Abstract: The invention pertains to semiconductor memories, and more particularly to enhancing the reliability of stacked memory devices. Apparatuses and methods are described for implementing RAID-style error correction to increase the reliability of the stacked memory devices.

Abstract: A method includes applying erase voltages to data lines and source lines of a memory block of memory cells in a non-volatile NAND architecture memory device during an erase operation. The memory block of memory cells includes a plurality of memory segments and a corresponding plurality of first select gate control lines. Each memory segment includes a plurality of memory sub-blocks that share a respective one of the first select gate control lines. The method includes applying a first bias voltage to the respective first select gate control line of a first one of the memory segments that has failed an erase verify operation to facilitate erasing the first memory segment during the erase operation, and applying a second bias voltage different from the first bias voltage to the respective first select gate control line of a second one of the memory segments that has passed the erase verify operation to facilitate inhibiting erasing of the second memory segment during the erase operation.

Abstract: A data recorder for permanently storing pre-event data may include a read-write memory with a plurality of bit cells in the read-write memory. Each bit cell may have a bit state of a high value or a low value. A fusible structure in the data recorder may include a morphable element associated with each bit cell. A temperature-triggered module may thermally couple to the ambient environment and may electrically couple to each morphable element. The temperature-triggered module may be further configured to determine if a parameter of the ambient environment exceeds a predetermined threshold, and if so may then transmit a burn signal to the fusible structure so that each morphable element permanently secures the bit state for each bit cell.

Abstract: Apparatus and methods are disclosed, including a method that raises an electrical potential of a plurality of access lines to a raised electrical potential, where each access line is associated with a respective charge storage device of a string of charge storage devices. The electrical potential of a selected one of the access lines is lowered, and a data state of the charge storage device associated with the selected access line is sensed while the electrical potential of the selected access line is being lowered. Additional apparatus and methods are described.

Abstract: A semiconductor device may include a power control signal generator and a sense amplifier circuit. The power control signal generator may generate a first power control signal, an enablement moment of the first power control signal controlled according to a logic level combination of temperature code signals in response to a mode signal. The sense amplifier circuit may generate a first power signal driven in response to the first power control signal and may generate a second power signal driven in response to a second power control signal. The sense amplifier circuit may sense and amplify a level of a bit line using the first power signal and the second power signal.

Abstract: A dynamic random access memory device includes a plurality of memory subblocks. Each subblock has a plurality of wordlines whereto a plurality of data store cells are connected. Partial array self-refresh (PASR) configuration settings are independently made. In accordance with the PASR settings, the memory subblocks are addressed for refreshing. The PASR settings are made by a memory controller. Any kind of combinations of subblock addresses may be selected. Thus, the memory subblocks are fully independently refreshed. User selectable memory arrays for data retention provide effective memory control programming especially for low power mobile application.

Abstract: A row decoder for a non-volatile memory device includes an input and pre-decoding module that receives address signals and generates pre-decoded address signals. A decoding module receives the pre-decoded address signals for generation on an output of decoded address signals. A driving module generates biasing signals for biasing wordlines of a memory array. The decoding module envisages a plurality of decoding stages, each of which carries out an operation of an OR logic combination between a first and a second predecoded address signal to be combined. The decoding module includes at least one first pass transistor for selectively transferring onto the output the one between the first and second predecoded address signals to be combined in a first operating condition. The decoding module includes at least one first pull-up transistor to selectively bring the output to a high state in at least one second operating condition.

Abstract: Methods of operating a memory include determining indications of programming voltages sufficient to program respective groups of memory cells of a plurality of groups of memory cells to a particular range of threshold voltages, applying a stepped programming pulse to a selected access line connected to each memory cell of the plurality of groups of memory cells, and enabling each group of memory cells for programming when a voltage level of the stepped programming pulse corresponds to the respective indication of the programming voltage sufficient to program that group of memory cells to the particular range of threshold voltages.

Abstract: A first data input circuit receives test data from a first pad to generate first input control data for generating cell input data stored in a memory cell array during a first operation period. A first data output circuit receives first output control data generated from cell output data outputted from the memory cell array to output the first output control data to an internal node coupled to a second pad during a second operation period.

Abstract: A nonvolatile memory device may include a plurality of cell strings including a plurality of memory cells serially coupled to one another; a plurality of bit lines coupled to a corresponding cell string of the plurality of cell strings; a plurality of page buffers each including a plurality of latches and coupled to a corresponding bit line of the plurality of bit lines; a first control circuit suitable for controlling the plurality of latches to perform an operation corresponding to an activated command signal of a plurality of command signals in an access operation; and a second control circuit suitable for activating one or more of the plurality of command signals, while controlling operations of the plurality of cell strings and the plurality of bit lines in the access operation.

Abstract: A method of testing a semiconductor integrated circuit including a one-time programmable (OTP) memory device is provided. A program command is transferred from a tester to the OTP memory device. Programming and a programming verification are performed with respect to OTP memory cells in the OTP memory device in response to the program command. The OTP device generates accumulated verification result signal by accumulating program verification results with respect to the OTP memory cells. The accumulated verification result signal is transferred from the OTP memory device to the tester.

