Abstract: The present invention discloses a heat resistance copper alloy material characterized in that said copper alloy material comprises 0.15 to 0.33 mass percent of Co, 0.041 to 0.089 mass percent of P, 0.02 to 0.25 mass percent of Sn, 0.01 to 0.40 mass percent of Zn and the remaining mass percent of Cu and inevitable impurities, wherein each content of Co, P, Sn and Zn satisfies the relationships 2.4?([Co]?0.02)/[P]?5.2 and 0.20?[Co]+0.5[P]+0.9[Sn]+0.1[Zn]?0.54, wherein [Co], [P], [Sn] and [Zn] are said mass percents of Co, P, Sn and Zn content, respectively; and said copper alloy material is a pipe, plate, bar, wire or worked material obtained by working said pipe, plate, bar or wire material into predetermined shapes.

Abstract: An induction heat treatment method with which temperature control is enabled, condition setting is easy, and the quality of a treatment object can be stabilized includes: a data acquiring step of heating and quench-hardening a sample of the treatment object to thereby acquire process data; a storing step of storing the process data; a checking step of checking the power supply output transition data and the quenching timing data as to validity based on the temperature transition data stored in the storing step; and a mass production step of performing heat treatment of the treatment object in accordance with the power supply output transition data and the quenching timing data stored in the storing step and checked as to validity in the checking step.

Abstract: The invention provides a carburization treatment method in which the carburization treatment is conducted under a condition where an atmosphere within the furnace is maintained at a high carbon potential which is slightly blow a carbon solid solubility. Preferably, the internal pressure within the furnace is kept at 0.1 to 101 kPa, the hydrocarbon gas is one, two or more than two kinds of gases selected from the group consisting of C3H8, C3H6, C4H10, C2H2, C2H4, C2H6 and CH4, while the oxidative gas is an air, an O2 gas, or CO2 gas.

Abstract: A process for heat treating metal workpieces contains with respect to an efficient process control the following successive operations following directly one after the other: a heating phase; an enrichment phase; a first cooling phase; a bonding phase; a second cooling phase; and a concluding quenching phase. Workpieces processed by a method of this type are distinguished by a comparatively great fatigue limit and fatigue strength with simultaneous high resistance to wear and tear.

Abstract: A material for a nuclear fusion reactor of the present invention contains intermetallic compounds of beryllium with Ti, V, Zr, Nb, Ta, Mo, W or Y. The beryllium intermetallic compounds are mixed with another metal or intermetallic compound. The material is preferably applied to blankets and facing members which are exposed to neutrons and heat generated by plasma of the nuclear fusion reactor.

Abstract: A process for forming an article, such as a combustion chamber liner, comprises the steps of providing a mandrel formed from a material, such as an aluminum containing material, having a net shape of the article to be made, depositing a powdered metal material onto the mandrel without melting the powdered metal material, and removing the material forming the mandrel to leave a free standing monolithic article. In a preferred embodiment of the present invention, the powdered metal material comprises powdered GRCop-84. Alternatively, the powdered metal material may be GRCop-42.

Abstract: An element such as Cr is caused to dissolve sufficiently in a base-material metal (Cu) in a solid solution state at a high temperature and a material in a supersaturated condition is obtained by performing quenching. After that, a strain is applied to this material and this material is subjected to aging treatment at a low temperature simultaneously with or after the application of this strain. As a result of this, it is possible to obtain a copper alloy having properties desirable as an electrode material, for example, a hardness of not less than 30 HRB, an electrical conductivity of not less than 85 IACS %, and a thermal conductivity of not less than 350 W/(m·K).

Abstract: An age-hardening copper alloy made of—as expressed in each case in weight %—0.4% to a maximum of 2% cobalt which is partially replaceable by nickel, 0.1% through 0.5% beryllium, optionally 0.03% through 0.5% zirconium, 0.005% through 0.1% magnesium and possibly a maximum of 0.15% of at least one element from the group including niobium, manganese, tantalum, vanadium, titanium, chromium, cerium and hafnium. The remainder is copper inclusive of production-conditioned impurities and usual processing additives. This copper alloy is used as the material for producing casting molds, in particular for the sleeves of continuous casting rolls as components of a two-roll casting installation.

Abstract: This aims to provide a wear-resistant copper-based alloy, which is advantages in not only enhancing wear resistance in a high temperature range but also enhancing crack resistance and machinability and which is especially suitable for forming a cladding layer. The wear-resistant copper-based alloy comprises, by weight, 4.7 to 22.0% nickel, 0.5 to 5.0% silicon, 2.7 to 22.0% iron, 1.0 to 15.0% chromium, 0.01 to 2.00% cobalt, 2.7 to 22.0% one or more of tantalum, titanium, zirconium and hafnium, and the balance of copper with inevitable impurities.

Abstract: Provided is a first copper alloy sputtering target comprising 0.5 to 4.0 wt % of Al and 0.5 wtppm or less of Si; a second copper alloy sputtering target comprising 0.5 to 4.0 wt % of Sn and 0.5 wtppm or less of Mn; the first or the second alloy sputtering target further comprising one or more selected from among Sb, Zr, Ti, Cr, Ag, Au, Cd, In and As in a total amount of 1.0 wtppm or less; and a semiconductor element wiring formed by the use of the above target. The above copper alloy sputtering target allows the formation of a wiring material for a semiconductor element, in particular, a seed layer being stable, uniform and free from the occurrence of coagulation during electrolytic copper plating and exhibits excellent sputtering film formation characteristics.

