Patents Examined by Son T Le
  • Patent number: 11754645
    Abstract: A magnetic sensor of the present invention has an elongate element portion having a magnetoresistive effect and a pair of elongate soft magnetic bodies that are arranged along the element portion on both sides of the element portion with regard to a short axis thereof. Each soft magnetic body includes a central portion that is adjacent to the element portion from one end to another end of the element portion with regard to a long axis direction thereof and a pair of end portions that protrude from the central portion in the long axis direction. A width of at least one of the end portions gradually decreases in a direction away from the central portion in at least a part of the end portions in the long axis direction thereof.
    Type: Grant
    Filed: December 22, 2021
    Date of Patent: September 12, 2023
    Assignee: TDK Corporation
    Inventor: Kazuya Watanabe
  • Patent number: 11747387
    Abstract: A computer implemented method, a fault detection and management system and a computer program product for managing an open circuit fault on an overhead line in a power network, are provided, that include obtaining overhead line data from a sensor mounted on the overhead line, determining fault detection parameters associated with one or more nodes of the overhead line on occurrence of a predefined node condition, that is, a low voltage and a negative rate of change of line current at the one or more nodes, and generating an output based on the fault detection parameters, wherein the output indicates potential presence of an open circuit at one or more nodes.
    Type: Grant
    Filed: February 22, 2022
    Date of Patent: September 5, 2023
    Inventors: Shibu Jolly, Mayur Mahambrey, Vengatasubramanian Muthuraman, Vivek Sharma
  • Patent number: 11747389
    Abstract: The application relates to a device and method for measuring a high electron mobility transistor. The device provided includes a controller, a protection circuit, a load circuit and a switching circuit electrically connected between the load circuit and the protection circuit. The controller is configured to provide a first control signal having a first value to a semiconductor component at a first time point and provide a second control signal having a second value to the switching circuit at a second time point. The semiconductor component is turned on by the first value of the first control signal, and the switching circuit is turned on by the second value of the second control signal. The second time point is later than the first time point.
    Type: Grant
    Filed: February 24, 2020
    Date of Patent: September 5, 2023
    Assignee: INNOSCIENCE (ZHUHAI) TECHNOLOGY CO., LTD.
    Inventors: Yulin Chen, Chunhua Zhou, Sichao Li, Wenjie Lin, Tao Zhang
  • Patent number: 11747390
    Abstract: The subject application provides an apparatus and method for measuring dynamic on-resistance of a device under test (DUT) comprising a control terminal electrically connected to an output of a first controlling module being configured to generate a first control signal to switch on and off the DUT. The apparatus comprises a switching device and a second controlling module configured to: receive the first control signal from the first controlling module and generate a second control signal to switch on and off the switching device such that the switching device is turned on later than the DUT for a first time interval and turned off earlier than the DUT for a second time interval.
    Type: Grant
    Filed: January 15, 2021
    Date of Patent: September 5, 2023
    Assignee: INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
    Inventors: Rong Yang, Sichao Li, Chunhua Zhou, Donghua Bai
  • Patent number: 11747130
    Abstract: An inductive angle sensor includes a stator component and a rotor component that is rotatable relative thereto about an axis of rotation. The rotor component has an inductive target with k-fold symmetry. The stator component has a first single pickup coil with k-fold symmetry and a second single pickup coil with the same k-fold symmetry. The first single pickup coil is rotated around the axis of rotation in relation to the second single pickup coil. The inductive target is stretched along a first axis that runs perpendicularly to the axis of rotation so that a contour outline, as seen in plan view, of the inductive target has an elliptical shape, and the first single pickup coil is stretched along a second axis that runs perpendicularly to the axis of rotation so that a contour outline, as seen in plan view, of the first single pickup coil has an elliptical shape.