Abstract: According to one embodiment, a semiconductor memory system includes a substrate, a plurality of elements and an adhesive portion. The substrate has a multilayer structure in which wiring patterns are formed, and has a substantially rectangle shape in a planar view. The elements are provided and arranged along the long-side direction of a surface layer side of the substrate. The adhesive portion is filled in a gap between the elements and in a gap between the elements and the substrate, where surfaces of the elements are exposed.

Abstract: A device is disclosed that includes memory cells, a reference circuit, and a sensing unit. Each of the memory cells is configured to store bit data. The reference circuit includes reference switches and reference storage units. The reference switches are disposed. A first reference storage unit of the reference storage units is configured to generate a first signal having a first logic state when a first reference switch the reference switches is turned on. A second reference storage unit of the reference storage units is configured to generate a second signal having a second logic state when a second reference switch of the reference switches is turned on. The sensing unit is configured to determine a logic state of the bit data of one of the memory cells according to the first signal and the second signal.

Abstract: The present disclosure relates to reference and sense architecture in a cross-point memory. An apparatus may include a memory controller configured to select a target memory cell for a memory access operation. The memory controller includes word line (WL) switch circuitry configured to select a global WL (GWL) and a local WL (LWL) associated with the target memory cell; bit line (BL) switch circuitry configured to select a global BL (GBL) and a local BL (LBL) associated with the target memory cell; and sense circuitry including a first sense circuitry capacitance and a second sense circuitry capacitance, the sense circuitry configured to precharge the selected GWL, the LWL and the first sense circuitry capacitance to a WL bias voltage WLVDM, produce a reference voltage (VREF) utilizing charge on the selected GWL and charge on the first sense circuitry capacitance and determine a state of the target memory cell based, at least in part, on VREF and a detected memory cell voltage VLWL.

Abstract: A data writing method for a solid state storage device includes following steps. A step (a) is performed to judge whether a shutdown command is issued from a host. In a step (b), if the solid state storage device confirms that the shutdown command is not issued from the host, plural program procedures are performed. Consequently, plural write data in a buffer are stored to a triple-level cell flash memory according to a program order. In a step (c), if the solid state storage device confirms that the shutdown command is issued from the host, plural redundant data are added to the plural write data, the write data are stored into the buffer, and the plural program procedures are performed. Consequently, the plural write data in the buffer are stored to the triple-level cell flash memory according to the program order.

Abstract: A non-volatile memory apparatus includes a non-volatile storage circuit and a controller. The non-volatile storage circuit reads a corresponding data voltage set, and converts the corresponding data voltage set to the corresponding data in accordance with the read-voltage parameter of the controller. The controller decides whether to perform the on-the-fly self-adaptive read-voltage adjustment in accordance with the number of error bits of the corresponding data.

Abstract: The disclosed technology generally relates to apparatuses and methods of operating the same, and more particularly to cross point memory arrays and methods of accessing memory cells in a cross point memory array. In one aspect, an apparatus comprises a memory array. The apparatus further comprises a memory controller configured to cause an access operation, where the access operation includes application of a first bias across a memory cell of the memory array for a selection phase of the access operation and application of a second bias, lower in magnitude than the first bias, across the memory cell for an access phase of the access operation. The memory controller is further configured to cause a direction of current flowing through the memory cell to be reversed between the selection phase and the access phase.

Abstract: An integrated circuit can include multiple SRAM cells, each including at least two pull-up transistors, at least two pull-down transistors, and at least two pass-gate transistors, each of the transistors having a gate; at least one of the pull-up transistors, the pull-down transistors, or the pass-gate transistors having a screening region a distance below the gate and separated from the gate by a semiconductor layer, the screening region having a concentration of screening region dopants, the concentration of screening region dopants being higher than a concentration of dopants in the semiconductor layer, the screening region providing an enhanced body coefficient for the pull-down transistors and the pass-gate transistors to increase the read static noise margin for the SRAM cell when a bias voltage is applied to the screening region; and a bias voltage network operable to apply one or more bias voltages to the multiple SRAM cells.

Abstract: A semiconductor memory device may include: a plurality of memory mats; and a plurality of sense amplifier arrays arranged alternately with the memory mats, each sense amplifier array being suitable for sensing and amplifying data of memory mats adjacent thereto, wherein during a data sensing operation to a memory mat among the plurality of memory mats, in addition to a sense amplifier for the memory mat and sense amplifiers positioned immediately above and below the sense amplifier for the memory mat, at least one additional sense amplifier closest to the sense amplifier for the memory mat is also activated for providing additional amplification.

Abstract: A nonvolatile memory (NVM) cell includes a selection transistor configured to have a selection gate terminal coupled to a word line and a source terminal coupled to a source line, a cell transistor configured to have a floating gate electrically isolated, a drain terminal coupled to a bit line and sharing a junction terminal with the selection transistor, a first coupling capacitor disposed in a first connection line coupled between the word line and the floating gate, and a P-N diode and a second coupling capacitor disposed in series in a second connection line coupled between the word line and the floating gate. An anode and a cathode of the P-N diode are coupled to the second coupling capacitor and the word line, respectively. The first and second connection lines are coupled in parallel between the word line and the floating gate.