Abstract: In some implementations, an optical interference filter includes a substrate; and a set of layers that are disposed on the substrate. The set of layers includes a first subset of layers, wherein the first subset of layers comprises an aluminum nitride (AlN) material; and a second subset of layers, wherein the second subset of layers comprises a hydrogenated silicon (Si:H) material.

Abstract: A fusible plug for a high pressure gas cylinder includes a communication hole filled with a low melting point alloy, a porous metal sintered body is press-fitted in at least a part of the communication hole in a length direction, all or a part of the porous metal sintered body is impregnated with the low melting point alloy to solidify and composite the low melting point alloy. It is preferable that: the low melting point alloy has a melting point of 110° C.; the porous metal sintered body to be press-fitted is a porous metal sintered body having pores with an area ratio of 30% or more and 50% or less and having pores with a diameter exceeding 5 ?m among the pores of 80% or more in terms of area ratio to all the pores; and the porous metal sintered body is a porous austenitic stainless steel sintered body.

Abstract: A cemented carbide composed of a first hard phase, a second hard phase and a binder phase, in which the first hard phase is composed of tungsten carbide particles, the second hard phase is composed of at least one first compound selected from the group consisting of TiNbC, TiNbN and TiNbCN, the second hard phase has an average particle diameter of no more than 0.1 ?m, the second hard phase has a dispersity of no more than 0.7, the second hard phase has a content of no less than 0.1 vol % and no more than 15 vol %, the binder phase contains at least one first element selected from the group consisting of iron, cobalt and nickel, and the binder phase has a content of no less than 0.1 vol % and no more than 20 vol %.

Abstract: Provided are a liquid crystal polymer film (LCP film) and a laminate comprising the same. The LCP film has a first surface and a second surface opposite each other, and the first surface has an arithmetical mean height of a surface (Sa) less than 0.32 ?m. The LCP film with proper Sa is suitable to be stacked with a metal foil, such that a laminate comprising the LCP film can have an advantage of low insertion loss.

Abstract: A corrosion resistant bimetal includes a part and one or more sacrificial anodes. The part includes a metal component that is susceptible to corrosion. The sacrificial anodes consists of an attachment to the part through a metallic bond between the metal component and the sacrificial anode to form a crystalline solid that includes the sacrificial anode and the metal component of the part.

Abstract: An embodiment of the present invention provides an electrical steel sheet laminate, including: a plurality of electrical steel sheets; and a fusion layer disposed between the electrical steel sheets, wherein the fusion layer includes an olefin-based semi-crystalline polymer and at least one inorganic metal compound of a metal phosphate and a metal chromate.

Abstract: A method for producing a semi-finished metal product (2), in particular a semi-finished copper product, for a metal-copper substrate, in particular for a copper-ceramic substrate, including: providing a first metal layer (11), in particular a first copper layer, and a second metal layer (12), in particular a second copper layer, joining the first metal layer (11) and the second metal layer (12) to form the semi-finished metal product (2), wherein, chronologically before the first metal layer (11) is joined to the second metal layer (12) by means of different temperature treatments, a grain growth in the first metal layer (11) and/or the second metal layer (12) is initiated in such a way that in the produced semi-finished metal product (2), in particular in the produced metal-copper substrate, a first grain size in the first metal layer (11) differs from a second grain size in the second metal layer (12).

Abstract: A plating steel sheet for hot press forming includes: a base steel sheet; an Al—Zn-based plating layer formed on at least one surface of the base steel sheet; and an Fe—Al-based surface alloy layer formed between the base steel sheet and the Al—Zn-based plating layer, wherein the Al—Zn-based plating layer can include 10-30 wt % of Zn, 1 wt % or less of Fe, and the balance of Al and impurities.

Abstract: The present invention relates to a hot stamped body comprising a steel sheet and a plating layer formed on at least one surface of the steel sheet, wherein the plating layer is comprised of a ZnO region present on a surface side of the plating layer and having an oxygen concentration of 10 mass % or more and an Ni—Fe—Zn alloy region present on a steel sheet side of the plating layer and having an oxygen concentration of less than 10 mass %, and an average concentration of a total of Fe, Mn and Si in the ZnO region is more than 0 mass % and less than 5 mass %.

Abstract: A coated member, an electronic device, and a method for manufacturing the coated member are provided. The coated member comprises a substrate, a color layer formed on a surface of the substrate, and an interference layer formed on a surface of the color layer. A coordinate L* corresponding to a color space presented by the color layer in a CIE LAB color system is within a preset range. When the coordinates of L* are within the preset range, the color of the coated member may be the same or may be different from the color of the color layer. Light passes through the interference layer and then enters the color layer. The color layer reflects and refracts the light. The reflected light enters the interference layer. The interference layer interferes with the reflected light, so that the coated member appears to be a target color.

Abstract: A method for forming a metal film includes forming an oxide layer on a to-be-treated surface of a to-be-treated object by bringing the to-be-treated surface into contact with a reaction solution containing fluorine and an oxide precursor, removing fluorine in the oxide layer, supporting a catalyst on the oxide layer by bringing the oxide layer into contact with a catalyst solution, and depositing a metal film on the oxide layer by bringing the oxide layer into contact with an electroless plating liquid.

