.08% and 0.25% mass of carbon, 0.1% mass or less of boron, between 10% and 30% mass of chromium, 5% mass or less of iron, and 30% mass or less of nickel; the iron and the nickel in a total amount of 30% mass or less; includes at least one of tungsten and molybdenum in a total amount of between 5% and 12% mass; includes at least one of titanium, zirconium, niobium, tantalum, hafnium, and vanadium in a total amount of between 0.5% mass and 2% mass; includes 0.5% mass or less of silicon, 0.5% mass or less of manganese, and between 0.003% and 0.04% mass of nitrogen; and includes cobalt and impurities as the balance of the powder. Crystal grains included in the cobalt-based alloy powder have segregated cells; the cells have an average size of between 0.15 ?m and 4 ?m.
    Type: Grant
    Filed: December 26, 2019
    Date of Patent: April 19, 2022
    Assignee: MITSUBISHI POWER, LTD.
    Inventors: Yuting Wang, Shinya Imano
  • Patent number: 11306387
    Abstract: Thermal barrier coatings for substrates comprising titanium. The thermal barrier coating may include a bond layer, an insulating layer, and a sealant layer. The bond layer may include titanium, a titanium alloy, an intermetallic compound of titanium, and/or a titanium metal matrix composite. The bond layer may have a superlattice structure having a periodically repeating group of layers. Methods for producing the thermal barrier coatings and articles of manufacture employing the thermal barrier coatings.
    Type: Grant
    Filed: January 17, 2020
    Date of Patent: April 19, 2022
    Assignee: LOCKHEED MARTIN CORPORATION
    Inventor: Thomas Christian Stinnett
  • Patent number: 11298742
    Abstract: A component is provided and includes a core including a ceramic matrix composite material, one or more cooling channels formed about the core, an outer metal shell disposed about the core and the one or more cooling channels and a protective material between the core and the outer metal shell. The one or more cooling channels are formed about the core as an array of cooling channels in the protective material.
    Type: Grant
    Filed: December 16, 2019
    Date of Patent: April 12, 2022
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Gary B. Merrill, Nicholas F. Martin, Jr.
  • Patent number: 11285701
    Abstract: A heat sink plate includes a first layer made of copper (Cu) or a copper (Cu) alloy, a second layer formed on the first layer and made of molybdenum (Mo) or an alloy that includes copper (Cu) and one or more components selected from molybdenum (Mo), tungsten (W), carbon (C), chromium (Cr), titanium (Ti), and beryllium (Be), a third layer formed on the second layer and made of copper (Cu) or a copper (Cu) alloy, a fourth layer formed on the third layer and made of molybdenum (Mo) or an alloy that includes copper (Cu) and one or more components selected from molybdenum (Mo), tungsten (W), carbon (C), chromium (Cr), titanium (Ti), and beryllium (Be), and a fifth layer formed on the fourth layer and made of copper (Cu) or a copper (Cu) alloy.
    Type: Grant
    Filed: February 25, 2020
    Date of Patent: March 29, 2022
    Assignees: THEGOODSYSTEM CORP., DOWA METALTECH CO., LTD.
    Inventors: Meoung-whan Cho, Il-ho Kim, Seog-woo Lee, Young-suk Kim, Hiroto Narieda, Tomotsugu Aoyama
  • Patent number: 11285705
    Abstract: A window product according to various embodiments of the present invention comprises: a window; and a film made of at least one insulation material and bonded to one side of the window, wherein the permittivity of the insulation material constituting the film is lower than the permittivity of the window and is higher than the permittivity of air, and the film may be a film for reducing loss of radio wave transmissivity of the window when attached to the window. Other various embodiments are also possible.
    Type: Grant
    Filed: October 18, 2017
    Date of Patent: March 29, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Junsig Kum, Hyunjin Kim, Yoongeon Kim, Taesik Yang, Youngju Lee, Jungyub Lee, Dohyuk Ha
  • Patent number: 11282622
    Abstract: A ferrite composition includes a main component and a sub-component. The main component includes 10.0 to 38.0 mol % of a Fe compound in terms of Fe2O3, 3.0 to 11.0 mol % of a Cu compound in terms of CuO, 39.0 to 80.0 mol % (excluding 39.0 mol %) of a Zn compound in terms of ZnO, and a balance of a Ni compound. The sub-component includes 10.0 to 23.0 parts by weight of a Si compound in terms of SiO2, 0 to 3.0 parts by weight (including 0 parts by weight) of a Co compound in terms of Co3O4, and 0.1 to 3.0 parts by weight of a Bi compound in terms of Bi2O3 with respect to 100 parts by weight of the main component.
    Type: Grant
    Filed: December 26, 2019
    Date of Patent: March 22, 2022
    Assignee: TDK CORPORATION
    Inventors: Takeshi Shibayama, Takashi Suzuki, Takahiro Sato, Kenji Komorita, Tatsuro Suzuki, Yukio Takahashi, Hiroyuki Tanoue, Yasuhiro Ito
  • Patent number: 11279993
    Abstract: A nickel-containing steel plate according to an aspect of the present invention has a chemical composition within a predetermined range, in which an average coarse grain size of prior austenite which is defined as a simple average value of maximum values of equivalent circle diameters of prior austenite grains in each of ten visual fields having an area of 200 ?m2, measured at a ¼t position of the steel plate in a section formed by a rolling direction of the steel plate and a thickness direction of the steel plate is 20 ?m or less, and a tensile strength is 690 MPa to 900 MPa.