    Type: Grant
    Filed: May 27, 2021
    Date of Patent: September 5, 2023
    Assignee: Infineon Technologies AG
    Inventor: Udo Ausserlechner
  • Patent number: 11742259
    Abstract: Various circuit board embodiments are disclosed. In one aspect, an apparatus is provided that includes a circuit board and a first phase change material pocket positioned on or in the circuit board and contacting a surface of the circuit board.
    Type: Grant
    Filed: June 21, 2021
    Date of Patent: August 29, 2023
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventors: Manish Arora, Nuwan Jayasena
  • Patent number: 11739746
    Abstract: A mounting pocket is provided for attaching a monitoring device to a pump bearing frame. The mounting pocket includes a recessed area located on an external side of the pump bearing frame, a flat surface within the recessed area; and at least four threaded mounting holes extending into the flat surface. At least a part of the drive bearing portion has a reduced radial wall thickness adjacent the flat surface. The threaded mounting holes are configured to receive threaded bolts from the monitoring device to secure the flat surface against a rear surface of the monitoring device. The flat surface is configured to transfer at least one of vibration or thermal energy from the pump bearing frame through the flat surface to the monitoring device.
    Type: Grant
    Filed: September 15, 2021
    Date of Patent: August 29, 2023
    Assignee: CORNELL PUMP COMPANY LLC
    Inventors: Adam Lindeman, Erick Johnson, Colin O'Callaghan, Andrew Enterline
  • Patent number: 11736062
    Abstract: A method including: acquiring present operating state data of a photovoltaic array, wherein the photovoltaic array includes at least two photovoltaic strings in parallel, and the present operating state data includes present output current values of the photovoltaic strings and present irradiances corresponding to the photovoltaic strings. Determining present characteristic parameters of the photovoltaic array based on the present operating state data, wherein the present characteristic parameters include a present characteristic current value, a present current discrete rate and the present irradiances; and determining an operating state of the photovoltaic array by comparing the present characteristic parameters with standard characteristic parameters of the photovoltaic array.
    Type: Grant
    Filed: March 11, 2021
    Date of Patent: August 22, 2023
    Assignees: ENVISION DIGITAL INTERNATIONAL PTE. LTD., SHANGHAI ENVISION DIGITAL CO., LTD.
    Inventors: Jinlin Yang, Jing Chang, Jie Sun, Kang Jian, Zhousheng Li, Huirong Jiang
  • Patent number: 11733318
    Abstract: A sensor package comprises a non-conductive substrate, at least two electrically conductive coils located at a first side of the non-conductive substrate, an evaluation circuit located at a second side of the non-conductive substrate opposing the first side of the non-conductive substrate and conductive connections between the at least two electrically conductive coils and the evaluation circuit.
    Type: Grant
    Filed: January 22, 2019
    Date of Patent: August 22, 2023
    Assignee: MELEXIS TECHNOLOGIES SA
    Inventors: Vincent Hiligsmann, Wolfram Kluge, David Ihle, Jian Chen, Jorg Rudiger, Sascha Beyer
  • Patent number: 11733282
    Abstract: A probe for non-intrusively detecting imperfections in a test object made from metallic, non-conductive, and/or composite materials. The probe may include a capacitive measuring apparatus that includes at least two coplanar electrodes, an adjustment device to adjust a spatial separation between the electrodes, and a separation device. The separation device may maintain a substantially constant distance between the at least two coplanar electrodes and the test object during test measurements.
    Type: Grant
    Filed: May 24, 2022
    Date of Patent: August 22, 2023
    Assignee: AIRBUS HELICOPTERS
    Inventors: Laurent Bianchi, Sebastien Bernier, John Enderby, Mark Bowes, Dawood Parker
  • Patent number: 11730416
    Abstract: A processing method using an electrocardiogram signal includes (a) selecting a candidate for an abnormal R-peak from the electrocardiogram signal, (b) determining an abnormal R-peak from among the candidates selected in (a), and (c) excluding the abnormal R-peak determined in (b) among all the R-peaks from the electrocardiogram signal.
