Abstract: Provided is a copper alloy sputtering target containing 0.01 to (less than) 0.5 wt % of at least 1 element selected from Al or Sn, and containing Mn or Si in a total amount of 0.25 wtppm or less. The above copper alloy sputtering target allows the formation of a wiring material for a semiconductor element, in particular, a seed layer being stable, uniform and free from the occurrence of coagulation during electrolytic copper plating and exhibits excellent sputtering film formation characteristics. A semiconductor element wiring formed with this target is also provided.
Abstract: The present invention relates to a nanocrystalline metallic material, particularly to nano-twin copper material with ultrahigh strength and high electrical conductivity and its preparation method. High-purity polycrystalline Cu material with a microstructure of roughly equiaxed submicron-sized grains (300-1000 nm) has been produced by pulsed electrodeposition technique, by which high density of growth-in twins with nano-scale twin spacing were induced in the grains. Inside each grain, there are high densities of growth-in twin lamellae. The twin lamellae with the same orientations are inter-parallel, and the twin spacing ranges from several nanometers to 100 nm with a length of 100-500 nm. This Cu material invented has more excellent performance than existing ones.
Type:
Grant
Filed:
October 16, 2003
Date of Patent:
June 15, 2010
Assignee:
Institute of Metal Research Chinese Academy of Sciences
Abstract: Raw materials for a copper alloy are melted in a high frequency smelter and cast, and milling, rolling, and annealing are carried out. Then, rolling is again carried out. Thereafter, the materials are heated at a temperature of 900° C. for one minute and are quenched in water, to be solution treated. Subsequently, the materials are heated at a temperature of 500° C. for five hours for aging, and then are cooled at a cooling rate in a range of 10 to 50° C. per hour until the materials are cooled to a temperature of 380° C.
Type:
Grant
Filed:
July 16, 2008
Date of Patent:
June 1, 2010
Assignees:
Mitsubishi Denki Kabushiki Kaisha, Mitsubishi Electric Metecs Co., Ltd.
Abstract: A copper alloy suitable for an IC lead pin for a pin grid array provided on a plastic substrate, which copper alloy is a Cu—Zn—Mg alloy, a Cu—Sn alloy, a Cu—SN—Ag alloy, a Cu—Fe—Zn—P alloy, or a Cu—Cr alloy, each having a given alloy composition, in which the copper alloy has conductivity of 50% IACS or more and tensile stress of 400 MPa to 650 MPa.
Abstract: A composite material having a high thermal conductivity and a small thermal expansion coefficient, which is obtained by impregnating a porous graphitized extrudate with a metal; the composite material having such anisotropy that the thermal conductivity and the thermal expansion coefficient are 250 W/mK or more and less than 4×10?6/K, respectively, in an extrusion direction; and that the thermal conductivity and the thermal expansion coefficient are 150 W/mK or more and 10×10?6/K or less, respectively, in a direction perpendicular to the extrusion direction.
Abstract: A refractory composition is described, containing niobium, silicon, titanium, and at least one of rhenium and ruthenium. The amount of silicon in the composition is at least about 9 atom %, and the amount of titanium present is less than about 26 atom %, based on total atomic percent. Turbine engine components formed from such a composition are also disclosed.
Type:
Grant
Filed:
July 26, 2005
Date of Patent:
April 27, 2010
Assignee:
General Electric Company
Inventors:
Bernard Patrick Bewlay, Laurent Cretegny, Pazhayannur Ramanathan Subramanian, Melvin Robert Jackson
Abstract: Disclosed is an improved low alloy high speed tool steel, which exhibits constant toughness with small dispersion of the properties after heat treatment and regardless of the size of the products. The steel consists essentially of, by weight %, C: 0.50-0.75%, Si: 0.02-2.00%, Mn: 0.1-3.0%, P: up to 0.050%, S: up to 0.010%, Cr: 5.0-6.0%, W: 0.5-2.0%, V: 0.70-1.25%, Al: up to 0.1%, O: up to 0.01% and N: up to 0.04% and the balance of Fe. In the steel [Mo+0.5W](Mo-eq.) is 2.5-5.0%, [Mo-eq.]/V is 2-4. In the annealed state the steel contains carbides of the types of MC+M6C and/or M23C6(M7C3), and after quenching from a temperature of 1100-1200° C. it contains substantially no remaining carbide or, even contains, almost all the carbides are of MC.