Abstract: The invention relates to a production method for producing, on a production installation (1), flat products, also of a large width, from continuously cast slabs having a large or medium thickness or from thin slabs. Said production installation is comprised of a single or multiple stand blooming train (4), of a roller table (3), which is provided for conveying the rolling stock and, optionally for oscillating, of a roller table section (5) with hinged heat-insulating covering hoods. The production installation is also comprised of a straightening unit (6) for straightening the pre-strips, of an, in particular, inductive heating installation (7) for effecting the controlled heating of the pre-strips to a defined temperature over the length and width of the pre-strips, of a multiple-stand finishing train (10), of a delivery roller table with devices (11) for cooling the hot rolled strip, and of subsequently arranged coiling machines (12) for coiling the finished strip.

Abstract: A lead-free solder includes at least one selected from 0.01 to 1% by weight of Co, 0.01 to 0.2% by weight of Fe, 0.01 to 0.2% by weight of Mn, 0.01 to 0.2% by weight of Cr, and 0.01 to 2% by weight of Pd; 0.5 to 2% by weight of Cu; and 90.5% by weight or more of Sn. This solder exhibits a satisfactory solderability in solder joints and shows a high resistance to electrode leaching upon soldering or when the resulting soldered article is left at high temperatures.

Abstract: This copper alloy contains at least zirconium in an amount of not less than 0.005% by weight and not greater than 0.5% by weight, includes a first grain group including grains having a grain size of not greater than 1.5 ?m, a second grain group including grains having a grain size of greater than 1.5 ?m and less than 7 ?m, the grains having a form which is elongated in one direction, and a third grain group including grains having a grain size of not less than 7 ?m, and also the sum of ? and ? is greater than ?, and ? is less than ?, where ? is a total area ratio of the first grain group, ? is a total area ratio of the second grain group, and ? is a total area ratio of the third grain group, based on a unit area, and ?+?+?=1.

Abstract: Provided is a hafnium alloy target containing either or both of Zr and Ti in a gross amount of 100 wtppm-10 wt % in Hf, wherein the average crystal grain size is 1-100 ?m, the impurities of Fe, Cr and Ni are respectively 1 wtppm or less, and the habit plane ratio of the plane {002} and three planes {103}, {014} and {015} lying within 35° from {002} is 55% or greater, and the variation in the total sum of the intensity ratios of these four planes depending on locations is 20% or less. As a result, obtained is a hafnium alloy target having favorable deposition property and deposition speed, which generates few particles, and which is suitable for forming a high dielectric gate insulation film such as HfO or HfON film, and the manufacturing method thereof.

Abstract: A die castable magnesium based alloy comprising, by weight, between about 3 and 10% aluminum, between about 0.5 and 2.5% calcium, up to about 1.5% silicon, up to about 0.7% zinc, and the remainder being magnesium. The alloy has been found to exhibit more favorable castability and creep resistance than comparative magnesium based alloys.

Abstract: There are provided an intermetallic-compound superconductor that is high in superconducting transition temperature, and an alloy superconductor that is high in superconducting transition temperature and excels in malleability and ductility, as well as a method of making such a superconductor with good reproducibility and at a low cost of manufacture. This entirely new intermetallic compound superconductor is made of magnesium (Mg) and beryllium (Be) and has a chemical composition expressed by formula: Mg1Be2, has a hexagonal AlB2 type crystallographic structure and has a superconducting transition temperature (Tc) of 35 K. An alloy containing this intermetallic compound excels in malleability and ductility and constitutes the alloy superconductor having a superconducting transition temperature (Tc) of 35 K and being low in specific resistance for normal conduction at a temperature ranging from the superconducting transition temperature to a room temperature.

Abstract: A thermally conductive, wear-resistant alloy is particularly suited to cladding aluminum engine head valve seats. In the preferred embodiments, the alloys are metallurgically compatible with the cast Al—Si alloy used for the engine head. Three alternative embodiments are disclosed, namely, copper-based alloys; aluminum silicon-based alloys; and two-layer systems.

Abstract: High purity tantalum metals and alloys containing the same are described. The tantalum metal preferably has a purity of at least 99.995% and more preferably at least 99.999%. In addition, tantalum metal and alloys thereof are described, which either have a grain size of about 50 microns or less, or a texture in which a (100) intensity within any 5% increment of thickness is less than about 15 random, or an incremental log ratio of (111):(100) intensity of greater than about ?4.0, or any combination of these properties. Also described are articles and components made from the tantalum metal which include, but are not limited to, sputtering targets, capacitor cans, resistive film layers, wire, and the like. Also disclosed is a process for making the high purity metal which includes the step of reacting a salt-containing tantalum with at least one compound capable of reducing this salt to tantalum powder and a second salt in a reaction container.

Abstract: Lead-free solder balls having a good surface appearance with no appreciable surface defects such as seams and shrinkage cavities comprises an alloy having a composition consisting essentially of about 4.0% to about 6.0% by weight of Ag, about 1.0% to about 2.0% by weight of Cu, and a balance of Sn, and they have a diameter of from 0.05 mm to 1.0 mm. The solder balls can be produced by forming a molten alloy having the above-described composition into solidified balls having a diameter of from 0.05 mm to 1.0 mm using the surface tension of the molten alloy.

Abstract: A lead-free solder includes at least one selected from 0.01 to 1% by weight of Co, 0.01 to 0.2% by weight of Fe, 0.01 to 0.2% by weight of Mn, 0.01 to 0.2% by weight of Cr, and 0.01 to 2% by weight of Pd; 0.5 to 2% by weight of Cu; and 90.5% by weight or more of Sn. This solder exhibits a satisfactory solderability in solder joints and shows a high resistance to electrode leaching upon soldering or when the resulting soldered article is left at high temperatures.