    Type: Grant
    Filed: December 27, 2018
    Date of Patent: March 22, 2022
    Assignee: NIPPON STEEL CORPORATION
    Inventors: Hitoshi Furuya, Kentaro Watanabe, Keisuke Mori, Masakazu Asaba, Yoshiaki Suematsu
  • Patent number: 11278955
    Abstract: An object of the present invention is to provide an electrically conductive paste having excellent bonding strength when bonded to an electronic substrate and the like, a laminated body, and a method for bonding a Cu substrate or Cu electrode to an electrical conductor. An electrically conductive paste comprising: a flake-like silver powder A having a particle size in the range of 1 ?m or more and 15 ?m or less and having a median diameter D50 of 2 ?m or more and 5 ?m or less; a silver powder B having a particle size in the range of 25 ?m or more and 100 ?m or less and having a median diameter D50 of 30 ?m or more and 40 ?m or less; a silver powder C having a particle size in the range of 10 nm or more and 190 nm or less and having a median diameter D50 of 50 nm or more and 150 nm or less; and a solvent, wherein the content of the silver powder C is more than 5.0 parts by mass and less than 90.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: March 22, 2022
    Assignee: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Jinting Jiu, Yoshie Tachibana
  • Patent number: 11277908
    Abstract: A ceramic circuit substrate having a metal plate bonded, by a bonding braze material, to at least one main surface of a ceramic substrate, wherein the bonding braze material contains, as metal components, 0.5 to 4.0 parts by mass of at least one active metal selected from among titanium, zirconium, hafnium, and niobium, with respect to 100 parts by mass, in total, of 93.0 to 99.4 parts by mass of Ag, 0.1 to 5.0 parts by mass of Cu, and 0.5 to 2.0 parts by mass of Sn; and Cu-rich phases in a bonding braze material layer structure between the ceramic substrate and the metal plate have an average size of 3.5 ?m or less and a number density of 0.015/?m2 or higher. A method for producing a ceramic circuit substrate includes bonding at a temperature of 855 to 900° C. for a retention time of 10 to 60 minutes.
    Type: Grant
    Filed: May 29, 2018
    Date of Patent: March 15, 2022
    Assignee: DENKA COMPANY LIMITED
    Inventors: Akimasa Yuasa, Yusaku Harada, Takahiro Nakamura, Shuhei Morita, Kouji Nishimura
  • Patent number: 11274439
    Abstract: The present invention is directed to flame-retardant building panels comprising a body having a first major surface opposite a second major surface; an inorganic coating atop the first major surface, the inorganic coating being optically transparent and flame retardant and comprising a blend of a borate compound and a phosphate compound, and wherein the inorganic flame retardant coating is substantially transparent such that the first major surface of the body is visible through the inorganic coating.
    Type: Grant
    Filed: May 31, 2018
    Date of Patent: March 15, 2022
    Assignee: AWI Licensing LLC
    Inventors: John E. Hughes, Michelle X. Wang
  • Patent number: 11273492
    Abstract: Described are porous sintered metal bodies, methods of making and using the porous sintered metal bodies, and methods of using the porous sintered metal bodies for commercial applications that include filtering a fluid, including in applications requiring high efficiency (high LRV) filtration.
    Type: Grant
    Filed: November 2, 2018
    Date of Patent: March 15, 2022
    Assignee: ENTEGRIS, INC.
    Inventor: Robert S. Zeller
  • Patent number: 11268170
    Abstract: A nickel-based superalloy comprises, in percentages by mass, 4.0 to 5.5% rhenium, 3.5 to 12.5% cobalt, 0.30 to 1.50% molybdenum, 3.5 to 5.5% chromium, 3.5 to 5.5% tungsten, 4.5 to 6.0% aluminum, 0.35 to 1.50% titanium, 8.0 to 10.5% tantalum, 0.15 to 0.30% hafnium, 0.05 to 0.15% silicon, the balance being nickel and unavoidable impurities. A single-crystal blade comprises such an alloy and a turbomachine comprising such a blade.
    Type: Grant
    Filed: November 14, 2018
    Date of Patent: March 8, 2022
    Assignees: SAFRAN, OFFICE NATIONAL D'ETUDES ET DE RECHERCHES AEROSPATIALES
    Inventors: Jérémy Rame, Virginie Jaquet, Joël Delautre, Jean-Yves Guedou, Pierre Caron, Odile Lavigne, Didier Locq, Mikael Perrut
  • Patent number: 11260451
    Abstract: A metal powder in which a coating made of one or more types of elements selected from Gd, Ho, Lu, Mo, Nb, Os, Re, Ru, Tb, Tc, Th, Tm, U, V, W, Y, Zr, Cr, Rh, Hf, La, Ce, Pr, Nd, Pm, Sm and Ti is formed on a surface of a copper or copper alloy powder, wherein a thickness of the coating is 5 nm or more and 500 nm or less. A metal powder for metal additive manufacturing based on the laser method which can be efficiently melted with a laser while maintaining the high conductivity of copper or copper alloy, and a molded object produced by using such metal powder are provided.
    Type: Grant
    Filed: June 21, 2018
    Date of Patent: March 1, 2022
    Assignee: JX NIPPON MINING & METALS CORPORATION
    Inventors: Yoshitaka Shibuya, Kenji Sato