Abstract: A copper-based alloy that has the soundness of alloy enhanced by restraining the concentrated occurrence of microporosities while suppressing the lead content and an ingot and a liquid-contacting part using the alloy are provided. The copper-based alloy has the soundness of alloy improved during the course of solidification of the copper-based alloy by crystallizing an intermetallic compound capable of solidifying at a temperature exceeding a solidus line in dendritic gaps of the alloy, suppressing migration of a solute, thereby allowing dispersion of microporosities, utilizing crystallization of the intermetallic compound as well for effecting dispersed crystallization of a low melting metal or a low melting intermetallic compound capable of solidifying at a temperature falling short of a liquidus line, and relying on the low melting metal or low melting intermetallic compound to enter the microporosities and suppress occurrence of microporosities.
Abstract: Disclosed is a high-strength hot-rolled steel sheet containing C in a range of 0.03 to 0.15 mass %, Mn in a range of 0.5 to 2 mass %, and Al in a range of 0.01 to 0.1 mass %, respectively, while controlling S to not more than 0.02 mass % (0% included), wherein the metallic structure thereof has a polygonal ferrite as the main phase, and contains martensite as a second phase, further containing P in a range of 0.030 to 0.08 mass %, and Cr in a range of 0.3 to 1.00 mass %, respectively, while controlling Si to not more than 0.1 mass % (0% included). Thus, a high-strength hot-rolled steel sheet superior in workability, and fatigue property, and excellent in surface quality is provided at a relatively low cost.
Abstract: A lead-free solder alloy suitable for use in flow soldering of electronic components to printed wiring boards comprises 0.1-3 wt % of Cu, 0.001-0.1 wt % of P, optionally 0.001-0.1 wt % of Ge, and a balance of Sn. The solder alloy may further contain at least one element of Ag and Sb in a total amount of at most 4 wt %, and/or at least one element of Ni, Co, Fe, Mn, Cr, and Mo in a total amount of at most 0.5 wt % in order to strengthen the alloy, and/or at least one element of Bi, In, and Zn in a total amount of at most 5 wt % in order to lower the melting point of the alloy.
Abstract: A magnesium-based alloy consists of 1.5-4.0% by weight rare earth element(s), 0.3-0.8% by weight zinc, 0.02-0.1% by weight aluminum, and 4-25 ppm beryllium. The alloy optionally contains up to 0.2% by weight zirconium, 0.3% by weight manganese, 0.5% by weight yttrium and 0.1% by weight calcium. The remainder of the alloy is magnesium except for incidental impurities.
Type:
Grant
Filed:
April 4, 2006
Date of Patent:
March 23, 2010
Assignee:
Cast Centre Pty Ltd
Inventors:
Colleen Joyce Bettles, Mark Antony Gibson
Abstract: The present invention: provides a good-workability and high-strength cold-rolled steel sheet excellent in post-painting corrosion resistance to the extent of securing excellent resistance to salt warm water immersion which is a good-workability and high-strength cold-rolled steel sheet excellent in post-painting corrosion resistance characterized in that: said steel sheet contains, in mass, 0.16 to 0.19% C, 1.10 to 1.30% Si, 1.50 to 1.60% Mn, not more than 0.1% P and 0.015 to 0.050% Al, with the balance consisting of Fe and unavoidable impurities; the average of the amount of Si incrassating on the surface of said steel sheet is not more than 20 times the Si concentration in said steel sheet; and the area percentage of the portions where the ratio of the Si concentration on the surface of said steel sheet to the Si concentration in said steel sheet is not less than 10 is not more than 95%.
Type:
Grant
Filed:
December 9, 2003
Date of Patent:
March 16, 2010
Assignees:
Nippon Steel Corporation, Honda Motor Co., Ltd.
Abstract: Disclosed is a non-heat treated steel for hot forging, particularly suitable for producing connecting rods of automobile engines. The steel consists essentially of: by weight, C: 0.3-0.8%, Si: 0.1-2.0%, Mn: 0.3-1.5%, P: 0.01-0.15%, Cr: 0-1.0%, V: 0-0.4%, Al: 0-0.05%, N: 0.005-0.03% and the balance being Fe and inevitable impurities, provided that the contents of C, Mn and Cr fulfill the following condition: 1.40[C %]+0.28[Mn %]+0.50[Cr %]?0.75 Pearlite area fraction in this steel after hot forging is 50% or more. Notches are provided with laser beam on an intermediate part at the location from which fracture starts, and load is applied. Then, the intermediate is split to be two components (big end or cap and small end/rod for connecting rod). The components are adhered to form the parts.
Type:
Grant
Filed:
March 20, 2002
Date of Patent:
March 2, 2010
Assignees:
Daido Steel Co., Ltd., Nissan Motor Co., Ltd.