    Type: Grant
    Filed: February 17, 2021
    Date of Patent: August 22, 2023
    Assignee: ATSENS CO., LTD.
    Inventors: Kab Mun Cha, Jong Ook Jeong
  • Patent number: 11733279
    Abstract: The present application discloses a circuit and a method for detecting insulation resistance. The circuit includes: a first voltage dividing module, a second voltage dividing module, a third voltage dividing module, a fourth voltage dividing module, a first switch module, a fifth voltage dividing module, a second switch module, a third switch module, and a detecting module, where the first voltage dividing module comprises a first voltage dividing unit and a second voltage dividing unit, and the third voltage dividing module comprises a third voltage dividing unit and a fourth voltage dividing unit. According to the embodiments of the present application, errors caused by fluctuations in the pull-up of the reference power supply can be avoided, and the accuracy of the circuit for detecting insulation resistance can be effectively improved.
    Type: Grant
    Filed: December 31, 2021
    Date of Patent: August 22, 2023
    Assignee: Contemporary Amperex Technology Co., Limited
    Inventors: Yanhui Fu, Le Chu
  • Patent number: 11719857
    Abstract: A reanalysis ensemble service includes a plurality of conversion utilities, each conversion utility configured to convert a specific one of a plurality of disparate climate reanalysis datasets from different sources to common format files that are temporally and spatially registered, a data analytics platform for storing and operating on the different sourced common format files, a service interface for mapping service requests to analytic operations performed on the different sourced common format files by the data analytics platform, and a services library that dynamically creates data objects from one or more of the different sourced common format files in response to the analytic operations, and delivers the data objects to the service interface.
    Type: Grant
    Filed: December 30, 2019
    Date of Patent: August 8, 2023
    Assignee: United States of America as represented by the Administrator of NASA
    Inventors: John L. Schnase, Daniel Q. Duffy, Glenn S. Tamkin, Jian Li, Savannah L. Strong, Roger Gill
  • Patent number: 11719770
    Abstract: A sensor die may include a set of sensing elements and a test structure associated with determining a magnetic sensitivity of the set of sensing elements. The test structure includes a first test sensing element sensitive in a direction in a plane defined by a surface of the sensor die, a second test sensing element sensitive in the direction in the plane defined by the surface of the sensor die, and a wire on chip (WoC) associated with applying a magnetic field to the first test sensing element and the second test sensing element. The first test sensing element, the second test sensing element, and the WoC may be arranged such that, when current flows through the WoC, the first test sensing element senses a component of the magnetic field in the direction, and the second test sensing element senses a component of the magnetic field in a perpendicular direction.
    Type: Grant
    Filed: October 2, 2019
    Date of Patent: August 8, 2023
    Assignee: Infineon Technologies AG
    Inventors: Christoph Schroers, Manfred Steiner, Armin Winkler
  • Patent number: 11710543
    Abstract: A system, device, and method for predicting an active set of compounds that bind to a biomolecular target is disclosed. The system and device contain modules allowing for the prediction of an active set of compounds. A core identification module can identify the core of an initial lead compound. A core hopping module is used to identify potential lead compounds having different cores compared to the core of an initial lead compound. A scoring module can use computational techniques to calculate the relative binding free energy of each identified potential lead compound. An activity prediction module can use the relative binding free energy calculations to predict an active set of compounds that bind to the biomolecular target. Empirical analysis can be used to inform the accuracy and completeness of the predicted active set of compounds.
    Type: Grant
    Filed: October 18, 2018
    Date of Patent: July 25, 2023
    Assignee: Schrödinger, Inc.