Abstract: Provided is a titanium composite material 1 including: a first surface layer portion 2; an inner layer portion 4; and a second surface layer portion 3; wherein: the first surface layer portion 2 and the second surface layer portion 3 are composed of a titanium alloy; the inner layer portion 4 is composed of a commercially pure titanium including pores; a thickness of at least one of the first surface layer portion 2 and the second surface layer portion 3 is 2 ?m or more, and a proportion of the thickness with respect to an overall thickness of the titanium composite material 1 is 40% or less; and a porosity in a cross section perpendicular to a sheet thickness direction is more than 0% and 30% or less.

Abstract: The present invention relates to a metal powder including 0.1?C?0.4 mass %, 0.005?Si?1.5 mass %, 0.3?Mn?8.0 mass %, 2.0?Cr?15.0 mass %, 2.0?Ni?10.0 mass %, 0.1?Mo?3.0 mass %, 0.1?V?2.0 mass %, 0.010?N?0.200 mass %, and 0.01?Al?4.0 mass %, with the balance being Fe and unavoidable impurities, and satisfying the following expression (1), 10<15[C]+[Mn]+0.5[Cr]+[Ni]<20 (1), in which [C], [Mn], [Cr] and [Ni] respectively represent the contents of C, Mn, Cr and Ni by mass %.

Abstract: A metal-ceramic substrate (1) comprising an insulating layer (11) comprising a ceramic and having a first thickness (D1), and a metallization layer (12) bonded to the insulation layer (11) and having a second thickness (D2), wherein the first thickness (D1) is less than 250 ?m and the second thickness (D2) is greater than 200 ?m and wherein the first thickness (D1) and the second thickness (D2) are dimensioned such that a ratio of an amount of the difference between a thermal expansion coefficient of the metallization layer (12) and a thermal expansion coefficient of the metal-ceramic substrate (1) to a thermal expansion coefficient of the metal-ceramic substrate (1) has a value less than 0.25, preferably less than 0.2 and more preferably less than 0.15 or even less than 0.1.

Abstract: A thermoplasmonic device includes a titanium film and a plurality of titanium nitride tube elements disposed on the titanium film. Each of the titanium nitride tube elements includes an open top and a titanium nitride bottom. Each of the titanium nitride tube elements has titanium nitride tubular middle portion that extends from the open top to the titanium nitride bottom.

Abstract: A sputtering target for a gallium nitride thin film, which has a low oxygen content, a high density and a low resistivity. A gallium nitride powder having powder physical properties of a low oxygen content and a high bulk density is used and hot pressing is conducted at high temperature in high vacuum to prepare a gallium nitride sintered body having a low oxygen content, a high density and a low resistivity.

Abstract: An object comprising a chromium-based coating on a substrate is disclosed. The chromium is electroplated from an aqueous electroplating bath comprising trivalent chromium cations, wherein the chromium-based coating comprises: a first chromium-containing layer, on the substrate, having a thickness of at least 100 nm, and a Vickers microhardness value of 700-1000 HV; a second chromium-containing layer, on the first chromium-containing layer, having a Vickers microhardness value that is at least 1.3 times higher than the Vickers microhardness value of the first chromium-containing layer, and a crystal size of 8-35 nm; and wherein the chromium-based coating exhibits a critical scratch load value (LC2) of at least 60 N in the adhesion test according to ASTM C1624-05 (2015; point 11.11.4.4), and wherein the chromium-based coating does not contain chromium carbide. Further is disclosed a method for its production.

Abstract: A metal plate to be used in the manufacture of a deposition mask comprises: a base metal plate; and a surface layer disposed on the base metal plate, wherein the surface layer includes elements different from those of the base metal plate, or has a composition ratio different from that of the base metal plate, and an etching rate of the base metal plate is greater than the etching rate of the surface layer. An embodiment includes a manufacturing method for a deposition mask having an etching factor greater than or equal to 2.5. The deposition mask of the embodiment includes a deposition pattern region and a non-deposition region, the deposition pattern region includes a plurality of through-holes, the deposition pattern region is divided into an effective region, a peripheral region, and a non-effective region, and through-holes can be formed in the effective region and the peripheral region.

Abstract: The present invention relates to a hot stamped body comprising a steel sheet and a plating layer formed on at least one surface of the steel sheet, wherein the plating layer is comprised of a ZnO region present on a surface side of the plating layer and having an oxygen concentration of 10 mass % or more and an Ni—Fe—Zn alloy region present on a steel sheet side of the plating layer and having an oxygen concentration of less than 10 mass %, and an average concentration of a total of Fe, Mn and Si in the ZnO region is 5 mass % or more and 30 mass % or less.

Abstract: To improve adhesion between a plating film reducing contact electrical resistance and a copper alloy plate containing Mg. A copper alloy plate containing Mg of more than 1.2% by mass and 2% by mass or less and the balance Cu and inevitable impurities in a center portion in a plate thickness direction, in the copper alloy plate, a surface Mg concentration at a surface is 30% or less of a center Mg concentration at the center portion in the plate thickness direction, a surface layer portion having a depth from the surface to where a Mg concentration is 90% of the center Mg concentration is provided, and in the surface layer portion, the Mg concentration increases from the surface toward the center portion of the plate thickness direction with a concentration gradient of 0.2% by mass/?m or more and 50% by mass/?m or less.