Abstract: A steel product for a line pipe according to the invention has a composition containing, in mass %, C : 0.03% to 0.15%, Si: 0.05% to 1.0%, Mn: 0.5% to 1.8%, P: 0.015% or less, S: 0.004% or less, O: 0.01% or less, N: 0.007% or less, sol. Al: 0.01% to 0.1%, Ti: 0.024% or less, Ca: 0.0003% to 0.02%, and the balance consisting of Fe and impurities. The size of TiN in the steel product for a line pipe is at most 30 ?m. The steel product has high HIC resistance and its crack area ratio can be reduced to 3% or less.
Abstract: A high-strength, high conductivity copper alloy wire that is excellent in resistance to stress relaxation, which contains 1.0 to 4.5% by mass of Ni, 0.2 to 1.1% by mass of Si, 0.05 to 1.5% by mass of Sn, and less than 0.005% (including zero) by mass of S, with the balance being Cu and inevitable impurities, wherein the wire has a conductivity of from 20% to 60% IACS and a tensile strength of from 700 to 1,300 MPa, and a method of producing the same.
Abstract: An exemplary magnesium alloy includes: by weight, magnesium as a main ingredient, aluminum in an amount from 7.5% to 7.8%, zinc in an amount from 0.35% to 1.0%, manganese in an amount from 0.15% to 0.5%, silicon less than 0.1%, copper less than 0.03%, iron less than 0.005%, and nickel less than 0.002%. The present invention also provides a thin workpiece made of the magnesium alloy.
Abstract: The present invention provides a phase change non-volatile memory material comprising a base material and at least one non-metallic light element selected from the group consisting of boron, carbon, nitrogen and oxygen, wherein the base material has a composition which corresponds to either that of congruent melting of the type with a minimum melting point or that of eutectic melting within the range of ±0.15 atomic fraction for each constituent element, thereby having a melting temperature of 600° C. or lower. The phase change non-volatile memory material according to the present invention may be utilized to reduce the electric power needed for reset/set operation and thermal interference between memory cells.
Type:
Grant
Filed:
April 25, 2006
Date of Patent:
December 15, 2009
Assignee:
Korea Institute of Science and Technology
Inventors:
Byung-ki Cheong, Jeung-hyun Jeong, Dae-Hwan Kang, Han Ju Jung, Taek Sung Lee, In Ho Kim, Won Mok Kim, Kyeong Seok Lee
Abstract: A lead-free free-cutting copper-antimony alloy comprises in percentage by weight: 55 to 65% Cu, 0.3 to 2.0% Sb, 0.2 to 1.0% Mn, at least two elements selected from the group of Ti, Ni, B, Fe, Se, Mg, Si, Sn, P and rare-earth metal in amount of 0.1-1.0%, as well as balance Zn and unavoidable impurities. The brass alloys according to the present invention possess superior cutting property, weldability, corrosion resistance, dezincification resistance and high-temperature-oxidation resistance, and are suitable for use in drinking-water installations, domestic appliances, toy for children, fastener, etc. The process for producing such alloys is also proposed.
Type:
Grant
Filed:
June 11, 2004
Date of Patent:
December 8, 2009
Assignee:
Ningbo Powerway Alloy Material Co., Ltd.
Abstract: A beryllium copper alloy is provided, having a thickness “t” in a range from 0.05 mm to 0.5 mm and having an alloy composition consisting by weight (or mass %), of Cu100?(a+b)NiaBeb, wherein 1.0?a?2.0, 0.15?b?0.35, and 5.5 ?a/b?6.5. The beryllium copper alloy also exhibits a 0.2% proof stress equal to or above 650 MPa, an electric conductivity equal to or above 70% IACS, and a bending formability defined by a ratio of R/t=0, wherein “R” is a maximum bend radius before cracking at a bent portion when the beryllium copper alloy is bent into a V shape at a right angle.
Abstract: A powder metallurgy cold-work tool steel article of hot isostatic compacted nitrogen atomized, prealloyed powder. The alloy of the article includes the addition of niobium, which combined with the use of gas atomization, results in a fine carbide size distribution. This in turn results in improved bend fracture strength and impact toughness. In addition, as a result of isostatic compaction of nitrogen gas atomized prealloyed powder a fine distribution of carbides results to obtain a microstructure that achieves both improved toughness and wear resistance.
Type:
Grant
Filed:
September 29, 2006
Date of Patent:
November 10, 2009
Assignee:
Crucible Materials Corporation
Inventors:
Alojz Kajinic, Andrzej L. Wojcieszynski