    Inventors: Robert L. Abel, Lingle Wang, Sathesh Bhat, Sayan Mondal, Jeremy Robert Greenwood, Kyle Konze
  • Patent number: 11709188
    Abstract: An energy monitoring device includes a power supply circuit electrically coupled to a power source via a hot conductor and a load via a load conductor; a relay circuit including a relay and a relay driver circuit, where the relay includes a plurality of coils and the relay contact electrically coupled to the hot conductor and the load conductor; a sensing circuit including a hot voltage sensor and a load voltage sensor; and a controller electrically coupled to the power supply circuit, the relay driver circuit, and the sensing circuit, and structured to receive a hot voltage from the hot voltage sensor and a load voltage from the load voltage sensor, and determine a load current based at least in part on a relay contact resistance of the relay contact and a delta between the hot voltage and the load voltage.
    Type: Grant
    Filed: July 29, 2021
    Date of Patent: July 25, 2023
    Assignee: EATON INTELLIGENT POWER LIMITED
    Inventors: Saivaraprasad Murahari, Nilesh Ankush Kadam
  • Patent number: 11703524
    Abstract: The present invention provides a probing system, which utilizes a suction nozzle to suck a wafer in probing. A relative distance between the suction nozzle and the probes can be adjusted according the conditions of the probing system, so the system extends the usage life.
    Type: Grant
    Filed: November 1, 2021
    Date of Patent: July 18, 2023
    Assignee: HERMES TESTING SOLUTIONS INC.
    Inventors: Wen-Yuan Hsu, Chi-Ming Yang, Sih-Ying Chang, Tsung-Po Lee, Kee-Leong Yu
  • Patent number: 11698630
    Abstract: An abnormality analysis device including: an overall information obtainer that obtains overall information indicating an overall feature amount of a manufacturing system; an overall abnormal degree calculator that calculates an overall abnormal degree that is an abnormal degree of a whole of the manufacturing system by statistically processing the overall information; an individual information obtainer that obtains individual information indicating a feature amount of each of the plurality of constituent elements; an individual abnormal degree calculator that calculates an individual abnormal degree that is an abnormal degree of each of the plurality of constituent elements by statistically processing the individual information; and a determiner that determines whether or not the overall abnormal degree exceeds a threshold value, wherein the individual abnormal degree calculator calculates the individual abnormal degree when the determiner determines that the overall abnormal degree exceeds the threshold valu
    Type: Grant
    Filed: June 7, 2019
    Date of Patent: July 11, 2023
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Hiroshi Amano, Narumi Atsuta, Noriaki Hamada, Yosuke Tajika, Nobutaka Kawaguchi, Yuichi Higuchi, Taichi Shimizu
  • Patent number: 11698404
    Abstract: A universal switching platform is configured to test a device under test, and includes a first power source, a first switch, a second switch and a second power source. The first switch, the second switch and the second power source are coupled in series between positive and negative terminals of the first power source. The common node of the first and second switches and the negative terminal of the first power source are configured to be respectively coupled to first and second terminals of the device under test. The universal switching platform provides a voltage and a current to test the device under test when the first and second switches are controlled to transition between conduction and non-conduction.
    Type: Grant
    Filed: October 8, 2021
    Date of Patent: July 11, 2023
    Assignee: Device Dynamics Lab Co., Ltd.
    Inventor: Ming-Cheng Lin
  • Patent number: 11693044
    Abstract: A body diode is energized by inputting a BD energization pulse signal having a predetermined cycle. At the start of energization of the body diode and immediately before termination thereof, an ON signal of a Von measurement pulse signal is input to a high-temperature semiconductor chip at a timing different from that of an ON signal of the BD energization pulse signal, thereby passing a drain-source current through a MOSFET, and a drain-source voltage is measured. Thereafter, energization of the body diode is terminated. At room temperature before and after the energization of the body diode, the drain-source voltage is measured by inputting the ON signal of the Von measurement pulse signal. A semiconductor chip for which a fluctuation amount of the drain-source voltage at a high temperature and a fluctuation amount of the drain-source voltage at room temperature are within predetermined ranges is determined to be a conforming product.
    Type: Grant
    Filed: November 30, 2021
    Date of Patent: July 4, 2023
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Makoto Utsumi, Masaki Miyazato